Provided are a vacuum heat insulating member which includes: a first substrate; a second substrate; and a sealing part disposed between the first substrate and the second substrate, in which an internal space is formed by surrounding by the first substrate, the second substrate and the sealing part, and in which the sealing part includes a glass phase and a metal phase, the metal phase being disposed on a side of the internal space of the glass phase. Thus, in the vacuum heat insulating member, an amount of a gas released from the glass phase to the internal space can be decreased and a high heat insulating property can be kept.

An antimony-free glass suitable for use in a frit for producing a hermetically sealed glass package is described. The hermetically sealed glass package, such as an OLED display device, is manufactured by providing a first glass substrate plate and a second glass substrate plate and depositing the antimony-free frit onto the first substrate plate. OLEDs may be deposited on the second glass substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first glass substrate plate to the second glass substrate plate and also protects the OLEDs. The antimony-free glass has excellent aqueous durability, good flow, low glass transition temperature and low coefficient of thermal expansion.

An inkjet ink for a glass substrate can enable formation of an aesthetic image with high concealability on the surface of the glass substrate. The inkjet ink disclosed here can include: an inorganic solid including an inorganic pigment that develops a color except for black and a glass frit; a monomer component having a photocuring property; and a photoinitiator. In the inkjet ink, a volume ratio of the inorganic solid in a case where an ink total volume is 100 volume % can be 35 volume % or less, a volume ratio of the inorganic pigment in the case where a total volume of the inorganic solid is 100 volume % can be 15 volume % or more and less than 90 volume %, and a volume ratio of the inorganic pigment to the photoinitiator can be 11 times or less.

A multilayer electronic component may include a multilayer body including a plurality of magnetic material layers, and an internal electrode disposed in the multilayer body. The internal electrode may contain a conductive metal and glass, and the glass contains a vanadium (V) oxide. Also, a conductive paste composition for an internal electrode includes a conductive metal and glass, wherein the glass contains a vanadium (V) oxide.

A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

A conductive paste contains at least a conductive powder, glass frit, and an organic vehicle. The conductive powder is a mixed powder of an atomized powder prepared by an atomization method and a wet reduced powder prepared by a wet reduction method and the conductive powder contains the atomized powder in the range of 5 to 40 wt %. The atomized powder is 5.2 to 9 m in average particle size and the content of a chlorine component mixed in the conductive powder is 42 ppm or less. The conductive paste is applied in the form of a line onto a glass substrate 1 and subjected to firing to form conductive films. This conductive paste can prevent glass substrates from undergoing color changes and prevent base layers for conductive films from having structural defects such as cracks.

Provided is a glass composition for protecting a semiconductor junction which contains at least SiO.sub.2, B.sub.2O.sub.3, Al.sub.2O.sub.3, ZnO and at least two oxides of alkaline earth metals selected from a group consisting of CaO, MgO and BaO, and substantially contains none of Pb, As, Sb, Li, Na and K, wherein an average linear expansion coefficient within a temperature range of 50 C. to 550 C. falls within a range of 3.3310.sup.6 to 4.1310.sup.6. A semiconductor device having high breakdown strength can be manufactured using such a glass material containing no lead in the same manner as a conventional case where a glass material containing lead silicate as a main component is used.

According to one embodiment, a glass may include from about 50 mol. % to about 70 mol. % SiO.sub.2; from about 12 mol. % to about 35 mol. % B.sub.2O.sub.3; from about 4 mol. % to about 12 mol. % Al.sub.2O.sub.3; greater than 0 mol. % and less than or equal to 1 mol. % alkali metal oxide, wherein Li.sub.2O is greater than or equal to about 20% of the alkali metal oxide; from about 0.3 mol. % to about 0.7 mol. % of Na.sub.2O or Li.sub.2O; and greater than 0 mol. % and less than 12 mol. % of total divalent oxide, wherein the total divalent oxide includes at least one of CaO, MgO and SrO, and wherein a ratio of Li.sub.2O (mol. %) to (Li.sub.2O (mol. %) +(Na.sub.2O (mol. %)) is greater than or equal 0.4 and less than or equal to 0.6. The glass may have a relatively low high temperature resistivity and a relatively high low temperature resistivity.

Coated glass or glass ceramic substrates having high temperature resistance, high strength, and a low coefficient of thermal expansion. The coating includes pores, is fluid-tight and suitable for coating a temperature-resistant, high-strength glass or glass ceramic substrate with a low coefficient of thermal expansion, and to a method for producing such a coated substrate.

This disclosure concerns a method of decorating a glass substrate having a coating, the method comprising: applying a paste onto at least a portion of the coating in a desired pattern; drying the paste to form a dried paste in the desired pattern; and firing the dried paste to form an enamel in the desired pattern, the enamel being directly bonded to the glass substrate by dissolution of the portion of the coating to which the paste is applied during the firing step. The paste comprises a solids portion dispersed in a dispersion medium, the solids portion including a composition comprising: 10 to 40 mol % ZnO; 20 to 40 mol % B.sub.2O.sub.3; 25 to 65 mol % Bi.sub.2O.sub.3, TeO.sub.2, or PbO, or mixtures thereof; and to 15 mol % Al.sub.2O.sub.3.