Described herein are aqueous binder formulations including organic compounds including acryloyloxy groups and carboxylic acid hydrazides.

A material comprising an epoxy/elastomer adduct, a polymeric particle, from about 0.05 to about 20 weight percent of an epoxy/diacid adduct, and optionally, an amine reaction product.

Described herein is a two-part condensation curable adhesive composition suitable for adhering a front lens having an inner surface coated with an anti-haze coating to a lamp body to create a sealed lamp unit. In general, once cured in place, residual ingredients from the adhesive composition or by-products of cure reactions thereof do not visibly inhibit functionality of the anti-haze coating of the sealed lamp unit.

Disclosed is a structural material-bonding adhesive capable of bonding materials other than iron, and maintaining the bonding ability in an environment at a high temperature and a low temperature, while maintaining performance similar to that of a structural material adhesive used as an adhesive for bonding iron materials. A curable resin composition contains an epoxy resin, blocked urethane, and an amine-based latent curing agent, wherein the blocked urethane is obtained by reacting a urethane polymer having a terminal isocyanate group with a blocking agent, the urethane polymer being obtained by reacting a polyisocyanate, a diol, and a branching agent containing at least three groups that react with an isocyanate group.

A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

A method for preparing an acid solution by contacting at least one aromatic carboxylic or sulfonic acid with at least one polyether having blocked hydroxyl groups as a solvent. The polyether having blocked hydroxyl groups is not volatile and exhibits a surprisingly high dissolving capacity for the aromatic carboxylic or sulfonic acid. The acid solution is very compatible in curable compositions and does not cause any emission or odor or migration effects. The acid solution is particularly suitable as a constituent of polyurethane compositions having latent curing agents for accelerating the hydrolysis of the latent reactive groups.

Provided are a silicone-based adhesive protection film and an optical member comprising same, the protection film being formed of a composition comprising an alkenyl group-containing organic polysiloxane, an organic polysiloxane resin, a siloxane-based ionic compound, a cross-linking agent, and a hydrosilylation catalyst, wherein the organic polysiloxane resin includes an organic polysiloxane resin comprising a R.sup.1R.sup.2R.sup.3SiO.sub.1/2 unit (R.sup.1, R.sup.2, and R.sup.3 are each independently an alkyl group having 1 to 6 carbon atoms) and a SiO.sub.4/2 unit.

Provided is a curable composition containing a reactive mixture of components including an polyethersulfone having a chemical group reactive with an epoxide, a cycloaliphatic polyepoxide resin, a polyepoxide having a functionality greater than two, a liquid diepoxide resin, a first curative containing 9,9-bis(aminophenyl)fluorene or a derivative therefrom and having a curing onset temperature of from 150° C. to 200° C. The components can further comprise a second curative having a curing onset temperature of from 60° C. to 180° C. When thermally curing this composition, the second epoxy curative starts to cure before the first epoxy curative, thereby inhibiting vertical flow of the adhesive during the curing process.

A heat stable siloxane-imide copolymer and a curable silicone adhesive composition comprising such a siloxane-imide copolymer is shown and described herein. The composition includes an alkenyl silicone, a silicone hydride based cross linker, hydrosilylation catalyst and additives that is curable at relatively low temperatures and shows good heat stability.

A condensation curable silicone adhesive composition comprising a siloxane-imide base polymer, condensation curable organopolysiloxane crosslinker, a condensation catalyst and an additive is shown and described herein. The composition is curable at relatively room temperatures and shows good heat stability