A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

A conductive paste contains at least a conductive powder, glass frit, and an organic vehicle. The conductive powder contains a noble metal powder such as an Ag powder and a base metal powder containing Cu and/or Ni, and the base metal powder has a specific surface area of less than 0.5 m.sup.2/g. The content of the base metal powder with respect to the total amount of the conductive powder is, in ratio by weight, 0.1 to 0.3 when the base metal powder contains Cu as its main constituent, 0.1 to 0.2 when the base metal powder contains Ni as its main constituent, and 0.1 to 0.25 when the base metal powder contains a mixed powder of Cu and Ni as its main constituent.

A glass composition formed of a glass frit including P.sub.2O.sub.5, SiO.sub.2, B.sub.2O.sub.3, Al.sub.2O.sub.3, ZrO.sub.2 and group I-based oxide, wherein P.sub.2O.sub.5 is contained in an amount of 20 wt % to 40 wt % based on a total weight of the glass frit, SiO.sub.2 is contained in an amount of to wt % to 30 wt % based on the total weight of the glass frit, B.sub.2O.sub.3 is contained in an amount of 3 wt % to 20 wt % based on the total weight of the glass frit, Al.sub.2O.sub.3 is contained in an amount of 7 to 24 wt % based on the total weight of the glass frit, ZrO.sub.2 is contained in an amount of 1 wt % to 7 wt % based on the total weight of the glass frit, and the group I-based oxide is contained in an amount of 7 wt % to 28 wt % based on the total weight of the glass frit.

A glass composition formed of glass frit including P.sub.2O.sub.5, TiO.sub.2 and group I-based oxide, wherein P.sub.2O.sub.5 is contained in an amount of 20 wt % to 30 wt % based on a total weight of the glass frit, wherein TiO.sub.2 is contained in an amount of 10 wt % to 20 wt % based on the total weight of the glass frit, and wherein the group I-based oxide is contained in an amount of 15 wt % to 30 wt % based on the total weight of the glass frit.

A conductive paste contains at least a conductive powder, glass frit, and an organic vehicle. The conductive powder is a mixed powder of an atomized powder prepared by an atomization method and a wet reduced powder prepared by a wet reduction method and the conductive powder contains the atomized powder in the range of 5 to 40 wt %. The atomized powder is 5.2 to 9 m in average particle size and the content of a chlorine component mixed in the conductive powder is 42 ppm or less. The conductive paste is applied in the form of a line onto a glass substrate 1 and subjected to firing to form conductive films. This conductive paste can prevent glass substrates from undergoing color changes and prevent base layers for conductive films from having structural defects such as cracks.

A vanadium-based glass material for local heat sealing has a glass composition containing, in terms of mol %, 30.0 to 60.0% V.sub.2O.sub.5, 20.1 to 30.0% ZnO, 10.0 to 25.0% TeO.sub.2, 1.0 to 5.0% Al.sub.2O.sub.3, 0.5 to 5.0% Nb.sub.2O.sub.5, 0 to 10.0% BaO, 0 to 5.0% Fe.sub.2O.sub.3, 0 to 5.0% MnO.sub.2, 0 to 5.0% CuO, 0 to 5.0% SiO.sub.2, and 0 to 8.0% CaO, and substantially not containing Pb and P.

A method of producing a hermetic package includes forming a first sealing material layer on a first glass substrate, and arranging a frame body having an opening on its top so that a bottom portion of the frame body and the first sealing material layer are in contact, followed by sealing the frame body and the first glass substrate with each other via the first sealing material layer. The method further includes forming a second sealing material layer on an upper edge portion of the frame body, housing, in the frame body, a member, and arranging a second glass substrate to be in contact with the second sealing material layer, followed by sealing the second glass substrate and the frame body with each other via the second sealing material layer by irradiating the second sealing material layer with laser light from a second glass substrate side.

A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

A photosensitive insulating paste contains glass frit, a first inorganic filler, a second inorganic filler, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent. The glass frit contains SiO.sub.2 and B.sub.2O.sub.3 as a base component and contains at least one of the aluminum element, sodium element, or phosphorus element as a minor component. The first inorganic filler is a silicon oxide having crystallinity, and the second inorganic filler contains at least one of alumina, titania, zirconia, ceria, forsterite, or an inorganic oxide pigment. The photosensitive insulating paste contains the first inorganic filler in an amount of from 10% by volume to 40% by volume and the second inorganic filler in an amount of from 0% by volume to 30% by volume, with the total of the glass frit, the first inorganic filler, and the second inorganic filler being 100% by volume.