Patent classifications
B32B2457/00
Structure with selectively variable stiffness
A stiffness control and systems for the same are disclosed herein. A first plate and a second plate can be connected with rigid support, a hydraulic actuator and a high roughness surface. Upon actuation, the actuator can force the high roughness surface against the first plate, thus increasing rigidity through hydraulic pressure against the first plate and the second plate. Thus, the stiffness of the surface can be altered in a variable and reversible fashion.
Apparatus and method for removing a film from a surface
After molding a substrate located between first and second molds of a molding system, a used release film that is in contact with the substrate during molding is removed from the molding system with a gripper assembly, which is reciprocally movable between a retracted position outside the molding system and an extended position in a space between the first and second molds when the first and second molds are opened. A carriage mechanism on which the gripper assembly is mounted moves the gripper assembly towards the first or second mold until the gripper assembly contacts the used release film, before an actuator actuates the gripper assembly to clamp onto a part of the used release film. The carriage mechanism also conveys the gripper assembly away from the first mold or second mold to remove the used release film from the molding system.
Multilayer structure and method for producing same, coating liquid, packaging material, and protective sheet for electronic devices
The present invention relates to a multilayer structure including a base (X) and a layer (Y), wherein the layer (Y) includes an aluminum-containing compound (A) and a phosphorus compound (BH) in which a phosphorus atom having at least one hydroxy group and a polar group are bonded via an alkylene chain having 3 to 20 carbon atoms or a polyoxyalkylene chain based on an alkylene having 3 to 20 carbon atoms, and the aluminum-containing compound (A) is a compound (Ab) including a reaction product (D) of an aluminum-containing metal oxide (Aa) and an inorganic phosphorus compound (BI).
Multiaxial textile resin base material and method of production thereof
A multiaxial fabric resin base material includes a multiaxial fabric base material laminate impregnated with a thermosetting resin (B), the multiaxial fabric base material laminate including fiber bundle sheets layered at different angles, the fiber bundle sheets including unidirectionally aligned fiber bundles stitched with stitching yarns composed of a thermoplastic resin (A), the multiaxial fabric base material laminate being penetrated in the thickness direction by other bodies of the stitching yarns, and being stitched with the other bodies of the stitching yarns such that the yarns reciprocate at predetermined intervals along the longitudinal direction, the thermoplastic resin (A) constituting the stitching yarns having a softening point, the softening point being higher than the resin impregnation temperature of the thermosetting resin (B).
Laminated anodic aluminum oxide structure, guide plate of probe card using same, and probe card having same
Proposed are a laminated anodic aluminum oxide structure in which a plurality of anodic aluminum oxide films are stacked, a guide plate of a probe card using the same, and a probe card having the same. More particularly, proposed are a laminated anodic aluminum oxide structure with a high degree of surface strength, a guide plate of a probe card using the same, and a probe card having the same.
Polycrystalline ceramic substrate, bonding-layer-including polycrystalline ceramic substrate, and laminated substrate
Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7<α.sub.1/α.sub.2<0.9 and relational expression (2) 0.7<α.sub.3/α.sub.4<0.9 holds, where α.sub.1 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 300° C. and α.sub.2 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 300° C., and α.sub.3 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 1000° C. and α.sub.4 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 1000° C.
Curable polysiloxane compositions and slippery materials and coatings and articles made therefrom
The present teachings generally provide curable polysiloxane compositions including a base resin including a surface active polymer. Articles of manufacture including the curable polysiloxane compositions and slippery coatings and materials also are provided. The compositions may be used to provide slippery, lubricious, or repellent materials and coatings and may provide anti-fouling function. The compositions can provide anti-fouling or foul-release function on open surfaces, internal surfaces, membranes; to provide pinning free or low contact angle hysteresis surfaces; to provide homogeneous interface to suppress nucleation; to provide a barrier layer such as anti-corrosion; to provide anti-stain, anti-smudge, anti-fingerprint, anti-soil function.
Electrically conductive surface and a process for producing the same
Load-bearing apparatus/systems for location in the vicinity of energized power lines are provided. The apparatus includes a base member. The base member has an upper layer and a backing surface layer. An uppermost surface of the upper layer is adapted to support on it at least power line workers and/or related stringing equipment. At least the uppermost surface of the upper layer is adapted to be electrically conductive. Methods for forming the apparatus are also provided.
Cover film
A cover film having at least (A) a substrate layer, (B) an intermediate layer, (C) an adhesive layer, and (D) a heat seal layer having a heat sealable resin, a thermoplastic resin of the (D) heat sealing layer having a mixture of two types of (meth)acrylic acid ester copolymers having different glass transition temperatures and a hydrazide compound, wherein one of the (meth)acrylic acid ester copolymer in the (meth)acrylic acid ester copolymer mixture has a glass transition temperature of −20 to 10° C. and the other (meth)acrylic acid ester copolymer has a glass transition temperature of 40 to 80° C.
POLYMER-CERAMIC COMPOSITE HOUSINGS AND HOUSING COMPONENTS FOR PORTABLE ELECTRONIC DEVICES
The present disclosure includes thin, high-stiffness laminates, portable electronic device housings including the same, and methods for making such laminates and portable electronic device housings. Some laminates include an inner section having one or more first laminae and one or more second laminae, and first and second outer sections disposed on opposing sides of the inner section, each having one or more third laminae The laminate has a width and a length that is perpendicular to the width. Each of the first lamina(e) can have fibers aligned in a direction parallel to the length, each of the second lamina(e) can have fibers aligned in a direction parallel to the width, and each of the third lamina(e) can have fibers aligned in a direction angnlarly disposed at an angle of at least 10 degrees to each of the length and the width.