Light-emitting quantum dot films, quantum dot lighting devices, and quantum dot-based backlight units are provided. Related compositions, components, and methods are also described. Improved quantum dot encapsulation and matrix materials are provided. Quantum dot films with protective barriers are described. High-efficiency, high brightness, and high-color purity quantum dot-based lighting devices are also included, as well as methods for improving efficiency and optical characteristics in quantum dot-based lighting devices.

The phosphor disc disclosed here includes the following structural elements: a disc-shaped metal plate; a phosphor layer disposed circumferentially on the metal plate; and a bonding layer for bonding the phosphor layer to the metal plate. The metal plate curves convexly toward the phosphor layer.

A ceramic matrix composite article, method for forming the article, and perforated ply which may be incorporated therein are disclosed. The article includes at least one shell ply forming an exterior wall having first and second portions and defining a plenum. An annular brace formed of at least one structural support ply is disposed within the plenum, including a first integral portion integral with and part of the first portion of the exterior wall, a first curved portion extending from the first integral portion and curving across the article plenum to the second portion of the exterior wall, a second integral portion integral with and part of the second portion of the exterior wall, a second curved portion extending from the second integral portion and curving across the article plenum to the first curved portion, and an overlap in which the first and second curved portions are integral.

In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

A gas barrier film includes, in order, a film substrate, an organic layer, and a silica layer, in which the silica layer includes a silica polymer having at least a covalent bond between a silicon atom and an oxygen atom, and a concentration of carbon atoms of the organic layer is 50% or more. A method of producing a gas barrier film includes forming an organic layer having a concentration of carbon atoms of 50% or more on a film substrate, applying a coating liquid including a silicon compound to the organic layer to form a layer including the silicon compound, and irradiating the layer including the silicon compound with vacuum ultraviolet rays to form a silica layer including a silica polymer having at least a covalent bond between a silicon atom and an oxygen atom.

The phosphor disc disclosed here includes the following structural elements: a disc-shaped metal plate; a phosphor layer disposed circumferentially on the metal plate; and a bonding layer for bonding the phosphor layer to the metal plate. The metal plate curves convexly toward the phosphor layer.

A wavelength conversion device comprises: a substrate; a reflective resin layer on the substrate; and a wavelength conversion layer on the reflective resin layer, configured to receive incident light and to provide output light by wavelength conversion of the incident light, such that the output light is reflected by the reflective resin layer. A method for manufacturing a wavelength conversion device by applying a reflective resin layer to a substrate and providing a wavelength conversion layer on the reflective resin layer is further provided.

The present invention provides a cover glass and a glass laminate which are reduced in warpage, and have excellent scratch resistance, low reflecting properties and excellent optical properties. According to the present invention, a cover glass and a glass laminate which are reduced in glass warpage, retain the effect of scratch resistance, and have low reflecting properties and excellent optical properties can be provided by alternately superposing a film including a high-refractive-index material and a film including a low-refractive-index material, in given amounts.

The present invention is related to a flexible multilayer packaging film with high gas barrier properties comprising: one or more support layer(s) (1,10); one or more barrier layer(s) (6,60), each of the one or more barrier layer(s) (6,60) comprising an organic layer (2,20) and an inorganic layer(3,30); wherein said multilayer film has an oxygen transmission rate of less than 0.1 cm.sup.3/m.sup.2/24 h/atm, preferably less than 0.05 cm.sup.3/m.sup.2/24 h/atm, most preferably less than 0.03 cm.sup.3/m.sup.2/24 h/atm measured at 23? C. and 50 % relative humidity.

A composite wafer having an oxide single-crystal film transferred onto a support wafer, the film being a lithium tantalate or lithium niobate film, and the composite wafer being unlikely to have cracking or peeling caused in the lamination interface between the film and the support wafer. More specifically, a method of producing the composite wafer, including steps of: implanting hydrogen atom ions or molecule ions from a surface of the oxide wafer to form an ion-implanted layer inside thereof; subjecting at least one of the surface of the oxide wafer and a surface of the support wafer to surface activation treatment; bonding the surfaces together to obtain a laminate; heat-treating the laminate at 90 C. or higher at which cracking is not caused; and exposing the heat-treated laminate to visible light to split along the ion-implanted layer to obtain the composite wafer.