Patent classifications
B29K2063/00
ULTRASONIC WELDING OF DISSIMILAR SHEET MATERIALS
A ultrasonic welding method of joining dissimilar-material workpieces, such as sheet materials, and the joined components formed thereby. The method includes applying ultrasonic energy to a thermoplastic piece to fill a hole of a dissimilar piece to form a weld point that is made up with polymer from the thermoplastic piece. In general, the geometry of the thermoplastic piece is not altered during the process. The dissimilar piece generally has a higher melting temperate and can be metal, thermoset polymers, or other thermoplastic material. The welded pieces can be arranged in a lap, laminate, or double lap configuration. In some embodiments, the hole of the dissimilar sheet material includes undercut features that improve the mechanical interlock between the dissimilar pieces. In some embodiments, the weld point has a mushroom cap to improve mechanical interlock.
Method and apparatus for supporting blades
A method of supporting a cantilevered component mounted to a hub by locating a cassette in proximity to the cantilevered component, the cassette defining a volume for filling with an encapsulant; filling the volume with an encapsulant material; and causing the encapsulant to solidify to the cantilevered component to support the cantilevered component. The cantilevered component is preferably a blade on a bladed disc and the encapsulant provides support to change the vibration response of the blade during a subsequent machining step.
RESISTANCE WELDING METHODS AND APPARATUS
Disclosed is a method of resistance welding between composite articles. A conductive element is provided between faying surfaces, having a plurality of lower resistivity electrode portions spaced apart along the length of the contact area between the composite articles. The electrode portions can be used to spot weld across the electrode portions, and along a longitudinal portion of the conductive element between the electrode portions by application of an electrical current. Also disclosed are apparatus for use in the resistance welding methods and composite articles and structures and elements incorporating the conductive element.
RESISTANCE WELDING METHODS AND APPARATUS
Disclosed is a method of resistance welding between composite articles. A conductive element is provided between faying surfaces, having a plurality of lower resistivity electrode portions spaced apart along the length of the contact area between the composite articles. The electrode portions can be used to spot weld across the electrode portions, and along a longitudinal portion of the conductive element between the electrode portions by application of an electrical current. Also disclosed are apparatus for use in the resistance welding methods and composite articles and structures and elements incorporating the conductive element.
Image pickup module and the manufacturing method thereof
An image pickup module includes a cover, a plurality of image pickup units, a self-curing gel, and a photopolymer gel. The cover includes an upper shield, a side shield, and illumination openings and image pickup openings on the upper shield, and the upper shield and the side shield surround an accommodation space where the image pickup units are disposed. The cover at least covers a portion of upper surfaces of the image pickup units. The photopolymer gel is disposed on positions corresponding to the illumination openings that expose the photopolymer gel. The self-curing gel is disposed between the upper surfaces of the image pickup units and the upper shield. The photopolymer gel is configured to fix relative positions between the image pickup units and the cover. A manufacturing method of an image pickup module is also provided.
FRICTION STIR SPOT WELDING METHOD AND WELDED ASSEMBLY UTILIZING SAME
A first member formed of a thermoplastic resin molding mixed with a fiber material and a second member formed of a molding containing at least a thermoplastic resin are welded by friction stir spot welding using a double-acting tool for friction stir spot welding. An overlapping part between the first member and the second member is formed, and the tool is disposed against the overlapping part while the pin and the shoulder are rotated about the rotation axis. The pin is plunged into the overlapping part, and friction stir is performed to cause extension fibers to remain around a plunging region of the pin while the shoulder is retracted to release an overflow material. The shoulder is brought closer to the overlapping part to wrap the extension fibers into the overflow material when the overflow material is backfilled while the pin is retracted from the overlapping part.
FRICTION STIR SPOT WELDING METHOD AND WELDED ASSEMBLY UTILIZING SAME
A first member formed of a thermoplastic resin molding mixed with a fiber material and a second member formed of a molding containing at least a thermoplastic resin are welded by friction stir spot welding using a double-acting tool for friction stir spot welding. An overlapping part between the first member and the second member is formed, and the tool is disposed against the overlapping part while the pin and the shoulder are rotated about the rotation axis. The pin is plunged into the overlapping part, and friction stir is performed to cause extension fibers to remain around a plunging region of the pin while the shoulder is retracted to release an overflow material. The shoulder is brought closer to the overlapping part to wrap the extension fibers into the overflow material when the overflow material is backfilled while the pin is retracted from the overlapping part.
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove.
Z-PIN FOR INCREASING DELAMINATION RESISTANCE
A Z-pin for increasing a delamination resistance of continuous fibre-reinforced polymer composites, formed of a composite material including a polymer matrix, and a plurality of fibres embedded in the polymer matrix and aligned along the length direction of Z-pin, the fibres having an elongation at break of at least 2% and a tensile strength of at least 5 GPa, the polymer matrix having an elongation at break equal to or greater than the elongation at break of the fibres, and a tensile strength of at least 120 MPa.
Z-PIN FOR INCREASING DELAMINATION RESISTANCE
A Z-pin for increasing a delamination resistance of continuous fibre-reinforced polymer composites, formed of a composite material including a polymer matrix, and a plurality of fibres embedded in the polymer matrix and aligned along the length direction of Z-pin, the fibres having an elongation at break of at least 2% and a tensile strength of at least 5 GPa, the polymer matrix having an elongation at break equal to or greater than the elongation at break of the fibres, and a tensile strength of at least 120 MPa.