An apparatus for manipulating an object includes a substrate, an electrically conductive layer disposed on the substrate, and a porous medium comprising an electrically conductive material. The apparatus also includes a dielectric layer conformally disposed on the porous medium to insulate the porous medium from the object during use. The porosity of the porous medium is about 90% or greater. The adhesive strength of the porous medium is about 1 kPa or lower, and the modulus of the porous medium is about 1 GPa or lower.

A method for manufacturing a sensor element that includes: a pair of electrodes; a ceramic layer having a hollow space that is to be an air introduction hole; and a first layer and a second layer stacked at both surfaces of the ceramic layer, One of the electrodes is in communication with the hollow space, The method includes: preparing an unsintered ceramic sheet, and a burn-out material sheet having a thickness different from that of the unsintered ceramic sheet, the burn-out material sheet having, in a plane orthogonal to the direction of an axial line O, a cross-sectional area substantially identical to a cross-sectional area of the pre-sintering hollow space; placing the burn-out material sheet in the pre-sintering hollow space; pressing the sheets so as to have an identical thickness; and burning out the burn-out material sheet.

The present disclosure relates to a structural coating and preparation method and use thereof. The structural coating provided in the present disclosure includes a titanium transition layer and platinum-hafnium composite structure layers laminated in sequence on a surface of a substrate; the number of the platinum-hafnium composite structure layer is ≥3; the platinum-hafnium composite structure layer includes a hafnium layer and a platinum layer laminated in sequence.

An object of the present invention is to provide a heat dissipation sheet having high thermal conductivity in the thickness direction. The present invention provides a heat dissipation sheet having a structure in which at least two thermally conductive insulation layers are laminated, wherein the lamination direction of the thermally conductive insulation layers is substantially perpendicular to the thickness direction of the heat dissipation sheet, and wherein for the entire cross-section perpendicular to the in-plane direction of the heat dissipation sheet, the thermally conductive insulation layer contains 75 to 97% by area of insulating particles, 3 to 25% by area of a binder resin, and 10% by area or less of voids.

An object of the present invention is to provide a heat dissipation sheet having high thermal conductivity in the thickness direction. The present invention provides a heat dissipation sheet having a structure in which at least two thermally conductive insulation layers are laminated, wherein the lamination direction of the thermally conductive insulation layers is substantially perpendicular to the thickness direction of the heat dissipation sheet, and wherein for the entire cross-section perpendicular to the in-plane direction of the heat dissipation sheet, the thermally conductive insulation layer contains 75 to 97% by area of insulating particles, 3 to 25% by area of a binder resin, and 10% by area or less of voids.

A multi-layer ceramic capacitor includes: a first region including a polycrystal including, as a main component, crystal grains free from intragranular pores; a second region that includes a polycrystal including, as a main component, crystal grains including intragranular pores and includes a higher content of silicon than a content of silicon in the first region; a capacitance forming unit including ceramic layers laminated along a first direction, and internal electrodes disposed between the ceramic layers; and a protective portion including a cover that covers the capacitance forming unit and constitutes a main surface facing in the first direction, a side margin constituting a side surface facing in a second direction orthogonal to the first direction, and a ridge constituting a connection portion, the connection portion connecting the main surface and the side surface to each other. The ceramic layers include the first region. The ridge includes the second region.

Methods of manufacturing composite sandwich components (100) and composite sandwich components overcome drawbacks in the prior art. For example, the large number of resin filled perforations that are unavoidable when manufacturing prior art composite sandwich components is avoided.

Methods of manufacturing composite sandwich components (100) and composite sandwich components overcome drawbacks in the prior art. For example, the large number of resin filled perforations that are unavoidable when manufacturing prior art composite sandwich components is avoided.

A method of forming a ceramic matrix composite component includes forming a fiber preform, the fiber preform including a plurality of ceramic fiber plies, a non-reduced fiber region having an areal weight, and a reduced fiber region characterized by a reduced areal weight less than the areal weight of the non-reduced fiber region by at least 5 percent. The method further includes selectively applying ceramic particles to the reduced fiber region in such manner as to avoid applying the ceramic particles to the non-reduced fiber region, and subsequently densifying the preform.

A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, a main component of the plurality of dielectric layers being a ceramic having a perovskite structure expressed by a general formula ABO.sub.3. At least one of crystal grains of the plurality of dielectric layers has a core-shell structure. A dispersion of atomic displacement amounts between B site atoms and oxygen atoms of a shell of the core-shell structure is larger than a dispersion of atomic displacement amounts between B site atoms and oxygen atoms of a core of the core-shell structure.