A sputtering target includes an indium cerium zinc oxide represented by In.sub.2Ce.sub.xZnO.sub.4+2x, wherein x=0.52. A method for making a sputtering target includes steps of: mixing indium oxide (In.sub.2O.sub.3) powder, cerium oxide (CeO.sub.2) powder, and zinc oxide (ZnO) powder to form a mixture, a molar ratio of indium (In), cerium (Ce), and zinc (Zn) as In:Ce:Zn in the mixture is 2:(0.5 to 2):1; and sintering the mixture at a temperature in a range from about 1250 C. to about 1650 C.

The appearance of natural rock faces are formed on planar panels or part portions disposed horizontally by stamping or texturizing a cementatious mixture of veneer material and then selectively applying colorant matter, which may include combinations of stains and mineral.

A method of manufacturing a component (100) having a main part (101) and a projecting feature (104,114), the method comprising providing a shaped void (210) corresponding to the component, locating a pre-formed element (214) in a feature region of the shaped void which corresponds to the projecting feature, locating powder (212) within the shaped void; and forming the element and the powder into the component such that the element creates at least a part of the projecting feature.

A mold and a method of manufacturing GOS ceramic scintillator by using the mold are provided. The mold comprises: a female outer sleeve having a cavity disposed inside; a plurality of female blocks disposed inside the cavity, the plurality of female blocks being put together to form a composite structure having a vertical through hole; and a male upper pressing head and a male lower pressing head, wherein each of the male upper pressing head and the male lower pressing head has a shape consistent with that of the vertical through hole. The disclosure may reduce defects of the related art in hot-pressing-sintering such as a mold has a short retirement period and a high material waste, significantly reduce the cost for production of the GOS ceramic scintillator, and significantly improve a process economy.

A heater tube for molten metal immersion 1 has a cylindrical heater housing part 4 equipped with a closed end 2 and an open end 3, wherein the heater housing part 4 comprises silicon nitride, a compound comprising yttrium, and a compound comprising magnesium. The heater housing part 4 has a surface roughness Ra of an outer circumferential surface of the heater housing part 4 is between 0.5 m and 10 m, inclusive.

There is provided an oxide sintered body including indium, tungsten and zinc, wherein the oxide sintered body includes a bixbite type crystal phase as a main component and has an apparent density of higher than 6.5 g/cm.sup.3 and equal to or lower than 7.1 g/cm.sup.3, a content rate of tungsten to a total of indium, tungsten and zinc is higher than 1.2 atomic % and lower than 30 atomic %, and a content rate of zinc to the total of indium, tungsten and zinc is higher than 1.2 atomic % and lower than 30 atomic %. There are also provided a sputtering target including this oxide sintered body, and a semiconductor device including an oxide semiconductor film formed by a sputtering method by using the sputtering target.

A tool holder with a main part, a deformable receiving portion for clamping a tool, and at least one blocking element which is designed to engage into a corresponding counter element on the tool in order to prevent the tool from moving axially out of the tool holder. The at least one blocking element is integrally formed with the receiving portion. A clamping system having such a tool holder and a method for producing a receiving portion for such a tool holder are also described.

A tool holder with a main part, a deformable receiving portion for clamping a tool, and at least one blocking element which is designed to engage into a corresponding counter element on the tool in order to prevent the tool from moving axially out of the tool holder. The at least one blocking element is integrally formed with the receiving portion. A clamping system having such a tool holder and a method for producing a receiving portion for such a tool holder are also described.

A molding composite includes mica flakes and a eutectic glaze. The composite allows making of lead-free parts for use in a variety of situations, such as electrical insulators for supporting electrically-conductive parts, such as electrodes, for electrical devices. The molded composite material can be used mold around such electrically-conductive parts, supporting them and/or providing hermetic seals around the parts. Other possible uses include substrates for electronic circuits, and housings for parts, such as electro-optical parts. The molding composite is heated under elevated pressure to liquefy the eutectic glaze, causing it to coat the mica flakes. After the composite is put into a desired shape it is solidify, for example by compressing the molding composite at a constant temperature until the eutectic glaze solidifies, followed by cooling of the molding composite.

A molding composite includes mica flakes and a eutectic glaze. The composite allows making of lead-free parts for use in a variety of situations, such as electrical insulators for supporting electrically-conductive parts, such as electrodes, for electrical devices. The molded composite material can be used mold around such electrically-conductive parts, supporting them and/or providing hermetic seals around the parts. Other possible uses include substrates for electronic circuits, and housings for parts, such as electro-optical parts. The molding composite is heated under elevated pressure to liquefy the eutectic glaze, causing it to coat the mica flakes. After the composite is put into a desired shape it is solidify, for example by compressing the molding composite at a constant temperature until the eutectic glaze solidifies, followed by cooling of the molding composite.