Patent classifications
C08F38/00
MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND FOR FORMING ORGANIC FILM
An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate. The present invention provides a material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent,
##STR00001##
noting that in the general formula (1A), when W.sub.1 represents any of
##STR00002##
R.sub.1 does not represent any of
##STR00003##
MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND FOR FORMING ORGANIC FILM
An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate, and a material for forming an organic film containing the compound. A material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A); and (B) an organic solvent,
##STR00001## noting that in the general formula (1B), when W.sub.1 represents
##STR00002##
R.sub.1 does not represent any of
##STR00003##
POLYDIFLUOROACETYLENE, METHOD FOR PRODUCING POLYDIFLUOROACETYLENE, PRECURSOR POLYMER, MOLDED ARTICLE AND POWDER
A polydifluoroacetylene containing a CC bond and a CF bond, the polydifluoroacetylene having a solubility of 0.2 g/10 g or less in dimethylformamide (DMF) at 25 C. Also disclosed is a method for producing the polydifluoroacetylene, a precursor polymer for providing the polydifluoroacetylene, a molded article including the polydifluoroacetylene and a polydifluoroacetylene powder.
CYCLIC POLYOLEFINS DERIVED FROM HEXYNE, OCTYNE, NONYNE, PENTADECYNE AND THEIR COPOLYMERS WITH ACETYLENE
Disclosed are saturated cyclic monopolymers derived from hexyne, octyne, nonyne, pentadecyne and saturated cyclic copolymers derived from acetylene and a second alkyne monomer that is hexyne, octyne, nonyne, or pentadecyne.
CYCLIC POLYOLEFINS DERIVED FROM HEXYNE, OCTYNE, NONYNE, PENTADECYNE AND THEIR COPOLYMERS WITH ACETYLENE
Disclosed are saturated cyclic monopolymers derived from hexyne, octyne, nonyne, pentadecyne and saturated cyclic copolymers derived from acetylene and a second alkyne monomer that is hexyne, octyne, nonyne, or pentadecyne.
Compound, method for manufacturing the compound, and composition for forming organic film
A compound includes two or more structures shown by the following general formula (1-1) in the molecule, ##STR00001##
Ar represents an aromatic ring or one that contains at least one nitrogen atom and/or sulfur atom optionally having a substituent, and two Ars are optionally bonded with each other to form a ring structure; the broken line represents a bond with Y; Y represents a divalent or trivalent organic group having 6 to 30 carbon atoms that contains an aromatic ring or a heteroaromatic ring optionally having a substituent, the bonds of which are located in a structure of the aromatic ring or the heteroaromatic ring; R represents a hydrogen atom or a monovalent group having 1 to 68 carbon atoms. This compound can be cured even in an inert gas not only in air atmosphere without forming byproducts, and can form an organic under layer film.
Compound, method for manufacturing the compound, and composition for forming organic film
A compound includes two or more structures shown by the following general formula (1-1) in the molecule, ##STR00001##
Ar represents an aromatic ring or one that contains at least one nitrogen atom and/or sulfur atom optionally having a substituent, and two Ars are optionally bonded with each other to form a ring structure; the broken line represents a bond with Y; Y represents a divalent or trivalent organic group having 6 to 30 carbon atoms that contains an aromatic ring or a heteroaromatic ring optionally having a substituent, the bonds of which are located in a structure of the aromatic ring or the heteroaromatic ring; R represents a hydrogen atom or a monovalent group having 1 to 68 carbon atoms. This compound can be cured even in an inert gas not only in air atmosphere without forming byproducts, and can form an organic under layer film.
COMPOUND, METHOD FOR MANUFACTURING THE COMPOUND, AND COMPOSITION FOR FORMING ORGANIC FILM
A compound includes two or more structures shown by the following general formula (1-1) in the molecule,
##STR00001##
Ar represents an aromatic ring or one that contains at least one nitrogen atom and/or sulfur atom optionally having a substituent, and two Ars are optionally bonded with each other to form a ring structure; the broken line represents a bond with Y; Y represents a divalent or trivalent organic group having 6 to 30 carbon atoms that contains an aromatic ring or a heteroaromatic ring optionally having a substituent, the bonds of which are located in a structure of the aromatic ring or the heteroaromatic ring; R represents a hydrogen atom or a monovalent group having 1 to 68 carbon atoms. This compound can be cured even in an inert gas not only in air atmosphere without forming byproducts, and can form an organic under layer film.
COMPOUND, METHOD FOR MANUFACTURING THE COMPOUND, AND COMPOSITION FOR FORMING ORGANIC FILM
A compound includes two or more structures shown by the following general formula (1-1) in the molecule,
##STR00001##
Ar represents an aromatic ring or one that contains at least one nitrogen atom and/or sulfur atom optionally having a substituent, and two Ars are optionally bonded with each other to form a ring structure; the broken line represents a bond with Y; Y represents a divalent or trivalent organic group having 6 to 30 carbon atoms that contains an aromatic ring or a heteroaromatic ring optionally having a substituent, the bonds of which are located in a structure of the aromatic ring or the heteroaromatic ring; R represents a hydrogen atom or a monovalent group having 1 to 68 carbon atoms. This compound can be cured even in an inert gas not only in air atmosphere without forming byproducts, and can form an organic under layer film.
Hydrochromic polydiacetylene composite composition, hydrochromic thin film using same, and use thereof
The present invention relates to a hydrochromic polydiacetylene composite composition, a hydrochromic thin film using same, and a use thereof, and more specifically, to a hydrochromic polydiacetylene composite composition reacting sensitively to moisture, providing the hydrochromic thin film using same, and to applying same to biorecognition or fingerprint recognition. According to the present invention, moisture secreted from a fingerprint or pores on the skin can be detected with high sensitivity. Thus, the position of pores unique to a fingerprint of an organism can be amplified and displayed through selective color change and fluorescent change patterns exhibited when moisture is absorbed.