B32B43/00

Manufacturing method of anodic oxide film structure and anodic oxide film structure

Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.

Manufacturing method of flexible electronic substrate and substrate structure

A manufacturing method of a flexible electronic substrate and a substrate structure are disclosed. The manufacturing method includes: providing a first substrate comprising a first surface and a second surface which are opposite; forming a separation layer on the first surface of the first substrate, the separation layer being in a film form; providing a second substrate on the separation layer, the second substrate being configured as a flexible substrate; and processing the separation layer, such that at least a part of the separation layer is cracked from the film form, thereby separating the second substrate from the first substrate.

Method for Transferring a Layer to a Substrate
20220396067 · 2022-12-15 ·

The present disclosure relates to a method for transferring a target layer to a substrate. The method includes providing a stack by forming a first transfer layer over a first substrate, forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble, and forming the target layer on the second transfer layer, such that the stack has a top surface. The method also includes bonding the top surface of the stack to a second substrate, separating the first transfer layer from the second transfer layer, and dissolving the second transfer layer in water.

TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION

The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: (meth)acrylate monomer; co-polymerizable acid; and, an electrolyte; and, ii) a second part comprising: a first curing agent for the monomers of said first part; a second curing agent for the monomers of said first part; and, a solubilizer.

PROTECTIVE FILM REMOVING APPARATUS AND METHOD EACH FOR REMOVING A PROTECTIVE FILM FROM AN OPTICAL LENS
20220388298 · 2022-12-08 ·

A protective film removal device has a first removal station for releasing a protective film from an optical lens first surface, a lens holder which has an imaginary central axis, at least one fluid nozzle having a nozzle exit duct, and a rotary mounting between the lens holder and the fluid nozzle(s). The rotary mounting is configured such that a relative movement about the central axis is able to be carried out by the fluid nozzle(s), wherein the nozzle exit duct of the fluid nozzle(s) is in each case oriented inwards. A lifting device between the lens holder and the fluid nozzle(s) is configured in such that a relative movement in relation to the lens holder, said relative movement being oriented along the central axis, is able to be carried out by the fluid nozzle(s). A method for releasing a protective film from a lens surface is also disclosed.

TRANSACTION CARD INCORPORATING ALUMINUM ALLOYS
20220383061 · 2022-12-01 ·

Disclosed are examples of transaction cards incorporating aluminum or aluminum alloys. The aluminum can be extracted or recycled from a retired aircraft. Other materials can also be incorporated into the transaction card to provide sufficient weight and rigidity to the transaction card. Stainless steel can be incorporated into the construction of the card in combination with aluminum to provide a desired user experience.

METHOD FOR PROTECTING LOW-E GLASS PLATE, METHOD FOR PRODUCING GLASS UNIT, LAMINATE AND PROTECTIVE SHEET FOR LOW-E GLASS PLATE

Provided is a Low-E glass plate protection method capable of preventing or inhibiting Low-E layer alteration. In the protection method, a protective sheet having a substrate and a PSA layer provided to at least one face of the substrate is applied for protection via the PSA layer to a Low-E glass plate having a Low-E layer that comprises a zinc component. The method is characterized by using the protective sheet wherein the PSA layer is formed from a water-dispersed PSA composition and includes less than 850 μg ammonia per gram of PSA layer weight.

SHEET SEPARATION DEVICE, LAMINATOR, IMAGE FORMING APPARATUS, AND IMAGE FORMING SYSTEM

A sheet separation device separates a non-bonding portion of a two-ply sheet in which two sheets are overlapped and bonded together at a bonding portion of the two-ply sheet. The sheet separation device includes a winding roller, a conveyance roller pair, and a separation claw. The winding roller rotates and winds the two-ply sheet. The conveyance roller pair conveys the two-ply sheet toward the winding roller. The separation claw is inserted into a gap between the two sheets at a position between the winding roller and the conveyance roller pair. The separation claw is disposed in a space that is bounded by an imaginary plane and includes the winding roller. The imaginary plane passes through a nip of the conveyance roller pair and a winding start position at which the two-ply sheet starts to be wound around the winding roller.

SEPARATING METHOD, SEPARATING APPARATUS, AND SEPARATING SYSTEM

A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.

Carrier substrate, laminate, and method for manufacturing electronic device

A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.