Diecuts are configured for permanent closing of holes and have a carrier comprising an assembly of at least two polymeric films. An upper film of the at least two polymeric films has a basis weight of at least 1.0 kg/m.sup.2 and a lower film of the at least two polymeric films consisting of at least two layers, wherein a first layer is in the form of a polymeric film and faces the upper film, and a second layer is in the form of a functional layer with a side of the lower film, facing away from the upper film, bears an applied adhesive composition.

Disclosed are exemplary embodiments of systems and methods for controllably changing (e.g., weaken, strengthen, eliminate, add, customize, alter, etc.) surface tack of thermal interface materials. Also disclosed are exemplary embodiments of thermal interface material assemblies, which include coatings configured to change surface tack of the thermal interface materials.

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

Provided are a thermoplastic resin film and an adhesive label including the thermoplastic resin film as a substrate excellent not only in transparency but also in indication visibility. The thermoplastic resin film of the present invention includes, in the following order, a printable layer (II), a substrate layer (I) and an adhesive-processing layer (III), wherein the substrate layer (I) comprises 60 to 99.5% by mass of a crystalline polypropylene resin and 0.5 to 40% by mass of a petroleum resin, and an internal haze of the thermoplastic resin film is less than 15%.

A rear SMC component is adhesively bonded to a central SMC component to form a cavity adjacent the rear wall that encloses a tapping plate. A reinforcing SMC component is adhesively bonded to the central SMC component with a rail portion against the top wall and a rear gusset portion against the rear wall. Conductive heaters are positioned directly against the surfaces on both sides of the adhesive for the rail portion but only on the interior side of the adhesive for the gusset portion, because the rear component blocks access thereto. As a result, the adhesive for the gusset portion is only partially cured by the heater. A gusset fastener is installed through the rear gusset portion and the rear wall and into the tapping plate to fixedly retain the rear gusset portion against the rear wall while this partially cured adhesive subsequently cures.

A composite material with an insert-molded attachment steel is provided. The composite material includes a plurality of burring apertures, each of which has a flange in one direction on the attachment steel and is inserted between fibers. A resin is then introduced between the fibers in each burring aperture and external to the flange.

A manufacturing apparatus of a display device includes a first jig configured to hold a first member; a second jig located under the first jig and coupled to or separated from the first jig such that the first member is locatable between the first jig and the second jig; fixing parts located at both ends of the second jig and configured to hold a second member between the first member and the second jig, the second jig including a pad; and a stage located under the pad and provided with a groove formed therethrough and having an area smaller than an area of the pad when viewed in a plan view, wherein one portion of the pad, which faces the stage, is configured to be within the groove.

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

Disclosed are exemplary embodiments of systems and methods for controllably changing (e.g., weaken, strengthen, eliminate, add, customize, alter, etc.) surface tack of thermal interface materials. Also disclosed are exemplary embodiments of thermal interface material assemblies, which include coatings configured to change surface tack of the thermal interface materials.

A manufacturing apparatus of a display device includes a first jig configured to hold a first member; a second jig located under the first jig and coupled to or separated from the first jig such that the first member is locatable between the first jig and the second jig; fixing parts located at both ends of the second jig and configured to hold a second member between the first member and the second jig, the second jig including a pad; and a stage located under the pad and provided with a groove formed therethrough and having an area smaller than an area of the pad when viewed in a plan view, wherein one portion of the pad, which faces the stage, is configured to be within the groove.