Patent classifications
C08G2110/00
POROUS POLYURETHANE POLISHING PAD AND PROCESS FOR PREPARING THE SAME
Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization and a process for preparing the same. It is possible to control the size and distribution of pores in the porous polyurethane polishing pad by using thermally expanded microcapsules and an inert gas as a gas phase foaming agent, whereby the polishing performance thereof can be adjusted.
ETHER/ESTER COMPOSITE POLYURETHANE FOAM COSMETIC
The present invention relates to a cosmetic comprising polyurethane foam in which a liquid cosmetic substance is impregnated. The present invention provides a cosmetic comprising polyurethane foam in which a cosmetic composition is impregnated, wherein the polyurethane of the polyurethane foam comprises an ether group and an ester group in a molar ratio of 4:6 to 6:4, the −<cosmetic composition has a water content of 35 wt % or less, and the threshold shear stress at which storage modulus (G′)=loss modulus (G″) is 100 Pa or less. According to the present invention, provided is a cosmetic comprising a composite polyurethane foam, wherein a cosmetic composition is stably present in a supported state and can be uniformly rearranged inside the foam during pressurization.
METHODS FOR PURIFYING POLYOLS CONTAINING OXYALKYLENE UNITS TO REDUCE 2-METHYL-2-PENTENAL CONTENT
Disclosed are methods for purifying polyols containing oxyalkylene units that is an alkali metal catalyzed alkoxylation reaction product of an alkylene oxide and an H-functional starter. The methods include neutralizing the alkali metal ions with an aqueous solution comprising water and sulfuric acid, in which: (i) the sulfuric acid is present in an amount of no more than 5% by weight, based on the total weight of the aqueous solution, and (ii) the sulfuric acid is used in an amount of 2% to 10% more than the theoretical amount necessary to neutralize all of the alkali metal ions present. The methods can produce polyols having a low content of 2-methyl-2-pentenal.
COMPOSITION FOR POLISHING PAD AND POLISHING PAD
The composition according to an embodiment employs a mixture of curing agents, which comprises a first curing agent containing sulfur and a second curing agent containing an ester group, whereby it is possible to control the physical properties of the polishing pad as necessary.
LOW VISCOSITY POLYOLS FOR POLYURETHANE APPLICATIONS
Lactide-based random polyester polyols for use in polyurethane compositions are disclosed. The polyester polyols have an OH value in the range of greater than 400 mg KOH/g up to 1100 mg KOH/g and are the reaction product of at least one polycarboxylic acid, at least one lactide, and one or more polyalcohols. The polyester polyols can be formulated into the B-side of a two part polyurethane composition to obtain a polyurethane having improved hardness and solvent resistance and a low VOC content. The polyurethane composition is particularly suitable for polyurethane coating applications.
TRANSLUCENT POLYURETHANE FOAMS
The present invention relates to specific translucent, preferably lightfast, polyurethane foams which have a high light transmission and are therefore suitable e.g. for producing translucent polyurethane foams or multilayer composite elements, for example for producing structural components, more particularly as roof elements such as strip lights and light domes, as wall elements such as a panel, in vehicles, in lamps, as furniture, as partitions and in sanitary facilities.
Manual method for injection molding coated components
Described herein is a manual process for injection molding of coated components, more particularly coated soles of plastic, where first of all the molding tool is lined with a release agent composition and, after flashing of this release agent composition, a composition for forming the component is injected. After crosslinking of these two compositions, the produced coated component is removed from the molding tool and subjected optionally to an aftertreatment.
EXPANDED THERMOPLASTIC POLYURETHANE BEADS, PRODUCTION THEREOF AND PRODUCTION OF A MOLDED PART
Disclosed herein are expanded thermoplastic polyurethane beads polymerized from an isocyanate, an isocyanate-reactive compound having a molecular weight between 500 and 10 000 g/mol and a chain extender, wherein customary adjuvants may be additionally present, and the thermoplastic polyurethane has a hard phase fraction ranging from 0.1 to 0.95 and the hard phase fraction is defined by:
where M.sub.KVx represents a molar mass of chain extender x in g/mol, m.sub.KVx represents a mass of chain extender x in g, M.sub.Ixo represents a molar mass of isocyanate in g/mol, m.sub.ges represents a total mass of all starting materials without adjuvants, and k represents a number of chain extenders. Also disclosed herein are processes for producing expanded thermoplastic polyurethanes and processes for producing molded parts therefrom.
Polymeric materials with improved environmental durability
Polymer composite materials and methods of preparation are discussed. The composite material may comprise a polyurethane foam and a plurality of inorganic particles dispersed in the polyurethane foam. The composite material may have moisture movement properties, such that (a) a sample of the composite material having a length of 48 inches has a moisture movement of less than 0.15% along the length, and/or (b) a sample having a length of 6 inches has a moisture movement of less than 0.8% along the length, when submerged in 45? C. distilled water for 14 days.
Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith
The present invention provides CMP polishing pads or layers having a Shore DO (15 second) hardness of from 40 to 80 made from a two-component reaction mixture of (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer, and (ii) a liquid polyol component comprising a) one or more polymeric polyols, b) from 15 to 36 wt. %, based on the total weight of the liquid polyol component, of one or more small chain difunctional polyols having from 2 to 6 carbon atoms, c) from 0 to 25 wt. %, based on the total weight of the liquid polyol component, of a liquid aromatic diamine which is a liquid at standard pressure and at 40? C., and d) an amount of water or CO.sub.2-amine adduct sufficient to reduce the density of a CMP polishing pad made from the two-component reaction mixture to from 0.2 to 0.50 g/mL, wherein the reaction mixture comprises 60 to 75 wt. % of hard segment materials, based on the total weight of the reaction mixture.