An intermediate partition plate positioning apparatus and battery module assembling equipment are provided. The intermediate partition plate positioning apparatus includes: a supporting mechanism; a first adjusting mechanism, connected to the supporting mechanism, and configured to drive the supporting mechanism to move along a vertical direction; and a second adjusting mechanism. The second adjusting mechanism is located on at least one side of the supporting mechanism along a first horizontal direction. The second adjusting mechanism includes a clamping portion and a driving portion. The clamping portion is connected to the supporting mechanism. The driving portion is able to drive the clamping portion to move so that the clamping portion clamps the intermediate partition plate from two sides of the intermediate partition plate along a second horizontal direction. The first horizontal direction intersects the second horizontal direction.

Described herein is a technique capable of improving a film uniformity on a surface of a substrate and a film uniformity among a plurality of substrates including the substrate. According to one aspect thereof, there is provided a substrate processing apparatus including: a substrate retainer including: a product wafer support region, an upper dummy wafer support region and a lower dummy wafer support region; a process chamber in which the substrate retainer is accommodated; a first, a second and a third gas supplier; and an exhaust system. Each of the first gas and the third gas supplier includes a vertically extending nozzle with holes, wherein an upper of an uppermost hole and a lower end of a lowermost hole are arranged corresponding to an uppermost and a lowermost dummy wafer, respectively. The second gas supplier includes a nozzle with holes or a slit.

An apparatus for supporting at least one component includes a supporting device having a first and at least one second support element, which are mounted movably relative to each other, and a shape-defining device with a surface contour which fits, at least in some regions, a contour of a supporting section of the component. The supporting device can be placed against the shape-defining device, and, by contact of the at least two support elements with the surface contour of the shape-defining device, the first support element can be moved into a defined position relative to the at least second support element, in which position the at least two support elements reproduce the contour of the supporting section, at least in some regions.

An apparatus for supporting at least one component includes a supporting device having a first and at least one second support element, which are mounted movably relative to each other, and a shape-defining device with a surface contour which fits, at least in some regions, a contour of a supporting section of the component. The supporting device can be placed against the shape-defining device, and, by contact of the at least two support elements with the surface contour of the shape-defining device, the first support element can be moved into a defined position relative to the at least second support element, in which position the at least two support elements reproduce the contour of the supporting section, at least in some regions.

In one embodiment, a calibration apparatus includes a jig body, a camera, an elongated strip which is deflectable and resilient, a lower groove which is disposed in the jig body, and is configured to receive and grasp the camera therein, an upper groove, which is disposed in the jig body above the lower groove, and is configured to receive and grasp the elongated strip therein so as to position the elongated strip above, and in a fixed relation to, the camera, the upper groove being wider than the lower groove, and an alignment element, which is disposed in the jig body, and is configured to align an end of the camera with an end of the elongated strip.

A vacuum cup assembly and a method of lifting an object are provided. The vacuum cup assembly includes a cup structure defining an opening at a proximal end, a recess at a distal end, and a cavity region between the proximal and distal ends, where the cavity region includes at least one cavity. The opening is in fluid communication with the recess and with the cavity region. Inner structures are disposed in the cavity region. The inner structures are configured to hold the cup structure in a gripping position when a negative pressure is applied to the cavity region through the opening in the cup structure. The cup structure is configured to be in a resting position without the negative pressure being applied to the cavity region. The vacuum cup assembly has a first shape in the resting position and a second shape in the gripping position.

Embodiments described herein relate to a substrate chucking apparatus having a plurality of cavities formed therein. The cavities are formed in a body of the chucking apparatus and a plurality of support elements extend from the body and separate each of the plurality of cavities. In one embodiment, a first plurality of ports are formed in a top surface of the body and extend to a bottom surface of the body through one or more of the plurality of support elements. In another embodiment, a second plurality of ports are formed in a bottom surface of the plurality of cavities and extend through the body to a bottom surface of the body. In yet another embodiment, a first electrode assembly is disposed adjacent the top surface of the body within each of the plurality of support elements and a second electrode assembly is disposed within the body adjacent each of the plurality of cavities.

A system that may include a apertured structure that is configured to support a substrate and a vacuum supply unit that is configured to (i) prevent a supply of vacuum to a first area of the substrate during a first processing period during which the first area is processed and a second area of the substrate is not processed; (ii) provide vacuum to the second area during the first processing period; (iii) prevent the supply of vacuum to the second area during a second processing period during which the second area is processed and the first area is not processed; and (iv) provide vacuum to the first area during the second processing period.

An apparatus and method for uniformly holding a substrate without flexure or bending of the substrate, thereby enabling accurate shape measurements of the substrate such as wafer curvature, z-height values and other surface characteristics. Techniques include using a liquid as a supporting surface for a substrate thereby providing uniform support. Liquid used has a same specific gravity of a substrate being supported so that the substrate can float on the liquid without sinking. Uniform support of the substrate enables precision metrology.

A method for supporting a heated glass sheet in connection with a glass processing operation may include adjusting a support structure so that multiple spaced apart support members of the support structure cooperate to define a shape that corresponds to a desired end shape of the glass sheet. The method may further include contacting the glass sheet with the support members until the glass sheet has been sufficiently cooled. Furthermore, the support structure may include a frame and a support assembly associated with the frame, the support assembly including the support members and a support connected to the support members such that at least a portion of each support member is adjustable with respect to the support. The support may further be connected to the frame at two locations on the frame such that the support spans an open area between the two locations on the frame.