B32B17/00

Flexible display apparatus

A flexible display apparatus includes a first functional layer, a second functional layer above the first functional layer, a third functional layer above the second functional layer, a first adhesive layer between the first functional layer and the second functional layer, and having a first recovery rate, and a second adhesive layer between the second functional layer and the third functional layer, and having a second recovery rate that is lower than the first recovery rate.

Flexible display apparatus

A flexible display apparatus includes a first functional layer, a second functional layer above the first functional layer, a third functional layer above the second functional layer, a first adhesive layer between the first functional layer and the second functional layer, and having a first recovery rate, and a second adhesive layer between the second functional layer and the third functional layer, and having a second recovery rate that is lower than the first recovery rate.

Ceramic-containing and ceramic composite transaction cards
11521035 · 2022-12-06 · ·

A process for making a card includes the steps of forming a core layer having a first surface and a second surface, disposing an uncured decorative ceramic layer of ceramic particles disposed in a resin binder over the first surface of the core layer, such as by spray coating, and curing the uncured decorative ceramic layer to form a cured decorative ceramic layer. Card products of the process may have a core layer of metal, ceramic, or a combination thereof that form a bulk of the card.

Ceramic-containing and ceramic composite transaction cards
11521035 · 2022-12-06 · ·

A process for making a card includes the steps of forming a core layer having a first surface and a second surface, disposing an uncured decorative ceramic layer of ceramic particles disposed in a resin binder over the first surface of the core layer, such as by spray coating, and curing the uncured decorative ceramic layer to form a cured decorative ceramic layer. Card products of the process may have a core layer of metal, ceramic, or a combination thereof that form a bulk of the card.

CURABLE COMPOSITIONS

The present invention is directed to a curable composition including: an isocyanate-functional prepolymer; an epoxy-containing component present in an amount of at least 10 percent by weight of the composition; and a latent curing agent having an ability to react with at least one of the isocyanate-functional prepolymer and the epoxy-containing component upon exposure to an external energy source. The present invention is also directed to methods of making the compositions, methods of coating a substrate, methods of adhering substrates and coated substrates.

SYNTHETIC BARRIER MATERIAL AND METHOD OF MANUFACTURE THEREOF

A synthetic barrier material includes a light-cured polymer and graphene nanoplatelets in parallel alignment in the polymer. Disclosed further is a method for manufacturing the synthetic barrier material. The graphene nanoplatelets are dispersed in a photocurable resin and polarically aligned by an electric field. Furthermore, disclosed is a synthetic barrier film manufactured from the aforementioned synthetic barrier material or the aforementioned method.

Carrier substrate, laminate, and method for manufacturing electronic device

A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

Carrier substrate, laminate, and method for manufacturing electronic device

A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

Laminated film for bonding and light-transmitting laminate including same
11571882 · 2023-02-07 · ·

The laminated film for bonding comprises: a first layer; a second layer disposed opposite to the first layer; and a third layer interposed between the first layer and the second layer, wherein the laminated film comprises a first end having a first thickness and a second end having a second thickness different from the first thickness, and a measuring area disposed between the first end and the second end and having a center thickness, wherein the center thickness is less than or equal to a middle value of the first thickness and the second thickness, wherein a penetration coefficient (F.sub.pe) at the measuring area is 1.35 kgf/mm.sup.2*mm or more, and wherein, a ratio of a sum of a thickness of the first layer and a thickness of the second layer to a thickness of the third layer is 100:12 to 24.

LOW TEMPERATURE CO-FIRED SUBSTRATE COMPOSITION
20230096796 · 2023-03-30 ·

It is demanded that a LTCC substrate composition capable of maintaining low relative permittivity k and high Q value without having a reactivity with a silver which is an electrode material and causing migration of the silver during a co-firing operation at a low temperature. Provided with a low temperature co-fired substrate composition containing 83 to 91 wt. % of CaO-B.sub.2O.sub.3-SiO.sub.2 based glass powder, 7.5 to 14 wt. % of two or more kinds of nanometer-sized SiO.sub.2 powders having different ranges of particle diameter and 1.5 to 3 wt. % of β-wollastonite powder as a crystallization agent wherein the glass powder contains 40.0 to 45.0 wt. % of CaO, 9.0 to 20.0 wt. % of B.sub.2O.sub.3 and 40.0 to 46.0 wt. % of SiO.sub.2.