Hybrid nanopores, comprising a protein pore supported within a solid-state membrane, which combine the robust nature of solid-state membranes with the easily tunable and precise engineering of protein nanopores. In an embodiment, a lipid-free hybrid nanopore comprises a water soluble and stable, modified portal protein of the Thermus thermophilus bacteriophage G20c, electrokinetically inserted into a larger nanopore in a solid-state membrane. The hybrid pore is stable and easy to fabricate, and exhibits low peripheral leakage, allowing sensing and discrimination among different types of biomolecules.

The present disclosure provides a microchannel device including a first base having a defining surface that defines a flow channel and containing a polymer that contains a fluorine atom and a second base having a defining surface that defines the flow channel together with the defining surface of the first base, having solvent resistance, and coming into contact with the first base, in which an arithmetic average roughness Ra of a surface of the first base, exposed by peeling the second base from the first base, is 1 μm or more, and provides a use application thereof.

The present disclosure provides a microchannel device including a first base having a defining surface that defines a flow channel and containing a polymer that contains a fluorine atom and a second base having a defining surface that defines the flow channel together with the defining surface of the first base, having solvent resistance, and coming into contact with the first base, in which an arithmetic average roughness Ra of a surface of the first base, exposed by peeling the second base from the first base, is 1 μm or more, and provides a use application thereof.

A microstructure and a method for manufacturing the same includes: disposing a liquid film on a surface of a substrate, wherein a solid-liquid interface is formed where the liquid film is in contact with the substrate; and irradiating the substrate with a laser of a predetermined waveband to etch the substrate at the solid-liquid interface, wherein the position where the laser is irradiated on the solid-liquid interface moves at least along a direction parallel to the surface of the substrate, and the absorption rate of the liquid film for the laser is greater than the absorption rate of the substrate for the laser.

A device includes a first layer of an electrically insulating material and a second layer of a non-electrically insulating material (e.g., semiconductor or electrically conductive) extending on the first layer. The second layer is structured so as to define opposite, lateral walls of a microchannel, a bottom wall of which is defined by an exposed surface of the first layer. The second layer is further structured to form one or more electrical insulation barriers; each barrier includes a line of through holes, each surrounded by an oxidized region of the material of the second layer. The through holes alternate with oxidized portions of the oxidized region along the line. Each barrier extends, as a whole, laterally across the second layer up to one of the lateral walls and delimits two sections of the second layer on each side of the barrier and on a same side of the microchannel.

Microfluidic chips that can comprise thin substrates and/or a high density of vias are described herein. An apparatus comprises: a silicon device layer comprising a plurality of vias, the plurality of vias comprising greater than or equal to about 100 vias per square centimeter of a surface of the silicon device layer and less than or equal to about 100,000 vias per square centimeter of the surface of the silicon device layer, and the plurality of vias extending through the silicon device layer; and a sealing layer bonded to the silicon device layer, wherein the sealing layer has greater rigidity than the silicon device layer. In some embodiments, the silicon device layer has a thickness between about 7 micrometers and about 500 micrometers while a via of the plurality of vias has a diameter between about 5 micrometers and about 5 millimeters.

Microfluidic chips that can comprise thin substrates and/or a high density of vias are described herein. An apparatus comprises: a silicon device layer comprising a plurality of vias, the plurality of vias comprising greater than or equal to about 100 vias per square centimeter of a surface of the silicon device layer and less than or equal to about 100,000 vias per square centimeter of the surface of the silicon device layer, and the plurality of vias extending through the silicon device layer; and a sealing layer bonded to the silicon device layer, wherein the sealing layer has greater rigidity than the silicon device layer. In some embodiments, the silicon device layer has a thickness between about 7 micrometers and about 500 micrometers while a via of the plurality of vias has a diameter between about 5 micrometers and about 5 millimeters.

Flexible, insertable, transparent microelectrode arrays that allow integration of electrophysiological recordings with any optical imaging or stimulation technology are disclosed. In some embodiments of the disclosed technology, a microelectrode array includes a flexible substrate layer including a shank member extending in a first direction and a tapered tip at an end of the shank member, and a plurality of electrode wires arranged in the first direction on the flexible substrate layer, wherein the plurality of electrode wires includes adjacent electrode wires having different lengths from each other such that an electrode wire arranged closer to a centerline of the flexible substrate layer is longer than an adjacent electrode arranged further away from the centerline of the flexible substrate.

Degradation of reliability of a thermal fluid flow sensor, caused by generation of a crack in an insulating film is prevented in the thermal fluid flow sensor including a detection section and a circuit section formed on the same substrate when stress adjustment is performed by forming a deep concave portion in an interlayer insulating film in the detection section and forming the insulating film having a tensile stress thereon. As a means thereof, stair-like step is provided in a side wall of a concave portion, formed in the interlayer insulating film on a diaphragm. Accordingly, each depth of a first concave portion and a second concave portion, which form the concave portion, is reduced, and coatability of the insulating film for the stress adjustment, which covers a side wall and a bottom face of the concave portion, is improved.

Example implementations relate to coagulation sensing. For example, a microfluidic chip for coagulation sensing may include a microfluidic channel, an outlet at an end of the microfluidic channel having an air interface, and an impedance sensor located within the microfluidic channel and within a particular proximity to the air interface, the impedance sensor to determine a stage of a coagulation cascade of a blood sample flowing through the microfluidic channel to the impedance sensor.