A transaction card includes a monolithic ceramic card body having one or more pockets, and at least one of a magnetic stripe, a barcode, and a laser signature portion. The one or more pockets may be configured to receive at least one of the magnetic stripe, the barcode, a contact chip module, a contactless chip module, a dual interface chip module, a booster antenna, a hologram or commercial indicia. A transaction card may also include a substrate layer having a first side and a second side. A first ceramic layer is connected to the first side of the substrate layer.

Curable prepregs possessing enhanced ability for the removal of gases from within prepregs and between prepreg plies in a prepreg layup prior to and/or during consolidation and curing. Each curable prepreg is a resin-impregnated, woven fabric that has been subjected to a treatment to create an array of openings in at least one major surface. Furthermore, the location of the openings is specific to the weave pattern of the fabric.

A hollow wall composite tube for improving performance in sports shafts and lightweight structural members is disclosed that includes: a constituent tube, for forming the wall, that comprises: a flexible core component, for providing an adjustable shape on which to wind or braid filaments or fabric; and an adjustable shape hollow structure, for reducing weight, providing a path for the core to be evacuated, tightly conformed to the core, and tow, braid filaments or fabric, for providing a reinforcing fiber matrix for saturation with epoxy, spirally wrapped, applied or braided on the constituent tube. Methods of producing contemplated composite tubes are also disclosed.

A composite oil pan for a work vehicle engine and a method of forming the composite engine oil pan include forming a sheet of metal into a first pan and open molding a fiber-reinforced polymer resin onto the first pan forming a second pan. The first pan has a first bottom wall and first peripheral walls extending from edges of the first bottom wall to define a sump, the first peripheral walls terminating in a first peripheral flange. The second pan has a second bottom wall and second peripheral walls abutting the first bottom wall and the first peripheral walls, the second peripheral walls terminating in a second peripheral flange. The first pan defines a thin metal structure with an inner surface extending across the first bottom wall, first peripheral walls and first peripheral flange; the second pan reinforces the first pan without abutting the inner surface.

A method for bonding components is provided. The method includes preparing a surface of a metal component, applying a film adhesive to the prepared surface, forming a thermoplastic component using injection molding such that the film adhesive is positioned between the metal component and the thermoplastic component, and curing the film adhesive.

Manufacturing a semiconductor apparatus includes preparing a support-base attached encapsulant including a thermosetting resin layer stacked as an encapsulant on a support base, coating a semiconductor-device mounting surface of a substrate on which semiconductor devices are mounted, or a semiconductor-device forming surface of a wafer on which semiconductor devices are formed with the thermosetting resin layer of the support-base attached encapsulant, heating and curing the thermosetting resin layer to collectively encapsulate the semiconductor-device mounting surface of the substrate or the semiconductor-device forming surface of the wafer, and cutting the encapsulated substrate or wafer by dicing. Coating includes surrounding a side face of the support-base attached encapsulant by a frame mechanism, holding the substrate or the wafer with the substrate or the wafer facing and spaced apart from the thermosetting resin layer of the support-base attached encapsulant, and vacuum laminating the support-base attached encapsulant together with the substrate or the wafer.

A method for production of a tubular body applying the following steps: Pressureless application of at least one first curable plastic layer made of reactive polyurethane materials with a core via a rotational molding process, Curing the at least one plastic layer, Winding at least one reinforcement layer onto the at least one first plastic layer, Pressureless application of at least one second curable plastic layer, wherein the reinforcement layer is embedded without holes between the two plastic layers, and Removal of the core after completion of the body.

Because of this, the position of the reinforcement layer 7 can be individually established and it can be ensured that the reinforcement layer will not penetrate into the first plastic layer during winding after the curing of the first plastic layer.

A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 μm and less than 1 μm, not less than 1 μm and less than 10 μm, from 10 μm to 50 μm, and from 20 μm to 100 μm, and in which a peak present in a range of from 10 μm to 50 μm includes an aluminum oxide particle, and a peak present in a range of from 20 μm to 100 μm includes a boron nitride particle. In Formula (I) each of R.sup.1, R.sup.2 and R.sup.3 independently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7. ##STR00001##

Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T1, and an adhesion initiation temperature of the second adhesive layer is set to T2, T2 is higher than T1 by 30° C. or more.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).