A semiconductor device includes a substrate, a first cell having a first functionality, and a second cell having a second functionality. The first cell includes a first portion on a first side of the substrate, wherein the first portion includes a first conductive element; a second portion on a second side of the substrate, wherein the second portion includes a second conductive element; and a first conductive via extending through the substrate and electrically connecting the first conductive element to the second conductive element. The second cell includes a third portion on the first side of the substrate, wherein the third portion includes a third conductive element; a fourth portion on the second side of the substrate, wherein the fourth portion includes a fourth conductive element; and a second conductive via extending through the substrate and electrically connecting the third conductive element to the fourth conductive element.

A lighting touchpad is provided. The lighting touchpad includes a substrate, a plurality of first electrodes, a plurality of second electrodes, a plurality of bonding pads and a plurality of lighting devices. The plurality of first electrodes, the plurality of second electrodes and the plurality of bonding pads are arranged on the substrate, and the first electrodes, the second electrodes, and the bonding pads are alternately arranged in a sensing area without overlapping with one another. The pluralities of lighting devices are connected to a part of the bonding pads. The sensing area includes a plurality of sensing cells, and the first electrodes, the second electrodes and the bonding pads are arranged according to a predetermined spatial characteristic for each of the sensing cells

A display device includes: a display panel; a driving integrated circuit chip configured to drive the display panel; a first printed circuit board connected to the display panel; a second printed circuit board connected to the first printed circuit board; and a cover including a body portion covering the driving integrated circuit chip, the first printed circuit board, and the second printed circuit board, and a wing portion protruding from the body portion, wherein the wing portion extends from a front surface of the display panel to a rear surface of the display panel while surrounding a side surface of the display panel.

According to an embodiment of the disclosure, a flexible display device includes a display part including a light emitting element disposed on a base layer, and a panel cover disposed on a rear surface of the display part and including a heat dissipation layer. The heat dissipation layer includes a base heat dissipation layer, and a heat dissipation pattern patterned on the base heat dissipation layer.

A micro heat transfer component includes a bottom metal plate; a top metal plate; a plurality of sidewalls each having a top end joining the top metal plate and a bottom end joining the bottom metal plate, wherein the top and bottom metal plates and the sidewalls form a chamber in the micro heat transfer component; a plurality of metal posts in the chamber and between the top and bottom metal plates, wherein each of the metal posts has a top end joining the top metal plate and a bottom end joining the bottom metal plate; a metal layer in the chamber, between the top and bottom metal plates and intersecting each of the metal posts, wherein a plurality of openings are in the metal layer, wherein a first space in the chamber is between the metal layer and bottom metal plate and a second space in the chamber is between the metal layer and top metal plate; and a liquid in the first space in the chamber.

A three-dimensional stacked integrated circuit is configured such that a package provided with a semiconductor chip and an interposer substrate provided with an opening are alternately stacked with respective electrode terminals and electrode pads, the package and the interposer substrate include electrode terminals having a shape in which a gap is generated between the electrode terminals in a stacking direction in a stacked state, an electrode pad for connecting the electrode terminals, and a guide hole for holding accurate positioning and connection at a time of stacking, an interlayer communication path is formed by connecting the package and the interposer substrate, and a cooling liquid flows through the gap to perform liquid immersion cooling.

In an embodiment a method for producing radiation-emitting semiconductor chips includes providing a semiconductor wafer, applying first contact layers on the semiconductor wafer, applying a second dielectric layer on the semiconductor wafer and the first contact layers, attaching a carrier arrangement to the semiconductor wafer, singulating the semiconductor wafer into semiconductor bodies and applying second contact layers on the semiconductor bodies, wherein the second dielectric layer is formed such that it mechanically stabilizes itself.

A low cost IC solution is disclosed to provide Super CMOS microelectronics macros. Hereinafter, the Super CMOS or Schottky CMOS all refer to SCMOS. The SCMOS device solutions with a niche circuit element, the complementary low threshold Schottky barrier diode pairs (SBD) made by selected metal barrier contacts (Co/Ti) to P and NSi beds of the CMOS transistors. A DTL like new circuit topology and designed wide contents of broad product libraries, which used the integrated SBD and transistors (BJT, CMOS, and Flash versions) as basic components. The macros include diodes that are selectively attached to the diffusion bed of the transistors, configuring them to form generic logic gates, memory cores, and analog functional blocks from simple to the complicated, from discrete components to all grades of VLSI chips. Solar photon voltaic electricity conversion and bio-lab-on-a-chip are two newly extended fields of the SCMOS IC applications.

A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

A display panel includes a first row driving module, a second row driving module, and a control module. The first row driving module is arranged on one side of the base plate, and includes a first row transistor column and a first decoder that are connected. Multiple first pins are arranged on the first row transistor column, and are each connected to a respective row of LEDs. The second row driving module is arranged on the other side of the base plate, and includes a second row transistor column and a first decoder that are connected. Multiple second pins are arranged on the second row transistor column, and are each connected to a respective row of LEDs. The control module is connected to the first and the second row driving module, and controls one of the first and the second decoder to operate or both to operate simultaneously.