A filler that can suppress thermal expansion of a glass composition with a small amount thereof added and is also excellent in terms of flowability when the glass composition is melted, and a glass composition containing the filler are provided. There is also provided a process for producing a hexagonal phosphate-based compound that can be suitably used as the filler using a simple, industrially advantageous method. The filler of the present invention contains a hexagonal phosphate-based compound that has a purity of 90% or higher and is represented by the following Formula 1, the filler having a content of an ionic compound that is no greater than 1.0 wt %,
K.sub.aZr.sub.b(PO.sub.4).sub.3(1) wherein, in Formula 1, a is a positive number of from 0.8 to 1.2 and b is a positive number satisfying a+4b=9.

A composition is for the manufacture of glass solders for high-temperature applications up to temperatures of approximately 1000 C., which composition, having no ZrO.sub.2, has SiO.sub.2 at a proportion in the range from 48 mol-% to 62 mol %, Al.sub.2O.sub.3 at a proportion in the range from 0.5 mol % to 6 mol %, B.sub.2O.sub.3 at a proportion in the range 4 mol % to 12 mol %, BaO at a proportion in the range 12 mol % to 30 mol %, and either CaO at a proportion in the range from 2.5 mol % to 15 mol %, or an R.sub.2O.sub.3 at a proportion in the range 0.5 mol % to 20 mol % where the R.sub.2O.sub.3 is selected from La.sub.2O.sub.3, Y.sub.2O.sub.3, Sc.sub.2O.sub.3, and from a further oxide of a chemical element from the series of lanthanoids, wherein the SiO.sub.2:BaO ratio is in the range from 1.9 to 4.

The sodium-resistant joining glass (1) is substantially free of ZrO.sub.2 and is based on a SiO.sub.2B.sub.2O.sub.3Na.sub.2OAl.sub.2O.sub.3 glass system. It is suitable for producing a joint of a metal and/or ceramic component with a further joining component (2, 3, 4) using the joining glass (1). Feedthrough-devices (20) using the joining glass (1) as fixing material are also disclosed.

A solid electrolyte including an alkali metal element, phosphorous, sulfur and halogen as constituent components.

A seal composition includes a first alkaline earth metal oxide, a second alkaline earth metal oxide which is different from the first alkaline earth metal oxide, aluminum oxide, and silica in an amount such that molar percent of silica in the composition is at least five molar percent greater than two times a combined molar percent of the first alkaline earth metal oxide and the second alkaline earth metal oxide. The composition is substantially free of phosphorus oxide. The seal composition forms a glass ceramic seal which includes silica containing glass cores located in a crystalline matrix comprising barium aluminosilicate, and calcium aluminosilicate crystals located in the glass cores.

A feed-through element for harsh environments is provided that includes a support body with at least one access opening, in which at least one functional element is arranged in an electrically insulating fixing material. The electrically insulating fixing material contains a glass or a glass ceramic with a volume resistivity of greater than 1.010.sup.10 cm at the temperature of 350 C. The glass or a glass ceramic has a defined composition range in the system SiO.sub.2B.sub.2O.sub.3-MO.

A composition for forming an electrode includes a conductive powder, a glass frit, an organic vehicle, and a burn-out retardant. The burn-out retardant exhibits a residual carbon of greater than or equal to about 1 wt % at a temperature of about 600 C. based on the initial amount of 100 wt % and an exothermic peak at about 200 C. to about 500 C.

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.