Provided are a coated member in which damage of a coating film can be suppressed in a high temperature environment and the coating may be performed at low cost, and a method of manufacturing the same. A coated member includes a bond coat and a top coat sequentially laminated on a substrate made of a Si-based ceramic or a SiC fiber-reinforced SiC matrix composite, wherein the top coat includes a layer composed of a mixed phase of a (Y.sub.1-aLn.sub.1a).sub.2Si.sub.2O.sub.7 solid solution (here, Ln.sub.1 is any one of Nd, Sm, Eu, and Gd) and Y.sub.2SiO.sub.5 or a (Y.sub.1-bLn.sub.1′.sub.b).sub.2SiO.sub.5 solid solution (here, Ln.sub.1′ is any one of Nd, Sm, Eu, and Gd), or a mixed phase of a (Y.sub.1-cLn.sub.2c).sub.2Si.sub.2O.sub.7 solid solution (here, Ln.sub.2 is any one of Sc, Yb, and Lu) and Y.sub.2SiO.sub.5 or a (Y.sub.1-dLn.sub.2′.sub.d).sub.2SiO.sub.5 solid solution (here, Ln.sub.2′ is any one of Sc, Yb, and Lu).

Provided are a coated member in which damage of a coating film can be suppressed in a high temperature environment and the coating may be performed at low cost, and a method of manufacturing the same. A coated member includes a bond coat and a top coat sequentially laminated on a substrate made of a Si-based ceramic or a SiC fiber-reinforced SiC matrix composite, wherein the top coat includes a layer composed of a mixed phase of a (Y.sub.1-aLn.sub.1a).sub.2Si.sub.2O.sub.7 solid solution (here, Ln.sub.1 is any one of Nd, Sm, Eu, and Gd) and Y.sub.2SiO.sub.5 or a (Y.sub.1-bLn.sub.1′.sub.b).sub.2SiO.sub.5 solid solution (here, Ln.sub.1′ is any one of Nd, Sm, Eu, and Gd), or a mixed phase of a (Y.sub.1-cLn.sub.2c).sub.2Si.sub.2O.sub.7 solid solution (here, Ln.sub.2 is any one of Sc, Yb, and Lu) and Y.sub.2SiO.sub.5 or a (Y.sub.1-dLn.sub.2′.sub.d).sub.2SiO.sub.5 solid solution (here, Ln.sub.2′ is any one of Sc, Yb, and Lu).

A method for manufacturing a sintered body, the method including heating a mixture that contains a plurality of particles of a metal oxide having a spinel-type structure, and a metal acetylacetonate under pressure at a temperature of from a melting point or higher of the metal acetylacetonate to 600° C. or lower, to form a sintered body that contains the metal oxide having the spinel-type structure.

A method for manufacturing a sintered body, the method including heating a mixture that contains a plurality of particles of a metal oxide having a spinel-type structure, and a metal acetylacetonate under pressure at a temperature of from a melting point or higher of the metal acetylacetonate to 600° C. or lower, to form a sintered body that contains the metal oxide having the spinel-type structure.

A material can have a layered structure with at least a first layer, including a carbon-based material or a substrate of a material other than a carbon-based material, a second layer, including a carbon-based material, and a third, intermediate layer that separates and interconnects the first and second layers. The carbon-based material includes at least 50 at. % carbon, has a hexagonal lattice and the layer or layers including the carbon-based material has/have a thickness of 1-20 times the size of a carbon atom. The intermediate layer is a layer that includes a salt having ions that include at least two separate cyclic, planar groups that are capable of forming π-π-stacking with the material of the second layer and that the third, intermediate layer is connected to at least the second layer by π-π-stacking caused by said cyclic planar groups of the salt ions.

Set forth herein are processes and materials for making ceramic thin green tapes by casting ceramic source powders and precursor reactants, binders, and functional additives into unsintered thin green tapes in a non-reactive environment.

A ceramic electronic device includes a multilayer structure in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately stacked. Each of the plurality of dielectric layers includes ceramic grains of a main component thereof expressed by (Ba.sub.1−x−yCa.sub.xSr.sub.y)(Ti.sub.1−zZr.sub.z)O.sub.3 (0<x≤0.2, 0≤y≤0.1, 0≤z≤0.1). D3<D1<D2 is satisfied when an average grain diameter of the ceramic grains of the main component of the plurality of dielectric layers in a section in which each two internal electrode layers is D1, an average grain diameter of the ceramic grains of the main component of first dielectric layers which are located at different height positions from the internal electrode layers is D2, an average grain diameter of the ceramic grains of the main component of second dielectric layers which are located at same height positions of the internal electrode layers is D3.

Panel suitable for assembling a floor covering by interconnecting a plurality of said panels with each other, wherein the panel has a substantially planar top side, and a substantially planar bottom side, at least four substantially linear side edges comprising at least one pair of opposite side edges, the panel having a layered structure which comprises a decorative top layer and a core layer wherein the decorative top layer and the core layer have a different chemical composition, wherein a reinforcement layer is positioned between the top layer and the core layer, and having a modulus of elasticity of at least 2 Mpa.

Panel suitable for assembling a floor covering by interconnecting a plurality of said panels with each other, wherein the panel has a substantially planar top side, and a substantially planar bottom side, at least four substantially linear side edges comprising at least one pair of opposite side edges, the panel having a layered structure which comprises a decorative top layer and a core layer wherein the decorative top layer and the core layer have a different chemical composition, wherein a reinforcement layer is positioned between the top layer and the core layer, and having a modulus of elasticity of at least 2 Mpa.

A method for forming a ceramic-based material comprises depositing a ceramic-precursor composition comprising nanoparticles having at least one dimension less than 100 nm and an aspect ratio of 1.5 or greater, and a carrier fluid on a surface of a substrate to form an as-deposited layer of the ceramic precursor composition; and sintering the as-deposited layer of the ceramic precursor composition at a sintering temperature to form a ceramic-based material.