Debonding methods comprise: providing a bound article comprising, in order: a first adherend, a first primer layer, an adhesive layer, optionally a second primer layer, and a second adherend; heating the article to a release temperature; and separating the first and second adherends. At room temperature, the adhesive layer exhibits a high overlap shear of greater than 1.0 MPa (145 psi) or even greater than 5.0 MPa (725 psi), however, at release temperature, the adhesive layer exhibits an overlap shear of no more than 0.34 MPa (50 psi) or even no more than 0.21 MPa (30 psi). The release temperature may be a temperature between 100° C. and 150° C. The adhesive layer may comprise: a first film-forming polymer or oligomer; a cured polymer comprising a polymer of a first species comprising first unsaturated free-radically polymerizable groups; a first transition metal cation; and optionally a quaternary ammonium salt.

A temporary adhesive material for wafer processing temporarily bonds a support to a wafer having a circuit-forming front and back surface for processing, including a composite temporary adhesive material layer having at least a two-layer structure of first and second temporary adhesive layers, the first layer including a thermoplastic resin layer that is releasably adhered to the wafer's front surface; and the second layer including a photo-curing siloxane polymer layer laminated on the first layer. A wafer processing laminate, a temporary adhesive material for wafer processing, and a method for manufacturing a thin wafer using the same, which suppress wafer warpage at the time of heat-bonding, have excellent delaminatability and cleaning removability, allow layer formation with uniform film thickness on a heavily stepped substrate, are highly compatible with steps of forming TSV, etc., have excellent thermal process resistance, and are capable of increasing productivity of thin wafers.

Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.

Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.

The embodiments discussed herein are related to a steam peeling device for an automobile tinting film comprising: a steam tarpaulin in the form of a rectangular oval; a wire frame sleeve seam part in which an outer seam part of the steam tarpaulin is rolled, folded and sewn at regular intervals; and a steam jack formed by fusion on one side of the middle of the steam tarpaulin; and a steam peeling device body in which a wire frame band having a certain length is inserted into the wire frame sleeve seam part, and a banding adjusting pinial formed at the end thereof are cross-pulled out to the upper edge slit in the middle part of the welding end of the steam tarpaulin wire frame sleeve seam part, the improvement of which includes: a wire frame banding module that is rivet assembled on both surfaces of the steam tarpaulin in contact with a slit in the middle part of the upper side border of the wire frame sleeve seam part, a wire frame sleeve stainless pipe in which a banding hole is cut and formed in the middle; a wire frame banding top plate having a length and a constant width standard of the wire frame sleeve stainless pipe, which is assembled in the front part of the steam tarpaulin of a portion where both ends of the wire frame band 4 intersect and protrude on both sides of the banding hole of the wire frame sleeve stainless pipe via the inside of the wire frame sleeve seam part; a pair of tapered slit fitting members that is integrally protruded and formed at the standard intervals of the banding holes on both sides of the upper border of the wire frame banding top plate; a U-shaped groove that is formed in a back face border of the upper side end of the tapered slit fitting member and a back face border on the lower side of the wire frame slit top plate; a pair of gripping parts that are formed to protrude at a predetermined interval to the right and left in the middle part of the front face of the wire frame banding top plate; a wire frame fixing groove that is formed in the vicinity of the wire frame banding top plate inside the pair of gripping parts; a cover plate which is a rectangular member having a standard corresponding to the back face part of the wire frame banding top plate; and a plurality of rivet holes that are penetrated opposite to each other in the wire frame banding top plate and the cover plate. The steam peeling device of the present invention solves the problem of the conventional case that the wire frame banding is loosened during the steam peeling operation, the steam tarpaulin is separated, or a part of the steam is released, and thereby solves the trouble of resetting the wire frame banding during operation, thereby l

Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

A method for manufacturing a display device includes providing a first display device assembly comprising a display module, a first window disposed on the display module, a first window adhesive layer disposed between the display module and the first window, and a first protective layer disposed on the first window. The first protective layer is removed. The first window is removed by providing an acid solution on the first display device assembly. A second window is provided that is disposed on the display module after the first window is removed. A second protective layer is provided that is disposed on the second window after the first protective layer is removed.

The embodiments disclosed are related to a steam peeling device for an automobile tinting film which includes: a wire frame banding module, a wire frame sleeve stainless pipe; a wire frame stent top plate; a pair of tapered slit fitting members; a U-shaped groove; a pair of gripping parts; a wire frame fixing groove; a cover plate; and a plurality of rivet holes. The steam peeling device of the present invention solves the problem of the conventional case that the wire frame banding is loosened during the steam peeling operation, the steam tarpaulin is separated, or a part of the steam is released, and thereby solves the trouble of resetting the wire frame banding during operation, thereby lowering the product unit cost through product productivity and function improvement, and reducing the time and labor costs further without resetting during operation along with the convenience of operation.

The invention relates to on-demand debondable pressure sensitive adhesive and laminating adhesive compositions and uses thereof. The debondable pressure sensitive adhesives and laminating adhesives are applied onto a substrate to form a bond, and upon exposure to electron beam or UV light energy source, the adhesive can dissociate from the substrate. The debondable pressure sensitive adhesives and laminating adhesives are particularly suitable for recycling in a circular economy.

An apparatus for supporting a process of debonding a carrier glass sheet and an ultrathin glass sheet. A suction plate includes a plurality of suction hole portions defining suction holes for suction-holding a glass laminate seated thereon and at least one recess portion defining at least one recess accommodating at least one device layer protruding from one surface of an ultrathin glass sheet of the glass laminate. A plurality of suction cups are fitted to the plurality of suction hole portions, respectively, such that the plurality of suction cups are elastically compressible, in response to contact pressure of the ultrathin glass sheet and the device layer. A vacuum pump is connected to the plurality of suction hole portions to apply negative pressure to the plurality of suction hole portions. A controller controls the vacuum pump to adjust the negative pressure applied to the plurality of suction hole portions.