A process for preparing ionic silylated copolyurethanes comprising two ureido-alkylene-alkoxysilane end groups, comprises: (i) forming a composition of copolyurethanes having—NCO end groups by carrying out a polyaddition reaction between a polyisocyanate, a carboxylic diol and a polyol composition comprising a polyol having an Mn of greater than or equal to 2500 g/mol and a polyol having an Mn of less than 2500 g/mol; (ii) neutralizing the formed product with a tertiary amine; and (iii) reacting with an aminosilane derived from a secondary amine. A composition of ionic silylated copolyurethanes comprising two ureido-alkylene-alkoxysilane end groups, said composition being able to be obtained by means of the process. A crosslinkable adhesive and/or sealant composition comprising the composition and a filler.

The present invention relates to a polyether-modified polyisocyanate composition, which is obtainable by reacting a system containing the following components: a) a polyisocyanate having an isocyanate group functionality of 2-4.5; b) a polyoxyalkylene monoether alcohol; and c) optionally a catalyst; the polyoxyalkylene monoether alcohol has a number-average molecular weight of 900 g/mol-2000 g/mol and an oxypropylene group content of 45 wt. %-100 wt. %, relative to the total weight of the oxyalkylene group of the polyoxyalkylene monoether alcohol; the system has an equivalent ratio of isocyanate group to hydroxyl group of 5:1-110:1; the polyisocyanate composition has the following characteristics: i) the average isocyanate functionality is 1.8-4.1; ii) the isocyanate group content is 8-20 wt. %; and iii) the amount of the polyoxyalkylene monoether structure is greater than 10 wt. % and less than 50 wt. %, for characteristics ii) and iii), relative to the total weight of the polyisocyanate composition.

This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure. The disclosure provides aromatic polyester polyether polyols and compositions comprising such polyols. The disclosed aromatic polyester polyether polyols and compositions including same are the products of the transesterification reaction of polyethylene terephthalate (“PET”) and an ethoxylated triol, namely glycerin or trimethylolpropane, wherein the degree of ethoxylation is from 1 to 9 moles. At least some of the PET used to generate the aromatic polyester polyether polyols is derived from recycled PET. The disclosed aromatic polyester polyether polyols have utility in preparing polyurethane materials, for example.

A siloxane compound is useful as a bonding agent in an adhesive formulation or sealant formation. A kit-of-parts can contain the siloxane compound. A corresponding method can be used to synthesize the siloxane agent.

A two-component silicone composition including a component (A) including at least one hydroxyl-terminated polydiorganosiloxane (P); preferably at least one filler; between 0.05% and 5.0% by weight of emulsified water, based on component (A); and a component (B) including at least one noncondensable polydiorganosiloxane (W) as a plasticizer; at least one organosilane (V) as a crosslinker; at least one catalyst (K) for the crosslinking of polydiorganosiloxanes; wherein all organosilanes (V) preferably have the same hydrolyzable alkoxysilane groups, preferably methoxysilane groups; and catalyst (K) is a tin complex having two mercaptide ligands of formula (V), where ligands (L.sup.1) are each independently alkyl mercaptides coordinated via sulfur, especially C.sub.6 to C.sub.16 alkyl mercaptides, where ligands (L.sup.1) optionally have methyldialkoxysilane groups, preferably methyldimethoxysilane groups, and ligands (L.sup.2) are each independently alkyl ligands, especially C.sub.6 to C.sub.14 alkyl ligands; and component (B) contains less than 5% by weight of carbon black based on component (B).

The invention provides a process for preparing a mixture (M) which comprises silane-terminated polymers (SP1) of the general formula (I)

Y.sup.1—[O—C(═O)—NH—(CR.sup.1.sub.2).sub.b—SiR.sub.a(OR.sup.2).sub.3-a].sub.x  (I),

optionally silane-terminated polymers (SP2) of the general formula (II)

Y.sup.2—[O—C(═O)—NH—(CR.sup.1.sub.2).sub.b—SiR.sub.a(OR.sup.2).sub.3-a].sub.z  (II) and hydroxy-functional polymers (SP3) of the general formula (III)

Y.sup.2—[O—C(═O)—NH—(CR.sup.1.sub.2).sub.b—SiR.sub.a(OR.sup.2).sub.3-a].sub.z-z1(OH).sub.z1  (III) where Y.sup.1 and Y.sup.2 are polymer radicals and R, R.sup.1, R.sup.2, x, z, z1, a and b have the definitions indicated in claim 1, wherein, in a first process step, at least one polymer (HP1) of the general formula (IV)

Y.sup.1—[OH].sub.x  (IV) reacts with at least one isocyanate-functional silane (S) of the general formula (V)

O═C═N—(CR.sup.1.sub.2).sub.b—SiR.sub.a(OR.sup.2).sub.3-a  (V) to give silane-terminated polymers (SP1), and, in a second process step, the unreacted isocyanate groups of the isocyanate-functional silane (S) of the general formula (V) are reacted with at least one oligomer or polymer (HP2) of the general formula (VI)

Y.sup.2(OH).sub.z  (VI); polymer mixtures (M) preparable by the process; and use of the polymer mixtures (M) for producing adhesives and sealants and also coatings.

A method of manufacturing a semiconductor device includes placing a polymer raw material mixture over a substrate. The polymer raw material may include a polymer precursor, a photosensitizer, and an additive. The polymer raw material mixture is exposed to radiation to form a dielectric layer and cured at a temperature of between about 150° C. and about 230° C.

An epoxy compound including a 5-membered aromatic heterocyclic ring represented by Formula 1 or Formula 2, a composition prepared using the epoxy compound, a semiconductor device prepared using the epoxy compound, an electronic device prepared using the epoxy compound, an article prepared using the epoxy compound, and a method of preparing the article:
E1-(M1).sub.a1-(L1).sub.b1-M3-(L2).sub.b2-(M2).sub.a2-E2  Formula 1
E1-(M1).sub.a1-(L1).sub.b1-M3-(L2).sub.b2-(M2).sub.a2-(L5).sub.b5-A-(L6).sub.b6-(M4).sub.a3-(L3).sub.b3-M6-(L4).sub.b4-(M5).sub.a4-E2  Formula 2 wherein in Formulae 1 and 2, M1, M2, M3, M4, M5, M6, L1, L2, L3, L4, L5, L6, E1, E2, a1, a2, a3, a4, b1, b2, b3, b4, b5, and b6 are the same as those defined in the detailed description.

An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:
E1-(M1).sub.a1-(L1).sub.b1-(M2).sub.a2-L2-A1-L3-(M3).sub.a3-(L4).sub.b2-(M4).sub.a4-E2  Formula 1
E3-(A2).sub.c1-(L5).sub.b3-(M5).sub.a5-L6-(M6).sub.a6-L7-(M7).sub.a7-(L8).sub.b4-(A3).sub.c2-E4  Formula 2 In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.

Provided is a resin composition comprises a cyanate ester compound (A), an amine adduct compound (B) and a borate ester (C).