Systems and techniques to provide a flexible, lightweight material that is also effective at protecting a body from ballistic threats are described. An example composite material described herein is fiber-based, and it includes one or more first regions where the fiber composite material is consolidated, and one or more second regions where the fiber composite material is unconsolidated. Example methods of manufacturing the composite material disclosed herein include using a specialized tool with a heated platen press or an autoclave. The tool may include one or more protrusions and/or cavities that contact a precursor composite material to transform the precursor material into a partially consolidated fiber composite material, which is suitable for use as body armor, among other potential applications for the manufactured composite material.

A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

A composite oil pan for a work vehicle engine and a method of forming the composite engine oil pan include forming a sheet of metal into a first pan and open molding a fiber-reinforced polymer resin onto the first pan forming a second pan. The first pan has a first bottom wall and first peripheral walls extending from edges of the first bottom wall to define a sump, the first peripheral walls terminating in a first peripheral flange. The second pan has a second bottom wall and second peripheral walls abutting the first bottom wall and the first peripheral walls, the second peripheral walls terminating in a second peripheral flange. The first pan defines a thin metal structure with an inner surface extending across the first bottom wall, first peripheral walls and first peripheral flange; the second pan reinforces the first pan without abutting the inner surface.

A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

A method of upcycling fiber reinforced polymer source material by disassembling the source material into sections; planking the sections into longitudinal pieces; separating core material from the source material in the longitudinal pieces to make composite strips; preparing the composite strips; and remanufacturing the prepared composite strips into an article.

The invention relates to a method for producing a component (9) by means of stereolithography, having the steps of: A) generating a component (9) in accordance with a virtual 3D model of the component (9) by curing a liquid plastic (7) using stereolithography, and B) cleaning the component (9) through at least one rotational movement of the component (9) about an axis of rotation or about multiple axes of rotation, wherein residues of the liquid plastic (7) are removed from the surface of the component (9) by a centrifugal force resulting from the rotational movement. The invention also relates to a 3D printing system for implementing such a method.

The present invention relates to a method and device for manufacturing artificial marble. According to the present invention, artificial marble having a stripe pattern similar to that of natural stone, such as striato, may be provided.

The present disclosure is drawn to multi-fluid kits for three-dimensional to printing, three-dimensional printing kits, and methods of making three-dimensional printed articles. In one example, a multi-fluid kit for three-dimensional printing can include a fusing agent, a first reactive agent, and a second reactive agent. The fusing agent can include water and a radiation absorber. The first reactive agent can include a first liquid vehicle and an epoxy compound having multiple epoxide groups. The second reactive agent can include a second liquid vehicle and an amine compound having multiple amino groups.

A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression molding material having a thixotropic index (TI) of 0.8 to 4.0.

A method for bonding composite substrates includes coupling a first co-cure prepreg layer having a first off-set amine to epoxide molar ratio onto a surface of a first composite substrate and coupling a second co-cure prepreg layer having a second off-set amine to epoxide molar ratio onto a surface of a second composite substrate. The first and second composite substrates are cured to the first and second co-cure prepreg layers, respectively, using a first cure cycle (including B-stage and cure temperatures) to form a first and a second co-cure prepreg layer portion. The method further includes coupling the first co-cure prepreg layer portion to the second co-cure prepreg layer portion and applying a second cure cycle to cure the first co-cure prepreg layer portion of the first composite substrate to the second co-cure prepreg layer portion of the second composite substrate to form a monolithic covalently bonded composite structure.