C08F24/00

FLUORORESIN, FLUORORESIN PARTICLES, AND METHODS FOR PRODUCING THESE

The present invention relates to resin particles including a residue unit represented by the following general formula (1) and having a volume average particle diameter equal to or more than 5 μm and equal to or less than 2000 μm, and a method for producing thereof. Furthermore the present invention relates to a fluororesin comprising a residue unit represented by a general formula (1) and having a weight average molecular weight Mw in a range of 5×10.sup.4 to 3×10.sup.5, and a yellow index of a heat-melted molded product (thickness 3 mm) after 24 h at 280° C. of equal to or less than 6, and a method for producing thereof.

##STR00001##

In the formula (1), Rf.sub.1, Rf.sub.2, Rf.sub.3, and Rf.sub.4 are each independently one of the groups consisting of a fluorine atom, a linear perfluoroalkyl group having 1 to 7 carbon atoms, a branched perfluoroalkyl group having 3 to 7 carbon atoms, or a cyclic perfluoroalkyl group having 3 to 7 carbon atoms. The perfluoroalkyl group may have an ethereal oxygen atom. Further, Rf.sub.1, Rf.sub.2, Rf.sub.3, and Rf.sub.4 may be linked to one another to form a ring having 4 or more and 8 or less carbon atoms, and the ring may include an ethereal oxygen atom.

FLUORORESIN, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING FLUORORESIN PARTICLES

The present invention relates to a fluororesin including a residue unit represented by a following general formula (1) and having a haze value equal to or less than 2% of a heat-press molded product (thickness 1 mm) with a small haze value of a melt-molded product and a method for producing the same.

##STR00001##

In the formula (1), Rf.sub.1, Rf.sub.2, Rf.sub.3 and Rf.sub.4 each independently represent one of the groups consisting of a fluorine atom, a linear perfluoroalkyl group having 1 to 7 carbon atoms, a branched perfluoroalkyl group having 3 to 7 carbon atoms, and a cyclic perfluoroalkyl group having 3 to 7 carbon atoms, the perfluoroalkyl group may have an ethereal oxygen atom, Rf.sub.1, Rf.sub.2, Rf.sub.3 and Rf.sub.4 may be linked to each other to form a ring having 4 or more and 8 or less carbon atoms, and the ring may include an ethereal oxygen atom. The present invention further relates to a method for producing fluororesin particles that each include a fluorine-containing aliphatic ring structure. The method comprises a precipitation step of lowering a solution temperature of a fluororesin (A) solution in which a fluororesin (A) including a fluorine-containing aliphatic ring structure is dissolved in a solvent (B), to precipitate particles of the fluororesin (A). The method is excelling in productivity and making it possible to remove foreign matter.

Fluororesin, fluororesin particles, and methods for producing these

The present invention relates to resin particles including a residue unit represented by the following general formula (1) and having a volume average particle diameter equal to or more than 5 μm and equal to or less than 2000 μm, and a method for producing thereof. Furthermore the present invention relates to a fluororesin comprising a residue unit represented by a general formula (1) and having a weight average molecular weight Mw in a range of 5×10.sup.4 to 3×10.sup.5, and a yellow index of a heat-melted molded product (thickness 3 mm) after 24 h at 280° C. of equal to or less than 6, and a method for producing thereof. ##STR00001## In the formula (1), Rf.sub.1, Rf.sub.2, Rf.sub.3, and Rf.sub.4 are each independently one of the groups consisting of a fluorine atom, a linear perfluoroalkyl group having 1 to 7 carbon atoms, a branched perfluoroalkyl group having 3 to 7 carbon atoms, or a cyclic perfluoroalkyl group having 3 to 7 carbon atoms. The perfluoroalkyl group may have an ethereal oxygen atom. Further, Rf.sub.1, Rf.sub.2, Rf.sub.3, and Rf.sub.4 may be linked to one another to form a ring having 4 or more and 8 or less carbon atoms, and the ring may include an ethereal oxygen atom.

