Patent classifications
C03C2207/00
ALL-ALUMINUM BACK SURFACE FIELD ALUMINUM PASTE FOR CRYSTALLINE SILICON SOLAR CELL AND PREPARATION METHOD THEREOF
The invention discloses an all-aluminum back surface field aluminum paste for a crystalline silicon solar cell and a preparation method thereof. The all-aluminum back surface field paste mainly comprises 60-70% aluminum powder, 5-10% nanometer metal oily solution, 1-10% inorganic binder, 10-20% organic binder, 5-30% organic solvent and 1-5% accessory ingredient. According to the aluminum paste prepared by the present invention, the back surface preparing process of an all-aluminum back surface field can be implemented preferably; moreover, the paste has great adhesive force, is easy to be better adhered to silver paste printed afterwards; meanwhile, the paste can be in good contact with a silicon chip through the nanometer metal oily solution added into the paste, the aluminum back surface is prevented from falling off, and good ohm contact can be formed, so that the photoelectric conversion efficiency is increased, and the economic benefits of enterprises are increased.
ORGANIC VEHICLE FOR ELECTROCONDUCTIVE PASTE
An organic vehicle comprising at least about 0.5 wt % and no more than about 45 wt % of at least one of a natural essential oil, based upon 100% total weight of the organic vehicle, at least about 0.5 wt % and no more than about 10 wt % of at least one resin, an organic solvent, and a thixotropic agent is provided. The invention also provides a solar cell and a method of forming a solar cell with the electroconductive paste of the invention.
RED AND RED-SHADE VIOLET INORGANIC OXIDE MATERIALS CONTAINING COBALT
The current technology is directed to red and red-shade violet pigments with an hexagonal ABO.sub.3 structure of the form Y(In, M)O.sub.3 in which M is substituted for In in the trigonal bipyramidal B site of the ABO.sub.3 structure, and where M is a mixture containing Co.sup.2+ and charge compensating ions, or M is a mixture containing Co.sup.2+ and charge compensating ions, as well as other aliovalent and isovalent ions.
ELECTRONICALLY CONDUCTIVE ENAMEL COMPOSITION
A description is given of an electronically conductive enamel composition, more particularly for anti-corrosion coatings.
PASTE COMPOSITION FOR FORMING SOLAR CELL FRONT ELECTRODE, N-TYPE SOLAR CELL FRONT ELECTRODE FORMED BY USING THE COMPOSITION, AND SOLAR CELL INCLUDING THE FRONT ELECTRODE
The present invention relates to a paste composition for forming a solar cell front electrode, a solar cell front electrode formed by using the composition, and a solar cell including the front electrode.
Specifically, the paste composition includes conductive powder; an inorganic additive; and an organic vehicle, wherein the conductive powder is a metal powder including a mixture of silver (Ag) powder and aluminum (Al) powder, and the inorganic additive includes a lead (Pb)-zinc (Zn)-boron (B)-silicon (Si)-tungsten (W)-based glass frit.
MULTILAYER ELECTRONIC COMPONENT AND CONDUCTIVE PASTE COMPOSITION FOR INTERNAL ELECTRODE
A multilayer electronic component may include a multilayer body including a plurality of magnetic material layers, and an internal electrode disposed in the multilayer body. The internal electrode may contain a conductive metal and glass, and the glass contains a vanadium (V) oxide. Al a conductive paste composition for an internal electrode includes a conductive metal and glass, wherein the glass contains a vanadium (V) oxide.
CONDUCTIVE PASTE AND GLASS ARTICLE
A conductive paste contains at least a conductive powder, glass frit, and an organic vehicle. The conductive powder contains a noble metal powder such as an Ag powder and a base metal powder containing Cu and/or Ni, and the base metal powder has a specific surface area of less than 0.5 m.sup.2/g. The content of the base metal powder with respect to the total amount of the conductive powder is, in ratio by weight, 0.1 to 0.3 when the base metal powder contains Cu as its main constituent, 0.1 to 0.2 when the base metal powder contains Ni as its main constituent, and 0.1 to 0.25 when the base metal powder contains a mixed powder of Cu and Ni as its main constituent.
Sealed devices comprising transparent laser weld regions
Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.
ENAMEL PASTE COMPOSITIONS AND METHODS OF FORMING ENAMEL COATINGS USING SAID COMPOSITIONS
An enamel paste composition includes: glass frit; a pigment; an organic carrier medium; and an oxygen source material to facilitate clean removal of the organic carrier medium components during firing, wherein the oxygen source material includes a combination of: (i) a first oxygen source material which releases oxygen at a temperature of less than 350 C.; and (ii) a second oxygen source material which releases oxygen at a temperature of greater than 350 C. The first oxygen source material can be magnesium peroxide and the second oxygen source material can be barium peroxide. The enamel paste composition is utilized to form enamel coated products without requiring a pre-firing step.
Conductive Paste
A conductive paste is provided including a conductive material, glass frit and an organic vehicle. The glass frit includes V.sub.2O.sub.5, TeO.sub.2, Bi.sub.2O.sub.3, and Al.sub.2O.sub.3. V.sub.2O.sub.5 is present in an amount of from about 15 wt. % to about 30 wt. % based on the total weight of the glass frit. Articles containing the conductive paste and methods for using the conductive paste are also provided.