A method for producing a cavity in a substrate composed of hard brittle material is provided. A laser beam of an ultrashort pulse laser is directed a side surface of the substrate and is concentrated by a focusing optical unit to form an elongated focus in the substrate. Incident energy of the laser beam produces a filament-shaped flaw in a volume of the substrate. The filament-shaped flaw extends into the volume to a predetermined depth and does not pass through the substrate. To produce the filament-shaped flaw, the ultrashort pulse laser radiates in a pulse or a pulse packet having at least two successive laser pulses. After at least two filament-shaped flaws are introduced, the substrate is exposed to an etching medium which removes material of the substrate and widens the at least two filament-shaped flaws to form filaments. At least two filaments are connected to form a cavity.

A rear cover of an electronic device is provided. The rear cover includes a glass substrate including a first face facing a first direction, a second face facing a second direction opposite to the first direction, and at least one side face disposed between the first face and the second face, a roughness layer formed on the first face and having a first roughness, a hairline pattern formed on the roughness layer and having a second roughness, and a hard coating layer formed on the roughness layer and the hairline pattern.

Provided is a silica glass disc in which the deformation amount thereof in heat treatment is minimized, and the surface area of a silica glass surface can be increased. There is provided a silica glass disc, including a dimple forming area in which a large number of dimples are formed on at least one of a front surface or a back surface of a silica glass body, and the dimples in the dimple forming area are regularly formed. It is preferred that the dimples be formed by a laser.

Provided is a silica glass disc in which the deformation amount thereof in heat treatment is minimized, and the surface area of a silica glass surface can be increased. There is provided a silica glass disc, including a dimple forming area in which a large number of dimples are formed on at least one of a front surface or a back surface of a silica glass body, and the dimples in the dimple forming area are regularly formed. It is preferred that the dimples be formed by a laser.

Disclosed is a method for manufacturing ultra-thin glass. The method includes: patterning, on a mother glass substrate comprising a plurality of display cells and a dummy area surrounding the display cells, a cutting line having a shape corresponding to the display cells; forming a mother glass protective film on the mother glass substrate; forming a through-hole which corresponds to the cutting line by etching the mother glass substrate; and cutting bridges which are formed by the mother glass substrate and connect the through-holes.

Apparatuses and methods for glass laminates having a controlled coefficient of thermal expansion are disclosed. In C one embodiment, a glass laminate includes a glass core having a core thickness (T.sub.core) and a core coefficient of thermal expansion (CTE.sub.core), a first glass cladding layer and a second glass cladding layer. The first glass cladding layer and the second glass cladding layer are arranged such that the glass core is disposed between the first glass cladding layer and the second glass cladding layer. The first glass cladding layer has a first cladding thickness (T.sub.clad1) and a first clad coefficient of thermal expansion (CTE.sub.clad1), and the second glass cladding layer has a second cladding thickness (T.sub.clad2) and a second clad coefficient of thermal expansion (CTE.sub.clad2). The glass laminate has a laminate coefficient of thermal expansion (CTE.sub.L) within a range of about 35×10.sup.−7/° C. to about 90×10.sup.−7/° C., the laminate coefficient of thermal expansion (CTE.sub.L) defined by: CTE.sub.L=((CTE.sub.core×T.sub.core)+(CTE.sub.clad1×T.sub.clad1)+(CTE.sub.clad2× T.sub.clad2))/(T.sub.core+T.sub.clad1+T.sub.clad2).

Apparatuses and methods for glass laminates having a controlled coefficient of thermal expansion are disclosed. In C one embodiment, a glass laminate includes a glass core having a core thickness (T.sub.core) and a core coefficient of thermal expansion (CTE.sub.core), a first glass cladding layer and a second glass cladding layer. The first glass cladding layer and the second glass cladding layer are arranged such that the glass core is disposed between the first glass cladding layer and the second glass cladding layer. The first glass cladding layer has a first cladding thickness (T.sub.clad1) and a first clad coefficient of thermal expansion (CTE.sub.clad1), and the second glass cladding layer has a second cladding thickness (T.sub.clad2) and a second clad coefficient of thermal expansion (CTE.sub.clad2). The glass laminate has a laminate coefficient of thermal expansion (CTE.sub.L) within a range of about 35×10.sup.−7/° C. to about 90×10.sup.−7/° C., the laminate coefficient of thermal expansion (CTE.sub.L) defined by: CTE.sub.L=((CTE.sub.core×T.sub.core)+(CTE.sub.clad1×T.sub.clad1)+(CTE.sub.clad2× T.sub.clad2))/(T.sub.core+T.sub.clad1+T.sub.clad2).

The disclosure provides textured glass components as well as electronic device cover assemblies and enclosures which include the textured glass components. In some cases, a protruding portion of the glass component includes a textured region provided over a camera assembly of the electronic device. One or more openings may be provided in the textured region. The textured region may be configured to provide a translucent or hazy appearance to the electronic device while providing a desirable “feel” to the electronic device and level of cleanability.

The disclosure provides textured glass components as well as electronic device cover assemblies and enclosures which include the textured glass components. In some cases, a protruding portion of the glass component includes a textured region provided over a camera assembly of the electronic device. One or more openings may be provided in the textured region. The textured region may be configured to provide a translucent or hazy appearance to the electronic device while providing a desirable “feel” to the electronic device and level of cleanability.

A method of production of glass reaction vessels includes irradiating a laser beam of a wavelength for which a first glass plate is transparent onto the surface of the first glass plate. The first hiss plate is etched. Etching of the first glass plate is terminated when the recesses extend, over only a portion of the thickness of the first glass plate and therefore the recesses have a bottom formed in the first glass plate as a single piece.