A resist composition including a resin component having a constitutional unit derived from a compound represented by General Formula (a0-1), in which R.sup.01 represents a hydrogen atom, L.sup.01 represents a divalent linking group, Ra.sup.01 and Ra.sup.02 each independently represent a hydrocarbon group which may have a substituent, Ar.sup.01 represents an aryl group in which some or all hydrogen atoms are substituted with iodine atoms, and the aryl group may have a substituent other than the iodine atoms

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Process for preparing 2,2-difluoroethylamine derivatives, wherein compounds of the general formula (IV) are reduced to the corresponding 2,2-difluoroethylamine derivatives of the general formula (III), where the A radical is as defined in the description: ##STR00001##

A polymer comprising recurring units derived from a polymerizable monomer having two structures of hydroxyphenyl methacrylate having a hydroxy group substituted with an acid labile group is used as base resin in a positive resist composition, especially chemically amplified positive resist composition. The resist composition forms a resist film which is processed by lithography into a pattern of good profile having a high resolution, minimal edge roughness, and etch resistance.

A polymer comprising recurring units derived from a polymerizable monomer having two structures of hydroxyphenyl methacrylate having a hydroxy group substituted with an acid labile group is used as base resin in a positive resist composition, especially chemically amplified positive resist composition. The resist composition forms a resist film which is processed by lithography into a pattern of good profile having a high resolution, minimal edge roughness, and etch resistance.

The present invention primarily relates to compounds of formula (I) as defined herein. It also relates to fragrance substance mixtures as defined herein and methods for producing the same and to perfumed products as defined herein and methods for producing the same. The present invention further relates to the use of a compound of formula (I) as defined herein as a precursor for the release of two or more different pleasantly smelling fragrance substances, to methods for the release of two or more different pleasantly smelling fragrance substances and to thiols as defined herein.

The present invention primarily relates to compounds of formula (I) as defined herein. It also relates to fragrance substance mixtures as defined herein and methods for producing the same and to perfumed products as defined herein and methods for producing the same. The present invention further relates to the use of a compound of formula (I) as defined herein as a precursor for the release of two or more different pleasantly smelling fragrance substances, to methods for the release of two or more different pleasantly smelling fragrance substances and to thiols as defined herein.

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin having a polarity that increases by an action of an acid, and (B) a compound that generates an acid upon irradiation with actinic rays or radiation, represented by a specific general formula, is which the resin (A) includes a repeating unit represented by a specific general formula; and an actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method, and a method for manufacturing an electronic device.

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin having a polarity that increases by an action of an acid, and (B) a compound that generates an acid upon irradiation with actinic rays or radiation, represented by a specific general formula, is which the resin (A) includes a repeating unit represented by a specific general formula; and an actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method, and a method for manufacturing an electronic device.

A radiation-sensitive resin composition includes: a first polymer including a structural unit including an acid-labile group; a second polymer including a structural unit represented by formula (1); and a radiation-sensitive acid generator. In the formula (1), A represents an oxygen atom or a sulfur atom; a sum of m and n is 2 or 3, wherein m is 1 or 2, and n is 1 or 2; X represents a single bond or a divalent organic group having 1 to 20 carbon atoms; and R.sup.1 represents a monovalent organic group including a fluorine atom. ##STR00001##

A radiation-sensitive resin composition includes: a first polymer including a structural unit including an acid-labile group; a second polymer including a structural unit represented by formula (1); and a radiation-sensitive acid generator. In the formula (1), A represents an oxygen atom or a sulfur atom; a sum of m and n is 2 or 3, wherein m is 1 or 2, and n is 1 or 2; X represents a single bond or a divalent organic group having 1 to 20 carbon atoms; and R.sup.1 represents a monovalent organic group including a fluorine atom. ##STR00001##