The present disclosure relates to a liquid crystal polyester resin composition comprising a liquid crystal polyester resin with a low dielectric constant and a low dielectric loss containing a naphthoic acid monomer as a main skeleton and a hydroxybenzoic acid; a glass bubble having a pressure resistance of 12,000 psi or more; and an inorganic filler such as mica. The present disclosure provides a liquid crystal polyester resin composition suitable for 5G communication materials, which can achieve low dielectric loss characteristics, and at the same time, the addition of glass bubbles with excellent pressure resistance can achieve a low dielectric constant and a low dielectric loss through the maintenance of the hollow body of the glass bubbles even after melt extrusion.

A method of preparing polymer particles includes combining a polyetherimide and a solvent at a first temperature to provide a slurry, wherein the polyetherimide is not soluble in the solvent at the first temperature; heating the slurry to a second temperature and at a pressure effective to dissolve the polyetherimide in the solvent to provide a homogenous solution; cooling the homogenous solution to a third temperature to provide a dispersion including a plurality of polymer particles; and isolating the polymer particles. The polymer particles have a Dv90 particle size of less than or equal to 250 micrometers. Polymers powders prepared according to the method are also described herein, wherein the powder includes a plurality of semi-crystalline polymer particles having a Dv90 of less than or equal to 250 micrometers.

The present disclosure relates to a liquid crystal polyester composition that can be injection molded into an ultra-thin film and has improved fluidity, and a manufacturing method thereof. The polyester resin composition for ultra-thin injection molding includes 60 to 85% by weight of a liquid crystal polyester resin and 15 to 40% by weight of an inorganic filler having an average cross-sectional aspect ratio of 2 to 6, based on the total weight of the composition, wherein the liquid crystal polyester resin includes 0.1 to 10 mol % of hydroxybenzoic acid (HBA), 40 to 60 mol % of hydroxynaphthoic acid, 20 to 30 mol % of biphenol, and 20 to 30 mol % of terephthalic acid. The liquid crystal polyester resin composition for ultra-thin injection molding according to the present disclosure not only has excellent mechanical strength and heat resistance, but also can exhibit very excellent fluidity in a high-speed injection process.

In a method of forming a semicrystalline polyetherimide, a solvent mixture is combined with an amorphous polyetherimide in a weight ratio of 1:1 to 50:1, respectively, to form a first dispersion. The solvent mixture includes dichloromethane and a C.sub.1-C.sub.6 alkanol in a weight ratio of 0.5:1 to 15:1, respectively. The first dispersion is agitated to form a second dispersion containing a semicrystalline polyetherimide, and the semicrystalline polyetherimide is isolated from the second dispersion. The isolated semicrystalline polyetherimide exhibits a melting point in a range of 230 to 300° C. Also described is a composition that includes a polyetherimide, dichloromethane, and a C.sub.1-C.sub.6 alkanol in specific ratios.

Described herein is a thermosetting resin composition, obtained from the reaction of at least: a polycarbodiimide (i), where the number of carbodiimide groups per molecule is in the range of from 1 to 10; a mixture of crystalline and amorphous polyols (ii), where the molar ratio of carbodiimide groups in the polycarbodiimide according to (i) to hydroxyl groups in the mixture according to (ii) is in the range of from 1:2 to 2:1 and where at least 25 weight-% of the mixture according to (ii) consists of at least one crystalline polyesterol, based on the overall weight of the mixture being 100 weight-%. Also described herein is a method of using the thermosetting resin composition as an adhesive, as well as processes for preparation of adhesives, an element including an adhesive layer on at least one substrate, and an adhesive film, obtained from one of the processes.

Disclosed is a sealant film including at least a layer formed of a polyester as a superficial layer, in which the polyester contains 20 to 50 mol % of a 2,5-furandicarboxylic acid unit, 18 to 49.5 mol % of at least one diol unit selected from the group consisting of an ethylene glycol unit, a 1,3-propanediol unit, and a 1,4-butanediol unit, and 0.5 to 2.5 mol % of a diethylene glycol unit, the sealant film has a crystallinity of less than 14%, and the sealant film is a stretched film that exhibits a shrinkage ratio of 6% or more in a maximum shrinkage direction upon being allowed to stand at 125° C. for 20 seconds. This provides a sealant film superior in mechanical properties, especially tensile elongation, and also superior in heat sealability, non-adsorptivity, and gas barrier properties.

The invention provides a liquid crystal polyester resin which not only has a low-dielectric tangent, but also is excellent in balance between heat resistance and processing stability. The liquid crystal polyester resin comprises: a structural unit (I) derived from an aromatic hydroxycarboxylic acid; a structural unit (II) derived from an aromatic diol compound; and a structural unit (III) derived from an aromatic dicarboxylic acid, wherein the structural unit (I) contains a structural unit (IA) derived from 6-hydroxy-2-naphthoic acid, the structural unit (III) contains a structural unit (IIIA) derived from isophthalic acid and a structural unit (IIIB) derived from 2,6-naphthalenedicarboxylic acid, the dielectric tangent at a measurement frequency of 10 GHz is 1.50×10.sup.−3 or less, the melting point is 290° C. or more, and the difference in temperature between the melting point and the crystallization point is 30° C. or more.

Disclosed herein are ropes containing bundles of filaments, where each bundle includes at least 70% by volume of liquid crystal polymer filaments, and where at least one bundle includes liquid crystal polymer filaments of at least 10 denier per filament in size. Also disclosed herein are methods of pulling or lifting an object by applying tension to such a rope connected to the object, where the rope is arranged over a sheave or a non-rotating guide surface, and a ratio of a diameter of the sheave or an effective diameter of the non-rotating guide surface, D, to a diameter of the rope, d, is at least 20:1.

The present invention refers to a polyesterpolyol which is obtained by reaction of at least one diol with at least one primary hydroxy group and at least one secondary hydroxy group with a saturated aliphatic dicarboxylic acid comprising a carbon chain of at least 12 carbon atoms. The invention further relates to an adhesive composition containing the polyesterpolyol, in particular a polyurethane adhesive composition.

The present invention relates to a polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices. The polymerizable mixture comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties and excellent mechanical properties. There is further provided a method for forming said copolymers and an electronic device containing said copolymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.