The phosphor disc disclosed here includes the following structural elements: a disc-shaped metal plate; a phosphor layer disposed circumferentially on the metal plate; and a bonding layer for bonding the phosphor layer to the metal plate. The metal plate curves convexly toward the phosphor layer.

Light-emitting quantum dot films, quantum dot lighting devices, and quantum dot-based backlight units are provided. Related compositions, components, and methods are also described. Improved quantum dot encapsulation and matrix materials are provided. Quantum dot films with protective barriers are described. High-efficiency, high brightness, and high-color purity quantum dot-based lighting devices are also included, as well as methods for improving efficiency and optical characteristics in quantum dot-based lighting devices.

The antifouling structure of the present invention includes a porous structural layer and a non-volatile liquid in pores and/or on a surface of the porous structural layer. The porous structural layer includes a modified portion at least at a surface part of the porous structural layer, and the elemental ratio of fluorine to silicon (F/Si) in the surface part is within the range of 3 to 50.

A method for processing a silicon wafer with a through cavity structure. The method is operated in accordance with the following sequence: performing ion implantation on a silicon wafer or pattern wafer; implanting a dummy substrate; bonding the silicon wafer to the pattern wafer; performing grinding and polishing, and thinning the pattern wafer to a depth exposing the pattern; bonding; and peeling the dummy substrate. Compared with the prior art, the present invention is standard in operation, and the product quality can be effectively guaranteed. The product has high cost performance and excellent comprehensive technical effect. The present invention has expectable relatively large economic values and social values.

A graphite-silicon composite, including: graphite; silicon; and an intermediate layer that is located between the graphite and the silicon, wherein the intermediate layer includes oxygen, carbon and silicon. Furthermore, provided is a method for producing a graphite-silicon composite, including: layering graphite and silicon; and heating the layered graphite and silicon while applying pressure to them, wherein, during heating the layered graphite and silicon while applying pressure to them, an oxygen concentration in the atmosphere is adjusted to 0.2 vol %, the applied pressure is adjusted to 24.5 MPa or higher, and the heating temperature is adjusted to 1260 C. or higher.

The present application discloses novel polyesteramides comprising cycloalkyl diols and/or cycloalkyl dialkanols with tunable properties based on the monomers and monomerratios used to prepare the polyesteramides and varying the reaction conditions. The present application also discloses compositions and articles.

A method of processing a double sided wafer of a microelectromechanical device includes spinning a resist onto a first side of a first wafer. The method further includes forming pathways within the resist to expose portions of the first side of the first wafer. The method also includes etching one or more depressions in the first side of the first wafer through the pathways, where each of the depressions have a planar surface and edges. Furthermore, the method includes depositing one or more adhesion metals over the resist such that the one or more adhesion metals are deposited within the depressions, and then removing the resist from the first wafer. The method finally includes depositing indium onto the adhesion metals deposited within the depressions and bonding a second wafer to the first wafer by compressing the indium between the second wafer and the first wafer.

In a method for producing a bonded body, a bonding step includes a supporting step of mounting a laminate on a support device, and a pressing step of pressing the laminate. A pressing member of the support device is a transparent glass plate formed in a circular shape. A sealing member of the support device is configured to circularly surround the laminate between the pressing member and the base member. The pressing step lowers the atmospheric pressure in the housing space by an atmospheric pressure adjusting device, thereby causing the pressing member to adhere to the sealing member and pressing the laminate with the pressing member.

An adhesive composition, wherein the adhesive composition is applied to obtain an adhesive coating layer having a complex viscosity of 10 Pa.Math.s or more and 10,000 Pa.Math.s or less at 25? C. or more and 100? C. or less, and the adhesive coating layer has a viscosity reduction rate of 80% or less determined by the following formula (1):

Viscosity reduction rate (%)=((V.sub.25?V.sub.100)/V.sub.25)?100Formula (1) wherein V.sub.25: Complex viscosity at 25? C., and V.sub.100: Complex viscosity at 100? C.

A method for producing a laminate of two silicon substrates, which includes: (a) providing a first silicon substrate having a first bonding part and a second silicon substrate having a second bonding part, wherein the first bonding part and the second bonding part are portions containing a silicon oxide; and bonding the first bonding part and the second bonding part with a reaction product derived from an organic material reactive with a hydrosilyl group and/or a silanol group. Also disclosed is a laminate including the two silicon substrates.