Foam compositions are provided. The compositions are prepared from multi-functional acetoacetate esters and multi-functional amines or acrylates. The foam compositions can include one or more additives. The foam compositions can be used for home and commercial insulation, air sealing, sound proofing, structural improvement, and exterior roofing, among other applications. The foam compositions provide advantages of being isocyanate free and offer reduced exposure to isocyanate.

The present invention provides a thermosetting resin composition characterized by comprising a bismaleimide compound and a triazine compound having a diaminotriazine structure.

The invention relates to a process for breaking down materials containing benzoxazine resin that is characterized in that the material containing benzoxazine resin is reacted by aminolysis with an agent containing at least one reactive NH.sub.2 and/or NH group. The process enables the material containing benzoxazine resin to be reused; after the breaking-down, volatile products are removed, preferably under reduced pressure and/or at elevated temperature, and the material is mixed with one or more substances that react with the resultant breakdown products to form a polymer network.

The present invention relates to a thermosetting resin composition, which comprises: (A) cyanate ester compound and/or cyanate ester prepolymer; and (B) polyphosphonate ester and/or phosphonate-carbonate copolymer. The thermosetting resin composition provided by the present invention has low dielectric constant and dielectric loss tangent. The prepreg and copper clad laminate made from the above-mentioned thermosetting resin composition have excellent dielectric properties and wet-heat resistance, UL94 V-0 flame resistance, and good processability.

Dry prepregs for ceramic matrix composites are described. The dry prepregs comprise a tow or fabric of ceramic fibers infiltrated with preceramic matrix comprising low levels of an aqueous solvent. The preceramic matrix contains an inorganic portion and a binder system. Binder systems comprising a binder and a plasticizer for the binder are described.

Foam compositions are provided. The compositions are prepared from multi-functional acetoacetate esters and multi-functional amines or acrylates. The foam compositions can include one or more additives. The foam compositions can be used for home and commercial insulation, air sealing, sound proofing, structural improvement, and exterior roofing, among other applications. The foam compositions provide advantages of being isocyanate free and offer reduced exposure to isocyanate.

It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.

Provided is a resin composition that has a low melt viscosity, and is capable of being turned into a cured product having a high heat resistance, a high adhesion and a high glass-transition temperature, though having a low permittivity and a low dielectric tangent. The resin composition is a cyclic imide resin composition containing: (a) a cyclic imide compound represented by the following formula (1), ##STR00001## (b) a cyclic imide compound represented by the following formula (2), ##STR00002##
and (c) a curing catalyst.

The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130-140 C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.

Foam compositions are provided. The compositions are prepared from multi-functional acetoacetate esters and multi-functional amines or acrylates. The foam compositions can include one or more additives. The foam compositions can be used for home and commercial insulation, air sealing sound proofing, structural improvement, and exterior roofing, among other applications. The foam compositions provide advantages of being isocyanate free and offer reduced exposure to isocyanate.