A method for self-aligning a thin-film device on a host substrate is provided. A predetermined location on a host substrate is treated with a hydrophobic lubricant to alter its interfacial energy. A needle is used to transfer a thin-film device, under water, to the location. Upon contact with the lubricant, the device adheres and self-aligns to the location to minimize the interfacial energy.

Provided is a semiconductor device manufacturing method that includes joining a support substrate to a back side of a semiconductor wafer across a ceramic adhesive layer and a mask, to form a joined body. The method further includes forming a functional structure on a front side of the semiconductor wafer. The method further includes detaching the support substrate from the semiconductor wafer by removing the ceramic adhesive layer and the mask. The method further includes a back side processing step of carrying out back side processing on the back side of the semiconductor wafer.

The phosphor disc disclosed here includes the following structural elements: a disc-shaped metal plate; a phosphor layer disposed circumferentially on the metal plate; and a bonding layer for bonding the phosphor layer to the metal plate. The metal plate curves convexly toward the phosphor layer.

A substrate laminate (10) includes a first substrate (11), a second substrate (12), and a cured product layer (13) interposed between the first substrate (11) and the second substrate (12). The cured product layer (13) is patterned, and includes a first layer (14) including a cured product of a first developable composition, and a second layer (15) including a cured product of a second developable composition, in this order from a first substrate (11) side. The first developable composition contains a polymerizable first curable compound and a first photopolymerization initiator and is free of a colorant. The second developable composition contains a polymerizable second curable compound, a second photopolymerization initiator, and a colorant.

This composite substrate has a single-crystal semiconductor thin film (13) provided to at least the front surface of an inorganic insulating sintered-body substrate (11) having a thermal conductivity of at least 5 W/m.Math.K and a volume resistivity of at least 110.sup.8 .Math.cm. The composite substrate also has, provided between the inorganic insulating sintered-body substrate (11) and the single-crystal semiconductor thin film (13), a silicon coating layer (12) comprising polycrystalline silicon or amorphous silicon. As a result of the present invention, metal impurity contamination from the sintered body can be inhibited, even in a composite substrate in which a single-crystal silicon thin film is provided upon an inexpensive ceramic sintered body which is opaque with respect to visible light, which exhibits an excellent thermal conductivity, and which further exhibits little loss at a high frequency range, and characteristics can be improved.

A room-temperature bonding apparatus includes a bonding chamber, an upper-side stage mechanism to support an upper-side wafer to be movable in an upper and lower direction in the bonding chamber, and a lower-side stage mechanism configured to support a lower-side wafer in a horizontal plane in the bonding chamber. The lower-side stage mechanism includes a carriage having a lower-side wafer holding section for holding the lower-side wafer, an elastic guide connected to the carriage to support the carriage, a positioning stage for finely moving the lower-side wafer holding section, and a fine movement mechanism for finely moving a lower-side wafer holding section, and a carriage support base. The elastic guide supports the carriage elastically deforms so as for the carriage to contact the carriage support base when the upper-side wafer contacts the lower-side wafer and a load is applied to the carriage into an upper and lower direction by the upper-side stage mechanism.

In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.

A display device includes a display panel which contains an LED which emits light, a first layer containing a porous polymer and disposed on the display panel, a second layer containing a metal halide and disposed on the first layer, and a lenticular lens disposed on the display panel, where the first layer has a first refractive index and the second layer has a second refractive index less than the first refractive index.