Fluororesin, fluororesin particles, and methods for producing these

The present invention relates to resin particles including a residue unit represented by the following general formula (1) and having a volume average particle diameter equal to or more than 5 μm and equal to or less than 2000 μm, and a method for producing thereof. Furthermore the present invention relates to a fluororesin comprising a residue unit represented by a general formula (1) and having a weight average molecular weight Mw in a range of 5×10.sup.4 to 3×10.sup.5, and a yellow index of a heat-melted molded product (thickness 3 mm) after 24 h at 280° C. of equal to or less than 6, and a method for producing thereof. ##STR00001## In the formula (1), Rf.sub.1, Rf.sub.2, Rf.sub.3, and Rf.sub.4 are each independently one of the groups consisting of a fluorine atom, a linear perfluoroalkyl group having 1 to 7 carbon atoms, a branched perfluoroalkyl group having 3 to 7 carbon atoms, or a cyclic perfluoroalkyl group having 3 to 7 carbon atoms. The perfluoroalkyl group may have an ethereal oxygen atom. Further, Rf.sub.1, Rf.sub.2, Rf.sub.3, and Rf.sub.4 may be linked to one another to form a ring having 4 or more and 8 or less carbon atoms, and the ring may include an ethereal oxygen atom.

MECHANICALLY STIMULATED MECHANOPHORES, POLYMERS THEREOF, METHODS OF PREPARATION THEREOF, AND SYSTEMS THEREOF FOR CONTROLLED EMISSION OF SMALL MOLECULES
20230357459 · 2023-11-09 ·

Compounds of formula (I) are provided. Polymers including monomers of formula (II) are further provided. Methods of releasing controlled amounts of a small molecule from the polymers are further provided. Devices for releasing controlled amounts of a small molecule are further provided.

##STR00001##

MECHANICALLY STIMULATED MECHANOPHORES, POLYMERS THEREOF, METHODS OF PREPARATION THEREOF, AND SYSTEMS THEREOF FOR CONTROLLED EMISSION OF SMALL MOLECULES
20230357459 · 2023-11-09 ·

Compounds of formula (I) are provided. Polymers including monomers of formula (II) are further provided. Methods of releasing controlled amounts of a small molecule from the polymers are further provided. Devices for releasing controlled amounts of a small molecule are further provided.

##STR00001##

Protective film forming composition having an acetal structure

A protective film-forming composition which protects against a semiconductor wet etching solution, contains a solvent and a compound or polymer thereof containing at least one acetal structure in a molecule thereof, and forms a protective film exhibiting excellent resistance against a semiconductor wet etching solution during the lithographic process when producing semiconductors; a method for producing a resist pattern-equipped substrate which uses the protective film; and a method for producing a semiconductor device.

ANTENNA COVER BASE MATERIAL

An object of the present disclosure is to provide an antenna cover base material that is coated with a fluoropolymer-containing film and that has excellent durability of water sliding. The present disclosure pertains to an antenna cover base material coated with a fluoropolymer-containing film, the film having the properties of a water sliding velocity of 150 mm/s or more at an inclination angle of 30°, and an average surface roughness (Ra) of 1 μm or less.

ANTENNA COVER BASE MATERIAL

An object of the present disclosure is to provide an antenna cover base material that is coated with a fluoropolymer-containing film and that has excellent durability of water sliding. The present disclosure pertains to an antenna cover base material coated with a fluoropolymer-containing film, the film having the properties of a water sliding velocity of 150 mm/s or more at an inclination angle of 30°, and an average surface roughness (Ra) of 1 μm or less.

FILM AND SUBSTRATE HAVING SURFACE COVERED WITH SAME

An object of the present disclosure is to provide a film that has high water slidability, and a substrate having a surface covered with the film. The present disclosure provides a film having the properties of a sliding velocity of 150 mm/s or more at an inclination angle of 30° and an average surface roughness (Ra) of 1 μm or less, and further provides a substrate having a surface covered with the film.