A hot foil stamping press (10) comprises a platen press (16), with a supporting plate (22) comprising a base plate (26) and a compensating plate (28) being rotatably attached to the base plate (26) for switching between an operating position and a makeready position and a hook element (38) comprising a base part and a top part being arranged at an angle relative to the base part. The hook element (38) is rotatably attached to a door (30) of the platen press (16) by a fixation axle for switching between a releasing position and a securing position of the hook element, wherein the top part retains the compensating plate (28) in its makeready position when the hook element (38) is in its securing position.

A transfer printing method is described that can be used for a wide variety of materials, such as to allow for circuits formed of different materials to be integrated together on a single integrated circuit. A tether (18) is formed on dice regions (16) of a first wafer (30), followed by attachment of a second wafer (32) to the tethers. The dice regions (16) are processed so as to be separated, followed by transfer printing of the dice regions to a third wafer (34).

A holographic foil supplying device for a hot foil stamping machine has a reel (26) for holographic foil (20), an advancement system (24) for advancing the holographic foil (20) along a movement path (P) in a feeding direction (F) and a frame (22) supporting the reel (26) and the advancement system (24), wherein the frame (22) comprises a mount (30) for mounting the holographic foil supplying device (18) to the hot foil stamping machine. Further, a hot foil stamping machine is shown.

Provided are an X-ray detector having fabrication fault tolerant structure and a method for manufacturing the same using a micro-transfer printing (MTP) technique. The X-ray detector may include a photodiode layer formed on a base substrate within a pixel area and including a plurality of photodiode pixel units, a dummy layer formed the base substrate within a peripheral area, a plurality of pixel driving integrated chips printed on the photodiode layer, a plurality of primary column and row integrated chips printed on the dummy layer, and metal lines coupling the column and row integrated chips with pixel driving integrated chips and other constituent elements, wherein the plurality of pixel driving integrated chips and primary column and row integrated chips are manufactured separately from the photodiode layer and the dummy layer and attached on the photodiode layer and the dummy layer, respectively.

A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

A foil transfer film cartridge includes a supply reel on which a foil film including a transfer layer containing foil is wound, a take-up reel on which to take up the foil film, a first connecting portion extending in a direction perpendicular to a first axial direction along a rotation axis of the supply reel and connecting the supply reel and the take-up reel at a position apart from the foil film, and a film guide member extending in a second axial direction along a rotation axis of the take-up reel the film guide member being capable of assuming an out-of-contact state and an in-contact state with the foil film extended between the supply reel and the take-up reel.

Examples relate to receiving image data of an image to be sublimation printed, wherein the image data comprising one or more colours to be printed, and a corresponding printing liquid density of the one or more colours. Based on the received image data, a sublimation energy to use to transfer printed printing liquid representing the image into a material is determined, and the determined sublimation energy is provided to a sublimator of a printer for transferring the image.

Examples relate to receiving image data of an image to be sublimation printed, wherein the image data comprising one or more colours to be printed, and a corresponding printing liquid density of the one or more colours. Based on the received image data, a sublimation energy to use to transfer printed printing liquid representing the image into a material is determined, and the determined sublimation energy is provided to a sublimator of a printer for transferring the image.

A stamp for micro-transfer printing includes a support having a support surface and posts disposed on the support surface. Each post has a distal end extending away from the support. The post has a post surface on the distal end. The post surface is a structured surface comprising spatially separated ridges that extend in a ridge direction entirely across the post surface and can be operable to form multiple delamination fronts when a first side of a micro-device is in contact with the post surface, a second side of the micro-device is in contact with a target surface of a target substrate, and the support is moved in a horizontal direction parallel to the target substrate surface. The post surface or ridges can be rectangular or non-rectangular with opposing edges having different lengths.

A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.