This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

Urethane/urea-containing bis(alkenyl) ethers can be incorporated into the backbone of polythioether prepolymers and can be used as curing agents in thiol-terminated polythioether prepolymer compositions. Cured sealants prepared using compositions containing urethane/urea-containing bis(alkenyl) ether-containing polythioether prepolymers and/or urethane/urea-containing bis(alkenyl) ether curing agents exhibit improved physical properties suitable for use in aerospace sealant applications.

Provided is a liquid crosslinking agent in which liquid life (pot life) as an undiluted solution is sufficiently long and excellent coating properties are exhibited when used. A liquid crosslinking agent containing an epoxy compound and an emulsifier, in which a content of water is 39% by mass or less with respect to a total amount of a liquid, and a contact angle with respect to a poly(ethylene-methacrylic acid) film when preparing an aqueous dispersion in which a concentration of a non-volatile component is 15% by mass is 42.0° or less. It is preferable that the epoxy compound has two or more epoxy groups in molecules, and it is preferable that the emulsifier is a nonionic surfactant. Provided is a coating method of a liquid crosslinking agent including diluting the liquid crosslinking agent with water to be used for coating.

Disclosed are epoxy resins exhibiting a highly favorable combination of tensile strength and elongation with respect to prior art epoxy systems. The elastomeric epoxy resin systems of the invention are prepared utilizing a curing agent containing at least one monoprimary amine, and are particularly useful in applications such as, for example, castings, potting, composites, crack sealing, coatings, adhesives, roofing materials, flooring or reinforced membranes.

The instant invention provides a polyester composition, method of producing the same, coating compositions made therefrom, and coating layers made from such coatings. The thermoset polyester composition according to the present inventions comprises the reaction product of: (a) one or more polyacids comprising at least 50 percent by the combined weight of one or more aromatic diacids; and (b) one or more polyols comprising at least 40 percent by the combined weight of 1,4-cyclohexanedimethanol and 2,2,4,4-tetramethylcyclobutanediol; wherein said polyester composition has a glass transition temperature in the range of from 70 to 125° C., a number average molecular weight between 6,000 and 20,000, a hydroxyl number in the range of from 4 to 18.

Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.

Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.

A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.