A support device for improving the haptics and/or gripping impression of humanoid or android type hands includes an active surface that interacts with parts (16, 18, 22) of the respective hand to carry out a movement and that has individual stem-like projections. Each projection has a free end face such that the projections at least partially improve the adhesion of at least parts of the hand or a hand protector (10) to surfaces, particularly smooth or delicate surfaces, that are touched. The respective free end faces (26) of the projections (24) are designed such that their adhesion results from acting van der Waals forces between the free end faces (26) and the touched surface.

Methods for fabricating composite tools and composite tools are provided. In an exemplary embodiment, a method for fabricating a composite tool includes providing a master mold and forming a low temperature cured resin laminate overlying the master mold. The low temperature cured resin laminate is heated and compressed to form a cured low temperature cured resin laminate, the low temperature cured resin laminate heated to a first temperature. The cured low temperature cured resin laminate is removed from the master mold and a high temperature cured resin laminate is formed overlying the cured low temperature cured resin laminate. The high temperature cured resin laminate is heated and compressed to form a cured high temperature cured resin laminate. The high temperature cured resin laminate is heated to a second temperature, wherein the second temperature is higher than the first temperature.

Methods for fabricating composite tools and composite tools are provided. In an exemplary embodiment, a method for fabricating a composite tool includes providing a master mold and forming a low temperature cured resin laminate overlying the master mold. The low temperature cured resin laminate is heated and compressed to form a cured low temperature cured resin laminate, the low temperature cured resin laminate heated to a first temperature. The cured low temperature cured resin laminate is removed from the master mold and a high temperature cured resin laminate is formed overlying the cured low temperature cured resin laminate. The high temperature cured resin laminate is heated and compressed to form a cured high temperature cured resin laminate. The high temperature cured resin laminate is heated to a second temperature, wherein the second temperature is higher than the first temperature.

Disclosed herein is an electronic circuit package includes a substrate, an electronic component mounted on a surface of the substrate, and a magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component. The magnetic mold resin includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the magnetic mold resin is 15 ppm/° C. or less.

A mold tool assembly includes a first tool having a protrusion for producing a respective hole in a foam body and a second tool configured to cooperate with the first tool to mold the foam body. The second tool defines a cavity corresponding to the protrusion. The mold tool assembly also includes a movable plunger for clearing flash corresponding to and located at least partially within the cavity in the second tool, and movable between a disengaged position when the first and second tools are separated, and an engaged position when the first and second tools are closed. The mold tool assembly also includes an actuator configured to move the movable plunger between the engaged position and the disengaged position. In the engaged position, the movable plunger contacts the protrusion to seal the cavity, and in the disengaged position, at least a portion of the movable plunger extends below a bottom surface of the second tool into the hole.

A process for fabricating an optical device includes injecting (301) optical silicone into a mold cavity formed by two or more mutually matching mold-elements, curing (302) the optical silicone contained by the mold cavity, and separating (303) the mold-elements from the optical device constituted by the optical silicone. The reversible elasticity of the optical silicone after the curing phase is utilized in the process so that at least one of the mold-elements has counterdraft which causes a reversible deformation in the optical device when the mold-element is separated from the optical device. As the counterdraft is allowable, the shape of the optical device as well as the dividing joints between the mold-elements can be designed more freely. For example, walls of the mold cavity corresponding to optically active surfaces of the optical device can be arranged to be free from dividing joints between the mold-elements.

A transdermal administration device including an administering part including a substrate having a first surface, and at least one projection protruding from the first surface. The projection has a shape which extends along the first surface and includes one linear top edge which is located away from the first surface and has a first end and a second end, two primary lateral faces which share the one linear top edge and have lateral edges each individually connecting the first surface with the first end, and a secondary lateral face which has the lateral edges in common with the respective two primary lateral faces and forms one corner together with the two primary lateral faces. One of the lateral edge and the top edge on the primary lateral face form an obtuse angle, and the two lateral edges on the secondary lateral face form an acute angle.

A process for providing an overmolded waterway comprising inserting a shaft portion of a sacrificial core into an end of a tube, the shaft portion having a first opening therein, the sacrificial core having a second portion comprising a second opening and a contact surface about the second opening, the second opening in fluid communication with the first opening and the inside of the tube, in a mold cavity inserting a core pin transverse to the tube end, the sacrificial core contact surface engaging a mating surface of the core pin closing the second opening, injection overmolding over a portion of the tube end and core pin forming an overmolded waterway having an outlet portion in fluid communication with the second opening and the inside of the tube, and removing the core pin from the second opening through the outlet portion and removing the overmolded waterway from the mold cavity.

A manufacturing method of a liquid ejection head, which includes a step of preparing a substrate including a first layer, a step of forming a flow path mold for forming the flow path and a member located outside the mold with a gap between the mold and the member from the first layer, a step of providing a second layer so that the second layer fills the gap and covers the mold and the member located outside the mold with the gap between them, a step of forming an ejection orifice forming member for forming an ejection orifice from the second layer, a step of removing the member located outside the mold with the gap between them, and a step of forming a wall member located outside the ejection orifice forming member with at least a partial gap between the ejection orifice forming member and the wall member.

In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.