The present invention relates to a silicone formulation comprising an oxime silane crosslinker comprising 2-heptanoneoxime which exhibits significantly improved early cracking behaviour and/or skin formation time compared to silicone formulations employing conventional oxime silane crosslinkers, the corresponding cured silicone formulation, uses of the cured silicone formulation and uses of such oxime crosslinkers in the area of silicone formulations.

The invention relates to a curable composition including (a) a component having one or more carbonyl group-containing compounds having a number average molecular weight (Mn) of at least 500 g/mole, wherein each carbonyl group is independently a ketone group or an aldehyde group; (b) a polyamine compound having at least two primary amine groups per molecule; and (c) a polyisocyanate compound. Articles coated with the curable composition are also provided.

Aqueous polyurethane dispersions and coatings and heat-activatable adhesives made from the dispersions are disclosed. The dispersions include a polyurethane reaction product of a polyester polyol and a polyisocyanate. The polyester polyol comprises recurring units of at least one C.sub.2-C.sub.6 aliphatic diol, at least one aliphatic or cycloaliphatic C.sub.4-C.sub.10 dicarboxylic acid, and an aromatic diacid source, which can be recycled PET. The dispersion is formulated using 1 to 3 moles of an acid-functional diol per mole of polyester polyol. Dispersions for the adhesives are produced at NCO/OH molar ratios within the range of 0.90 to 0.98. The adhesives successfully bond a wide range of plastic and metal materials, often demonstrating substrate failure, even with steel. This contrasts with commercial adhesives such as EVA that exhibit only adhesive failure with the same substrates.

An epoxy resin has excellent adhesiveness to different materials. An epoxy resin composition includes the following (A) to (E): (A) a compound with an epoxy equivalent of less than 210 g/eq. that is liquid at 25° C. and has two or more epoxy groups in one molecule, (B) (B-1) a compound with an epoxy equivalent of 210 g/eq. or more that is liquid at 25° C. and has two or more epoxy groups in one molecule and/or (B-2) a compound that is solid at 25° C. and has two or more epoxy groups in one molecule, (C) a thiol curing agent, (D) a latent curing agent, and (E) a reactive diluent.

A nitrogen compound having a melting point of at least 65° C. is used as a curing agent for heat curing in a heat-curable single-component polyurethane composition, which includes a prepolymer with isocyanate end groups made of at least one polyisocyanate and at least one polyol, wherein the solid nitrogen compound is selected from a polyamine, a hydrazide or mixtures thereof.

The present invention relates to an epoxy composition comprising a) an epoxy resin; b) a curing agent; and c) a bio-based epoxy compound having a structure I:

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The composition according to the present invention can be used as a structural adhesive, a coating and a primer.

Oligomeric substances which contain one or more (meth)acryloyl functional groups as well as two or more amide functional groups are useful as components of compositions which may be cured using actinic irradiation to provide polymeric articles.

The invention relates to curable polyorganosiloxanes with special silicon-containing terminal groups and curable compositions based on these polyorganosiloxanes, a capped adhesion promoter, and a curing catalyst. These compositions have improved adhesion properties and excellent storage stability. The invention also relates to the use thereof.

A two-component solventless polyurethane adhesive composition including (A) at least one isocyanate component and (B) at least one polyol component. The isocyanate component (A) comprises an isocyanate prepolymer that is the reaction product of (Ai) a polyisocyanate and (Aii) an isocyanate-reactive component; wherein the isocyanate-reactive component comprises (Aiia) at least one polyol having a functionality greater than two, (Aiib) at least one aromatic polyester polyol having a functionality of greater than two, and (Aiic) at least one hydrophobic polyol. The polyol component (B) comprises (Bi) at least one polyether polyol having a functionality greater than two, (Bii) at least one aromatic polyester polyol transesterified with a natural oil, and (Biii) at least one phosphate ester polyol. A method for forming a laminate is also disclosed, the method comprising the steps of: (I) mixing the above reactants (components (A) and (B)) to form a solventless adhesive composition, (II) applying a layer of the solventless adhesive composition to a surface of a first substrate, (III) bringing the layer of the solventless adhesive composition on the first substrate into contact with a surface of a second substrate to form a laminate, and (IV) curing the solventless adhesive composition. A laminate comprising the above solventless adhesive composition is also disclosed.

Disclosed herein is a composition comprising: an epoxy-containing component, elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; and a curing component activatable by an external energy source, the curing component comprising at least one guanidine having a D90 particle size of 25 μm measured by dynamic light scattering. Also disclosed is the composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the composition. Also disclosed are substrates formed by the method of the present invention.