An airfoil including a plurality of composite plies extending from a leading edge to a trailing edge and between a tip and a root. The airfoil further includes a frangible airfoil portion at the tip extending between the leading edge and the trailing edge and extending between the tip and a frangible line along a span including a first plurality of composite plies. The frangible airfoil portion includes a first plurality of composite plies including fibers having a first fiber modulus. The airfoil further includes a residual airfoil portion extending from the frangible line to the root along the span including a second plurality of composite plies. The second plurality of composite plies including one or more plies having a second fiber modulus. The second fiber modulus is greater than the first fiber modulus. Further, the residual airfoil portion meets the frangible airfoil portion at the frangible line.

Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7<α.sub.1/α.sub.2<0.9 and relational expression (2) 0.7<α.sub.3/α.sub.4<0.9 holds, where α.sub.1 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 300° C. and α.sub.2 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 300° C., and α.sub.3 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 1000° C. and α.sub.4 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 1000° C.

Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7<α.sub.1/α.sub.2<0.9 and relational expression (2) 0.7<α.sub.3/α.sub.4<0.9 holds, where α.sub.1 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 300° C. and α.sub.2 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 300° C., and α.sub.3 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 1000° C. and α.sub.4 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 1000° C.

A porous refractory cast material contains a closed refractory aggregate fraction having a minimum particle size and a maximum particle size; the ratio of maximum particle size to minimum particle size is 10:1 or less. This closed refractory aggregate fraction comprises all of the porous refractory cast material having a particle diameter greater than 0.1 mm. The porous refractory cast material also contains a binder phase containing refractory selected from calcium aluminate cement, alumina phosphate, hydratable alumina, colloidal silica and combinations thereof. Also disclosed is a metallurgical vessel with an interior lining incorporating the porous refractory cast material.

There is provided at least any of a layered body which has a change in color tone and in which it is unnecessary to select a colorant and the content of the colorant in consideration of a difference in the sintering behavior between layers, a precursor thereof, or a method for producing these. Provided is a layered body which has a structure, in which two or more layers containing stabilizer-containing zirconia and a colorant are layered, and in which types and contents of the colorants contained in the layers are equal to each other, the layered body including at least: a first layer containing a colorant and zirconia which has a stabilizer content of higher than or equal to 3.3 mol %; and a second layer containing a colorant and zirconia which has a stabilizer content different from that of the zirconia contained in the first layer.

A method for constructing multiple ceramic layers by winding continuous ceramic filaments of identical composition to prepare multilayer RF-transparent structures is provided. In the method, identical continuous ceramic filaments are wound to construct a layer with specific dielectric constant according to patterns, characterized by the winding angle, winding density/inter-fiber aperture and winding count/layer thickness. Layers with same or different dielectric characteristics forms a sandwich design to fulfill the desired mechanical, thermal and electrical requirements.

The present invention relates to a method for producing ceramic gas-separation membranes, which comprises depositing, by means of inkjet printing, water-based inks that form layers of a gas separation membrane. More specifically, the method comprises at least the following steps forming a porous support (i) compatible with a functional separation layer; depositing on the support (i), by means of inkjet printing, at least one functional separation layer (ii) formed by at least two inks, and depositing at least one porous catalytic activation layer (iii) on the functional separation layer (ii); and performing at least one heat treatment, which produces sintering. The functional separation layer (ii) is deposited in a manner to produce a surface with fadings, patterns, or combinations thereof he invention also relates to a gas separation membrane produced using the described method.

A selective laser sintering system includes a leveling roller having a first orientation. The leveling roller is configured to roll over a first feed bin. The build chamber is configured to receive, from the first feed bin and by the leveling roller, a transfer of a portion of matrix material. The selective laser sintering system is configured to transfer the portion to the build chamber in a number of orientations.

A selective laser sintering system includes a leveling roller having a first orientation. The leveling roller is configured to roll over a first feed bin. The build chamber is configured to receive, from the first feed bin and by the leveling roller, a transfer of a portion of matrix material. The selective laser sintering system is configured to transfer the portion to the build chamber in a number of orientations.

An apparatus for manipulating an object includes a substrate, an electrically conductive layer disposed on the substrate, and a porous medium comprising an electrically conductive material. The apparatus also includes a dielectric layer conformally disposed on the porous medium to insulate the porous medium from the object during use. The porosity of the porous medium is about 90% or greater. The adhesive strength of the porous medium is about 1 kPa or lower, and the modulus of the porous medium is about 1 GPa or lower.