Patent classifications
B32B2274/00
Article with Crosslinked Foam Layer Adhered to Substrate
The present disclosure provides an article. The article includes a crosslinked foam composition, an adhesive layer, and a substrate composed of an olefin-based polymer. The crosslinked foam composition includes an ethylene/a-olefin multi-block copolymer, an ethylene/propylene/diene terpolymer (EPDM), optional silicone rubber, optional blend component selected from ethylene/aolefin random copolymer, ethylene-vinyl acetate copolymer (EVA), styrene-butadiene block copolymer, hydrogenated styrene-butadiene block copolymer, and combinations thereof, optional plasticizer, optional filler, and optional additive.
THERMOPLASTIC POLYURETHANE FILM AND MULTILAYER FILM
Problem to be Solved
A thermoplastic polyurethane film that is capable of achieving a stress relaxation property regardless of the type of polyol, while having good pasting workability, as well as a multilayer film using the same, is provided.
Solution
The thermoplastic polyurethane film is constituted by a reaction product obtained by using dicyclohexylmethane diisocyanate (H.sub.12MDI). This enables the thermoplastic polyurethane film and the multilayer film to have a good stress relaxation property regardless of the type of polyol, and to have excellent pasting workability.
Joined body
Provided is a joined body comprising a first joined member, a second joined member, and a joining layer that joins the first joined member and the second joined member, wherein the first joined member and the second joined member are each independently one selected from the group consisting of a metal member, a polyamide resin member, and a polyolefin resin member, and the joining layer is a layer formed of a resin composition having a co-continuous phase including a continuous phase A farmed of the polyamide resin and a continuous phase B formed of the polyolefin resin and has a dispersed domain a distributed in the continuous phase A, a finely dispersed subdomain a′ distributed in the dispersed domain a, a dispersed domain b distributed in the continuous phase B, and a finely dispersed subdomain b′ distributed in the dispersed domain b.
SEALANT FILM, LAMINATE FILM, AND PACKAGING MATERIAL
A sealant film is provided in which a surface resin layer (A), an adhesive resin layer (B), a release resin layer (C), and a heat seal resin layer (D) are laminated. The adhesive resin layer (B) contains a thermoplastic elastomer (b1) and a tackifier resin (b2). The release resin layer (C) contains 40% by mass or more of an ethylene ionomer (c1) with a polar group concentration exceeding 5.5 mol % in a resin component contained in the release resin layer (C). The release resin layer (C) further contains 0 to 60% by mass of an ethylene ionomer (c2) with a polar group concentration of 5.5 mol % or less in the resin component contained in the release resin layer (C). The heat seal resin layer (D) contains an ethylene resin (d1).
HVACR pipe
The present invention relates to a pipe suitable for conveying fluids in HVACR applications, which pipe comprises an inner tube delimiting an inner space or passageway for a fluid, an insulating cover and an anti-corrosion layer.
Textile Backsheet
Textile backsheets including a nonwoven fabric and film, such as a vapor-permeable and liquid impermeable (VPLI) film or a non-permeable film, are provided, wherein the nonwoven fabric is directly or indirectly bonded to the film. Methods of making such textile backsheets and absorbent articles including the textile backsheets are also provided.
BILLBOARD SHEETING MATERIALS
A composite material for use as a billboard sheeting material includes a scrim coated on only a single side with PVC. The composite weighs about 5 ounces per square yard.
PIPE FOR CONVEYING FLUIDS IN HVACR SYSTEMS
The present invention relates to a composite coating for an inner tube delimiting a passageway for a fluid for obtaining a pipe for conveying fluids in HVACR systems.
HEAT-RESISTANT FILM
An object of the present invention is to provide a heat-resistant film that is suitable for protection of a surface provided with electrical conduction, decoration or the like in a plastic product, a glass product, a ceramic product, and the like, or that is suitable for holding a semiconductor, dies, and the like in producing dies through dicing and singulation. The film that solves the above object is a heat-resistant film comprising a thermoplastic resin, wherein (a) the thermoplastic resin is a polyester-based elastomer comprising a hard segment and a soft segment that are linked to each other, (b) the hard segment comprises a polyester unit constituted from an aromatic dicarboxylic acid and an aliphatic diol or an alicyclic diol, (c) the soft segment is constituted mainly from the prescribed polycarbonate, (d) a weight ratio of the hard segment contained in the polyester-based elastomer exceeds 50%, and (e) the film comprising the thermoplastic resin has an elastic modulus of 30 to 500 MPa, an elongation at break of 200 to 700%, and a ratio F50/F25 of 1.05 or more, the ratio F50/F25 being a ratio of a stress F50 at an elongation of 50% to a stress F25 at an elongation of 25%.
Multilayer structure and use of same
A multilayer structure includes a layer of a resin composition containing an ethylene-vinyl alcohol copolymer and a thermoplastic elastomer, wherein a mass ratio of the ethylene-vinyl alcohol copolymer to the thermoplastic elastomer is from 65/35 to 95/5 and the layer of the resin composition has one surface directly adjacent to a layer of polyolefin with no polar functional group. A multilayer structure is thus provided that is excellent in gas barrier properties, transparency, and flexibility and also has good delamination properties between the layer of the resin composition and the layer of the polyolefin with no polar functional group.