The present disclosure relates to a decoration element comprising a light reflective layer, and a light absorbing layer provided on the light reflective layer and comprising Si.

Provided are vacuum-insulated articles that comprise an evacuated space disposed between first and second walls and a reflective material disposed within the evacuated space. Also provided are methods of fabricating such articles.

A polymer composite of dissimilar polymers covalently bonded at the interface is disclosed. A method for bonding dissimilar polymers includes providing a first precursor to a hydrogel polymer network comprising a first coupling agent; providing a second precursor to a second polymer network comprising a second coupling agent, wherein the hydrogel polymer network and the second polymer network are different; initiating polymerization of the first precursor to form a hydrogel polymer network, wherein the first coupling agent is incorporated into the polymer network with a negligible amount of condensation; initiating polymerization of the second precursor to form a second polymer network, wherein the second coupling agent is incorporated into the second polymer network with a negligible amount of condensation; contacting one of the first hydrogel precursor or the hydrogel polymer network with one of the second polymer precursor or second polymer networks and initiating condensation between the first and second coupling agents to form a covalent bond.

This invention relates to devices integrally comprising fibres that have emissivities, particularly of infrared radiation, that can be controllably varied. The active emissive surface comprises graphene layers with intercalated ions.

The interaction of elementary particles, in particular neutrinos of any kind and/or electromagnetic waves and/or gravitation, hereinafter referred to as kinetic energy of radiations, such as non-visible spectrum of solar or space radiation with metallic and/or non-metallic structures, in particular a film which is made of metal, a metal alloy or an electrically conductive plastic and which has a non-metallic nano-coating.

The present invention provides a multilayer structure that has excellent gas barrier properties and an excellent peel strength between a base and a gas barrier layer after retorting, and that can retain a good appearance with no delamination even after retorting under stress. The present invention also provides packaging materials and products including such a multilayer structure. The present invention relates to a multilayer structure comprising a base (X), a layer (Z) stacked on the base (X), and a layer (Y) stacked on the layer (Z), the layer (Y) containing a reaction product (D) of an aluminum-containing metal oxide (A) and an inorganic phosphorus compound (BI), the layer (Z) containing a polyvinyl alcohol resin (C) and a polyester resin (L).

A fibre-reinforced polymer composite comprising fibres bound within a solid polymer matrix, wherein at least some of the fibres are in contact with graphene, and wherein the composite changes electrical resistance when deformed.

3D printers and novel polymeric laminates for use in 3D printers. The novel laminates comprise a first layer composed of a PMP polymer, a PPO polymer or the like and a second layer composed of an amorphous fluoropolymer.

The present disclosure relates to hot-fillable articles made from multilayered thermoformable film and sheet comprising polyester and copolyester compositions which comprise residues of terephthalic acid, 1,4- cyclohexanedimethanol (CHDM), 2,2,4,4-tetramethyl-1,3-cyclobutanediol (TMCD), ethylene glycol (EG), and diethylene glycol (DEG), in certain compositional ranges having certain advantages and improved performance properties.

A semiconductor substrate processing apparatus includes a vacuum chamber having a processing zone in which a semiconductor substrate may be processed, a process gas source in fluid communication with the vacuum chamber for supplying a process gas into the vacuum chamber, a showerhead module through which process gas from the process gas source is supplied to the processing zone of the vacuum chamber, and a substrate pedestal module. The substrate pedestal module includes a platen made of ceramic material having an upper surface configured to support a semiconductor substrate thereon during processing, a stem made of ceramic material having an upper stem flange that supports the platen, and a backside gas tube made of ceramic material that is located in an interior of the stem. The backside gas tube includes an upper gas tube flange that is located between a lower surface of the platen and an upper surface of the upper stem flange wherein the backside gas tube is in fluid communication with at least one backside gas passage of the platen and the backside gas tube is configured to supply a backside gas to a region below a lower surface of a semiconductor substrate that is to be supported on the upper surface of the platen during processing.