C03C15/00

Glass article and method for producing the same

A method for producing a glass article is provided. The method for producing a glass article, the method including preparing a glass to be processed, the glass comprising a glass bulk and a low-refractive surface layer disposed on the glass bulk, and etching away the low-refractive surface layer to form an etched glass, wherein the etching away the low-refractive surface layer comprises: cleaning the low-refractive surface layer with an acid solution; and cleaning the low-refractive surface layer with a base solution after the cleaning it with the acid solution.

ANTI-GLARE SUBSTRATE FOR A DISPLAY ARTICLE WITH A TEXTURED REGION INCLUDING ONE OR MORE SURFACES AT TWO, THREE, OR FOUR ELEVATIONS, AND SURFACES FEATURES PROVIDING AT LEAST A PORTION OF THE ONE OR MORE SURFACES, AND METHOD OF MAKING THE SAME

A substrate for a display article is described herein including (a) a primary surface; and (b) a textured region disposed at the primary surface, the textured region comprising: (i) one or more higher surfaces residing at a higher mean elevation parallel to a base-plane disposed below the textured region extending through the substrate; (ii) one or more lower surfaces residing at a lower mean elevation parallel to the base-plane; and (iii) surface features providing at a least a portion of either or both of (i) the one or more higher surfaces and (ii) the one or more lower surfaces. The surface features can include larger surface features and smaller surface features, either or both providing one or more surfaces of the substrate that reside at one or more intermediate mean elevations parallel to the base-plane between the higher mean elevation and the lower mean elevation.

GLASS WITH MODIFIED SURFACE REGIONS AND METHODS AND APPARATUSES FOR FORMING THE SAME VIA ELECTRO-THERMAL POLING AND FIELD-ASSISTED ION EXCHANGE

A glass substrate with modified surface regions is disclosed. The glass substrate includes an alkali-containing bulk, a first alkali-depleted region, a second alkali-depleted region, and a first ion-exchanged region. The alkali-containing bulk has a first surface and a second surface with the first and second surfaces on opposite sides. The first alkali-depleted region extends into the alkali-containing bulk from the first surface. The second alkali-depleted region extends into the alkali-containing bulk from the second surface. The first ion-exchanged region extends into the alkali-containing bulk from the first surface. The first alkali-depleted region, the second alkali-depleted region, and the first ion-exchanged region each have a substantially homogenous composition. A method of forming the glass substrate is disclosed. The method includes simultaneously forming the first alkali-depleted region and the first ion-exchanged region in the first surface. The method also includes near-simultaneously forming the second alkali-depleted region in the second surface.

Patterned glass articles and methods of making the same

A patterned article that includes: an alkali silicate glass substrate comprising a thickness and a primary surface, the substrate having a bulk composition; a patterned region defined by at least a portion of the primary surface; and a compressive stress region that extends from the at least a portion of the primary surface to a first depth within the substrate. The patterned region comprises a surface roughness (Ra) from about 1 nm to about 600 nm and at least one of a plurality of protrusions and a plurality of depressions. Further, each of the compressive stress region and the patterned region comprises a concentration of at least one alkali metal ion that is different than the concentration of the at least one alkali metal ion in the bulk composition.

FABRICATION OF WAVEGUIDE STRUCTURES
20230221491 · 2023-07-13 · ·

A method of fabricating a waveguide structure to form a solid-core waveguide from a waveguiding layer may include etching a fluid channel into the waveguiding layer, etching a first air-gap and a second air gap into the waveguiding layer, wherein etching the first and the second air-gaps creates a solid-core waveguide in the waveguiding layer between the first air-gap and the second air-gap. A method for fabricating a waveguide structure to form a solid-core waveguide may include forming a first trench, a second trench, and a third trench in a substrate layer, and depositing a waveguiding layer on the machined substrate layer, wherein depositing the waveguiding layer creates a hollow core of a fluid channel in a location corresponding to the first trench, and a solid-core waveguide portion in the waveguiding layer in a location corresponding to an area between the second trench and the third trench.

FABRICATION OF WAVEGUIDE STRUCTURES
20230221491 · 2023-07-13 · ·

A method of fabricating a waveguide structure to form a solid-core waveguide from a waveguiding layer may include etching a fluid channel into the waveguiding layer, etching a first air-gap and a second air gap into the waveguiding layer, wherein etching the first and the second air-gaps creates a solid-core waveguide in the waveguiding layer between the first air-gap and the second air-gap. A method for fabricating a waveguide structure to form a solid-core waveguide may include forming a first trench, a second trench, and a third trench in a substrate layer, and depositing a waveguiding layer on the machined substrate layer, wherein depositing the waveguiding layer creates a hollow core of a fluid channel in a location corresponding to the first trench, and a solid-core waveguide portion in the waveguiding layer in a location corresponding to an area between the second trench and the third trench.

THROUGH-GLASS VIA-HOLE FORMATION METHOD

A through-glass via-hole formation method includes: forming a hole-shaped deformed region extending in a thickness direction of a glass substrate by irradiating the glass substrate with a laser beam at an energy intensity not exceeding an ablation threshold of the glass substrate; and forming a via-hole through the glass substrate along the deformed region by immersing the glass substrate in an etching solution such that the deformed region is etched and removed, wherein an etching solution having a first concentration is used as the etching solution to allow the via-hole to have a first aspect ratio, and an etching solution having a second concentration greater than the first concentration is used as the etching solution to allow the via-hole to have a second aspect ratio smaller than the first aspect ratio.

THROUGH-GLASS VIA-HOLE FORMATION METHOD

A through-glass via-hole formation method includes: forming a hole-shaped deformed region extending in a thickness direction of a glass substrate by irradiating the glass substrate with a laser beam at an energy intensity not exceeding an ablation threshold of the glass substrate; and forming a via-hole through the glass substrate along the deformed region by immersing the glass substrate in an etching solution such that the deformed region is etched and removed, wherein an etching solution having a first concentration is used as the etching solution to allow the via-hole to have a first aspect ratio, and an etching solution having a second concentration greater than the first concentration is used as the etching solution to allow the via-hole to have a second aspect ratio smaller than the first aspect ratio.

GLASS ELECTROCHEMICAL SENSOR WITH WAFER LEVEL STACKING AND THROUGH GLASS VIA (TGV) INTERCONNECTS

A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.

GLASS ELECTROCHEMICAL SENSOR WITH WAFER LEVEL STACKING AND THROUGH GLASS VIA (TGV) INTERCONNECTS

A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.