This invention discloses a method to fuse silicone and thermoplastic resin, comprising the following steps: Step A: conducting treatment twice on thermoplastic resin lid upon molding in plasma equipment under normal temperature, and opening the inert molecular chain of thermoplastic resin; wherein the power for treating the thermoplastic resin lid ranges 500 to 800 W, the time of treatment ranges from 5 s to 60 s; Step B: applying glue on the place for laying silicone gasket on thermoplastic resin lid, baking in the oven for 15-20 min; Step C: putting the treated thermoplastic resin lid and silicone gasket in step B into the over mold for encapsulation, the time of which is 2-3 min; conducting post vulcanization for 2 h after completing the encapsulation.

A method is provided for treating the surface of a shaped melded part produced with a plastic having ester, ketone and/or ether bonds. The plastic is selected from the group including a polymer, copolymer, polymer blend and combinations of the same. The method includes a pretreatment step for cationically modifying the surface of the melded shaped part. The cationic modification is carried out with a reactant dissolved in a solvent and having one or more amine, imine and/or amide groups.

A process for treating elastomeric materials with supercritical CO.sub.2 such that they can be used or reused as intended prior to exposure to supercritical CO.sub.2. The process includes the following steps: (a) loading the elastomeric materials into a vessel and closing the vessel; (b) introducing CO.sub.2 into the vessel and creating a supercritical CO.sub.2 environment within the vessel; (c) subjecting the elastomeric materials contained within the vessel to the supercritical CO.sub.2 environment for a predetermined period of time; (d) after the predetermined period of time introducing an inert gas under controlled pressure into the vessel to force the supercritical CO.sub.2 out of the vessel; (e) continuing introducing inert gas until the supercritical CO.sub.2 has been exhausted from the vessel; maintaining the inert gas within the vessel at least 1,500 psi to create an inert gas environment within the vessel to subject the elastomeric materials contained within the vessel to the inert gas environment for a time period sufficient to penetrate the elastomeric materials; (f) depressurizing the vessel to 0 psi by exhausting the inert gas from the vessel; and optionally including the step of filling the vessel with an inert gas under pressure prior to step (b) introducing CO.sub.2 into the vessel and creating a supercritical CO.sub.2 environment within the vessel.

A process for treating elastomeric materials with supercritical CO.sub.2 such that they can be used or reused as intended prior to exposure to supercritical CO.sub.2. The process includes the following steps: (a) loading the elastomeric materials into a vessel and closing the vessel; (b) introducing CO.sub.2 into the vessel and creating a supercritical CO.sub.2 environment within the vessel; (c) subjecting the elastomeric materials contained within the vessel to the supercritical CO.sub.2 environment for a predetermined period of time; (d) after the predetermined period of time introducing an inert gas under controlled pressure into the vessel to force the supercritical CO.sub.2 out of the vessel; (e) continuing introducing inert gas until the supercritical CO.sub.2 has been exhausted from the vessel; maintaining the inert gas within the vessel at least 1,500 psi to create an inert gas environment within the vessel to subject the elastomeric materials contained within the vessel to the inert gas environment for a time period sufficient to penetrate the elastomeric materials; (f) depressurizing the vessel to 0 psi by exhausting the inert gas from the vessel; and optionally including the step of filling the vessel with an inert gas under pressure prior to step (b) introducing CO.sub.2 into the vessel and creating a supercritical CO.sub.2 environment within the vessel.

The present invention relates to a method for creating nanostructures in and on organic or inorganic substrates comprising at least the following steps: a) providing a primary substrate having a predetermined refractive index; b) coating the primary substrate with one or more mediating layers each having a predetermined refractive index different from that of the primary substrate, wherein the sequence of the layers is arranged so that a predetermined gradient of the refractive index is generated between the primary substrate and the uppermost layer of the one or more mediating layers; c) optionally coating the uppermost layer of the one or more mediating layers with an additional top layer; d) depositing a nanostructured etching mask onto the uppermost layer of the composite substrate obtained after steps a)-b) or a)-c); e) generating protruding structures, in particular conical or pillar structures, or recessed structures, in particular holes, in at least the uppermost layer of the composite substrate by means of reactive ion etching. A further aspect of the invention relates to a composite substrate with a nanostructured surface obtainable by said method.

Composite structures including an ion-conducting material and a polymeric material (e.g., a separator) to protect electrodes are generally described. The ion-conducting material may be in the form of a layer that is bonded to a polymeric separator. The ion-conducting material may comprise a lithium oxysulfide having a lithium-ion conductivity of at least at least 10.sup.6 S/cm.

The present invention provides a resin plating method using an etching bath containing manganese as an active ingredient, the method being capable of maintaining stable etching performance even during continuous use. The resin plating method includes: an etching step, which uses a resin material-containing article as an object to be treated and etches the article using an acidic etching bath containing manganese; a catalyst application step, which uses palladium as a catalyst metal; and an electroless plating step; and the method further includes a step of maintaining the palladium concentration in the acidic etching bath at 100 mg/L or less.

A film contains a siloxane compound having an alkyl group and a resin having a density of 1.1 g/cm.sup.3 or higher and a glass transition temperature of 150 C. or higher.

The present invention refers to a bioactive coating material for coating plastic materials for cell cultures, comprising a polymer conjugate of each a polymer anchor molecule having surface active anchoring groups and one or more biologically active molecules. The anchor molecule is an amphiphilic molecule with a hydrophobic moiety of styrene-, methacrylic acid-, isobutene-, acrylic acid-, acrylic acid ester-, or methacrylic acid ester units and a hydrophilic moiety of units including carboxyl-, amino-, epoxide-, thiol-, alkine- or azide groups. By selecting cell instructive coating materials cell destiny choices are individually and effectively controllable, in particular, the cell adhesion of almost any cell culture one-way articles by the user. With this concept, new options open up for high-throughput-diagnostics, stem cell-biotechnology and regenerative therapies.

A touch panel according to the embodiment includes a substrate including an effective area and a dummy area surrounding the effective area; and an outer dummy layer in the dummy area; a planar layer on the substrate; and a transparent electrode disposed on the substrate to detect a position.