An adhesion promoter, a curable composition containing the adhesion promoter, a cured composition formed from the curable composition, and an article containing the cured composition are provided. The adhesion promoter, which is formed by reacting a polyepoxide with a mercaptosilane that has a hydrolyzable silyl group, has at least one epoxide group and at least one hydrolyzable silyl group. The epoxide groups allow incorporation of the adhesion promoter into the polymeric matrix of the cured composition and the hydrolyzable silyl groups allow bond formation with various substrates.

Disclosed is a curable resin composition that has excellent curability by irradiation of light and heating and that is suitable for such applications as liquid encapsulants, liquid adhesives, adhesives for camera modules, and liquid crystal sealants. The curable resin composition contains (A) an aromatic epoxy resin having an allyl group, (B) a thiol-based curing agent, (C) a photoradical initiator, and (D) a thermally latent curing agent. Preferably, (A) the compound having an allyl group and an epoxy group is an aromatic epoxy resin having an allyl group. Preferably, the thiol-based curing agent, which is component (B), is in liquid form at 25° C.

A solventless adhesive composition is provided. The solventless adhesive composition comprises (A) an isocyanate prepolymer having a side chains represented by —R.sub.2—(O—R.sub.1—O).sub.n—R.sub.3 and (B) an isocyanate-reactive component, and exhibits improved bond strength, heat seal strength, adhesive COF property and optical appearance. A laminate product prepared with said solventless adhesive composition as well the method for preparing the laminate product are also provided.

An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:

E1-(M1).sub.a1-(L1).sub.b1-(M2).sub.a2-L2-A1-L3-(M3).sub.a3-(L4).sub.b2-(M4).sub.a4-E2  Formula 1

E3-(A2).sub.c1-(L5).sub.b3-(M5).sub.a5-L6-(M6).sub.a6-L7-(M7).sub.a7-(L8).sub.b4-(A3).sub.c2-E4  Formula 2

In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.

The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component; and (B) a polyol component containing (i) a polyester-polycarbonate polyol and (ii) a phosphate-terminated polyol. The present disclosure also provides a method of forming the two-component solvent-less adhesive composition.

A two-component adhesive composition is provided. The two-component adhesive composition comprises an isocyanate component, an isocyanate-reactive component and an amine-epoxy adduct, and can achieve superior adhesion strength between the adhesive and a substrate like metal alloy substrate. A laminated article prepared with said composition, a method for preparing the article and the use of the amine-epoxy adduct as adhesion promoter in a two-component polyurethane adhesive composition are also provided.

The present invention relates to a 2-component system containing at least one specific N-, S-, O- and Si-containing compound. The invention further relates to a process for preparing silicon-containing polyurethanes, comprising reacting the first component with the second component of the 2-component system according to the present invention, and to the silicon-containing polyurethanes obtained therefrom. In addition, the invention relates to the use of the 2-component system according to the present invention for the production of coating, sealants or adhesives.

The present invention relates to a selective process for the preparation of NCO-functionalized polyols, to their use in the preparation of silylated polyurethanes, to processes for preparing silylated polyurethanes and to silylated polyurethanes obtainable by a reaction of NCO-functionalized polyol with amino silane and to their use in CASE applications (coatings, adhesives, sealants and elastomers).

The invention is an epoxy resin system useful as an adhesive for high temperature applications. The system is a combination of a diglycidyl ether a bisphenol epoxy resin(s), at amounts of 30-70% by weight, with 1-10% by weight of an epoxy novolac resin 10-30% by weight of a polyurethane toughener which preferably has the terminal isocyanate functional group blocked, 1-8% by weight of a hardener, 0.1-% by weight of a cure accelerator, preferably a latent urea cure accelerator, provides the desired balance of mechanical strength and elastic modulus. The epoxy novolac resin is characterized by at least one of the following features: (i) having a viscosity at 25 degrees C. of less than 3000 mPa-s according to ASTM D-445, (ii) an average number of epoxide groups per molecule of more than 2 but less than 3.7, and (iii) a molecular weight of less than 750 g/mol.

Polyurethanes are made by reacting, in one or more reaction steps, a) at least one organic polyisocyanate, b-1) one or more polyols having a hydroxyl equivalent weight of greater than 250 g/mol and a nominal hydroxyl functionality of 2 to 4 and b-2) at least one alkoxylated Mannich base to produce a polyurethane polymer having a density of at least 750 kg/m3 and a hard segment content of 20 to 80% by weight.