Borosilicate glasses are disclosed having (in weight %) 66-76% SiO.sub.2, 0-8% Al.sub.2O.sub.3, 10-18% B.sub.2O.sub.3, 0-4% Li.sub.2O, 0-12% Na.sub.2O, 0-12% K.sub.2O, 1-1.5% Ag, 1.5-2.5% Cl.sup. and 0.01-0.06% of a summed amount of CuO and NiO, wherein the glass composition is bleachable upon exposure to ultraviolet irradiation from a stable state color or shade to a lighter color or shade. Such reverse photochromic borosilicate glass compositions may be thermally darkenable. The borosilicate glasses may be strengthened via ion-exchange strengthening treatment. The borosilicate glasses may retain their reverse photochromic and thermally darkenable properties even after ion-exchange strengthening treatment.

A multilayer electronic component may include a multilayer body including a plurality of magnetic material layers, and an internal electrode disposed in the multilayer body. The internal electrode may contain a conductive metal and glass, and the glass contains a vanadium (V) oxide. Also, a conductive paste composition for an internal electrode includes a conductive metal and glass, wherein the glass contains a vanadium (V) oxide.

An antimony-free glass suitable for use in a frit for producing a hermetically sealed glass package is described. The hermetically sealed glass package, such as an OLED display device, is manufactured by providing a first glass substrate plate and a second glass substrate plate and depositing the antimony-free frit onto the first substrate plate. OLEDs may be deposited on the second glass substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first glass substrate plate to the second glass substrate plate and also protects the OLEDs. The antimony-free glass has excellent aqueous durability, good flow, low glass transition temperature and low coefficient of thermal expansion.

The invention relates to a process for manufacturing flat glass, comprising the following successive steps: (a) applying a layer of a glass frit to a glass textile, the glass of the frit and of the textile having essentially the same composition, (b) heating the glass textile bearing the layer of glass frit to a temperature T>T.sub.L20 C., T.sub.L being the Littleton temperature of the glass frit, for a sufficient length of time to convert the layer of frit into an enamel layer of the same composition as the glass textile, and (c) cooling the glass textile impregnated with the enamel or bearing an enamel layer, obtained in step (b), so as to obtain a glass sheet.

It also relates to a glass sheet capable of being obtained by this process.

A resin-sealed semiconductor device 10 of the present invention includes: a mesa-type semiconductor element 100 which includes a mesa-type semiconductor base body having a pn-junction exposure portion in an outer peripheral tapered region which surrounds a mesa region, and a glass layer which covers at least the outer peripheral tapered region; and a molding resin 40 which seals the mesa-type semiconductor element 100, wherein the mesa-type semiconductor element 100 includes a glass layer which substantially contains no Pb as the glass layer. The resin-sealed semiconductor device of the present invention can acquire higher resistance to a reverse bias at a high temperature than a conventional resin-sealed semiconductor device, although the resin-sealed semiconductor device of the present invention has the structure where the mesa-type semiconductor element is molded with a resin in the same manner as the conventional resin-sealed semiconductor device.

Provided is a composite powder, including 55 mass % to 95 mass % of glass powder, 5 mass % to 45 mass % of inorganic pigment powder, and 0 mass % to 20 mass % of refractory filler powder, in which the glass powder includes as a glass composition, in terms of mol %, 45% to 62% of SiO.sub.2, 0% to 10% of B.sub.2O.sub.3, 0% to 9% of Al.sub.2O.sub.3, 12% to 32% of ZnO, 12% to 28% of Li.sub.2O+Na.sub.2O+K.sub.2O, 0% to 10% of BaO, and 0% to 15% of TiO.sub.2+ZrO.sub.2.

A description is given of an electronically conductive enamel composition, more particularly for anti-corrosion coatings.

A method of making a vacuum insulating panel including a first substrate, a second substrate, a plurality of spacers provided in a gap between at least the first and second substrates, and a seal provided between at least the first and second substrates, the seal comprising a first seal layer, and optionally second and/or third primer layer(s). The method may include at least one of: (i) laser heating, using a laser beam from a laser, the first seal material for firing and/or sintering the first seal material to form the first seal layer, in a manner that causes TeO.sub.4>TeO.sub.3 in the first seal material to transform into TeO.sub.3>TeO.sub.4 due to said laser heating, whereby an amount of TeO.sub.4 decreases and an amount of TeO.sub.3 increases due to said laser heating, and/or (ii) laser heating in a manner that causes V.sub.2O.sub.5>VO.sub.2 in the first seal material to transform into VO.sub.2>V.sub.2O.sub.5 due to said laser heating whereby an amount of VO.sub.2 increases and an amount of V.sub.2O.sub.5 decreases due to said laser heating, so that after said laser heating the first seal layer comprises more VO.sub.2 than V.sub.2O.sub.5 by wt. %.

A method of making a vacuum insulating panel, the vacuum insulating panel comprising a first glass substrate, a second glass substrate, a plurality of spacers provided in a gap between at least the first and second glass substrates, and a seal provided between at least the first and second glass substrates, the seal comprising a first seal layer and/or a second seal layer. The method may include laser heating, using a laser beam from a continuous wave near-IR laser, seal material in order to form the first seal layer; wherein the laser heating may include causing the laser beam to move at a lateral speed of from about 5-70 mm/second relative to the substrates and the first seal material so that the laser beam at least partially passes through at least one of the glass substrates and impinges upon at least the second seal layer in order to heat the second seal layer and fire and/or sinter the first seal material thereby forming the first seal layer.

A method of making a vacuum insulating panel, the vacuum insulating panel including a first glass substrate, a second glass substrate, a plurality of spacers provided in a gap between at least the first and second glass substrates, and a seal provided between at least the first and second glass substrates, the seal comprising a first seal layer. The method may include: providing first seal material for the first seal layer in a location at least partially between at least the first and second glass substrates; laser heating, using a laser beam from a continuous wave near-IR laser, the first seal material in order to form the first seal layer; wherein said laser heating may comprise using the laser beam, having a size of from about 2-15 mm, so that the laser beam at least partially passes through at least one of the glass substrates to fire and/or sinter the first seal material thereby forming the first seal layer, in a manner so that the first seal layer a density of from about 2.8-4.0 g/cm.sup.3; and after forming the first seal layer, evacuating the gap to a pressure less than atmospheric pressure.