B32B2274/00

RELEASE FILM
20230226804 · 2023-07-20 ·

A release film includes a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board. The first release film comprises a fixing portion having a shape extending in one direction. A second release film is disposed under the printed circuit board. The second release film includes an incision portion. The fixing portion extends into the incision portion.

Conductive composite and method for manufacturing a conductive composite

A conductive composite includes a first layer of elastomeric polymer, a layer of electrically conductive paste on the first layer of elastomeric polymer, and a second layer of elastomeric polymer on the layer of electrically conductive paste. A reinforcement mesh is in contact with the layer of electrically conductive paste.

High strength multi-use hose
11703158 · 2023-07-18 · ·

A single layer/ply multi-use hose is contemplated. A thermoplastic polymer, such as polyurethane, is extruded through a woven tubular mesh of aramid fibers so as to encourage pillaring through gaps in the mesh of a sufficient amount to improve the overall durability and strength of the resultant hose. This wide diameter (at least 4 inches) and long continuous length (at least 300 feet) hose exhibits excellent durability (e.g., resistance to abrasion and/or punctures) and tensile ratios in excess of 2:1 so as to withstand tensile loads in excess of 100,000 pounds without delamination or bubbling within the hose wall.

MULTILAYER FILM, LAMINATED BODY, AND AIR BAG
20230020420 · 2023-01-19 ·

A multilayer film bonded to a base fabric includes a first layer bonded to the base fabric; and a second layer disposed on the first layer. The first layer, the second layer, or both includes a thermoplastic elastomer. The thermoplastic elastomer is at least one selected from the group consisting of a polyester-based elastomer, a polyurethane-based elastomer, and a polyamide-based elastomer. A melt strength of the multilayer film is greater than or equal to 7.5 mN.

DECORATIVE PANEL HAVING ANTIMICROBIAL PROPERTIES
20230217921 · 2023-07-13 ·

A decorative panel includes a substrate, a decor layer and a cover layer. The cover layer has a lacquer or is composed of a lacquer. The lacquer includes antimicrobial additives; and has an acrylate matrix and/or a methacrylate matrix.

RESIN COMPOSITION FOR SEALANT, MULTILAYERED BODY, PACKAGING MATERIAL AND PACKAGING CONTAINER
20230220189 · 2023-07-13 ·

A resin composition for a sealant, comprising an ethylene/polar monomer copolymer (A), an adhesion-imparting resin (B) and a 4-methyl-1-pentene/α-olefin copolymer (C), a content of the 4-methyl-1-pentene/α-olefin copolymer (C) being from 1% by mass to 20% by mass with respect to a total mass of the resin composition for a sealant.

LAYERED CONTAINMENT FEATURES
20230019398 · 2023-01-19 ·

A degradable containment includes an outer structural layer constructed of a pulp material, a central carrier layer constructed of a biopolymer, and an interior nanomaterial layer constructed of a nanomaterial.

Metal resin composite-molded article and method for manufacturing same

A metal resin composite-molded article which can suppress deformation induced by laser processing in a technique for improving the adhesion between a metal plate and a resin by forming grooves on the surface of the metal plate by means of a laser, even if the metal plate is thin. A metal resin composite-molded article obtained by insert-molding a resin composition on a metal plate having a thickness of 500 μm or less, grooves are formed on the surface of the metal plate in which the resin composition is inserted, the width of the grooves is 30-300 μm, the depth of the grooves is at most 24% of the thickness of the metal plate, and the ratio of the width to the depth is 0.1-2.5.

Encapsulation film including metal layer and protective layer with resin component

The present application provides an encapsulation film comprising an encapsulation layer, a metal layer, and a protective layer. The encapsulation film provides a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, minimizes the appearance change of the film due to excellent handling properties and processability, and prevents physical and chemical damage during encapsulation process.

Molded article and production method therefor
11697274 · 2023-07-11 · ·

A molded product having both small specific gravity and high stiffness and also suffering few sink marks is described along with a method for the production thereof, where the molded product includes a porous body (A) integrated with an injection molded body (B), the porous body (A) having an apparent density of 0.05 to 0.8 g/cm.sup.3, the average thickness (tA) of the porous body (A) and the average thickness (tB) of the injection molded body (B) satisfying the relation tA≥3×tB, and the injection molded body (B) covering at least one face of the porous body (A).