Disclosed herein are a black photosensitive resin composition and a black column spacer prepared therefrom. The black photosensitive resin composition may form a cured film exhibiting good adhesion to a substrate, good height difference property, good surface roughness and high light shielding property (optical density), and may be effectively used for the formation of a cured film, particularly a black column spacer, of a liquid crystal display (LCD) or an organic light-emitting diode (OLED) display.

Disclosed are a novel monofunctional polyethylene glycol (PEG) and derivatives thereof. More particularly, one terminal of each of the monofunctional polyethylene glycol and derivatives thereof is modified with a tertiary alkoxy group.

An adhesive having water vapor barrier properties, comprising an adhesive base comprised of at least one epoxy syrup at least one elastomer at least one initiator optionally at least one tackifier resin and optionally at least one further reactive resin and
optionally a solvent,
wherein the adhesive base without solvent has a water vapor permeation rate after activation of the reactive resin component of less than 100 g/m.sup.2d, preferably of less than 60 g/m.sup.2d, in particular less than 30 g/m.sup.2d, wherein the epoxy syrup comprises bisepoxy monomers and high molecular weight uncrosslinked polyepoxies produced therefrom, exhibits good barrier properties and is also sufficiently pressure sensitive to achieve easy handleability.

An adhesive having water vapor barrier properties, comprising an adhesive base comprised of at least one epoxy syrup at least one elastomer at least one initiator optionally at least one tackifier resin and optionally at least one further reactive resin and
optionally a solvent,
wherein the adhesive base without solvent has a water vapor permeation rate after activation of the reactive resin component of less than 100 g/m.sup.2d, preferably of less than 60 g/m.sup.2d, in particular less than 30 g/m.sup.2d, wherein the epoxy syrup comprises bisepoxy monomers and high molecular weight uncrosslinked polyepoxies produced therefrom, exhibits good barrier properties and is also sufficiently pressure sensitive to achieve easy handleability.

An adhesive having water vapor barrier properties, comprising an adhesive base comprised of at least one epoxy syrup at least one elastomer at least one initiator optionally at least one tackifier resin and optionally at least one further reactive resin and
optionally a solvent,
wherein the adhesive base without solvent has a water vapor permeation rate after activation of the reactive resin component of less than 100 g/m.sup.2d, preferably of less than 60 g/m.sup.2d, in particular less than 30 g/m.sup.2d, wherein the epoxy syrup comprises bisepoxy monomers and high molecular weight uncrosslinked polyepoxies produced therefrom, exhibits good barrier properties and is also sufficiently pressure sensitive to achieve easy handleability.

A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

The present disclosure provides a curable composition containing a benzoxazine, reactive diluent and a soluble polyimide. The curable composition, upon curing, renders an article having well balanced thermal, chemical and mechanical properties and may be used in a variety of applications, such as in coatings, structural composites and encapsulating systems for electronic and electrical components.

The present disclosure provides a curable composition containing a benzoxazine, reactive diluent and a soluble polyimide. The curable composition, upon curing, renders an article having well balanced thermal, chemical and mechanical properties and may be used in a variety of applications, such as in coatings, structural composites and encapsulating systems for electronic and electrical components.

Moisture-curable resin compositions include a mixture of one or more polysilylated of ethers and one or more polyether monosilanes. The polyether monosilanes have one hydrolysable silane group per molecule, and the hydrolysable silane group has at least two hydrolysable substituents. The polyether monosilane is an effective plasticizer and viscosity reducer. Despite the presence of the polyether monosilane, the resins compositions cure to form cured sealants having useful tensile and elongation properties.