Dry prepregs for ceramic matrix composites are described. The dry prepregs comprise a tow or fabric of ceramic fibers infiltrated with preceramic matrix comprising low levels of an aqueous solvent. The preceramic matrix contains an inorganic portion and a binder system. Binder systems comprising a binder and a plasticizer for the binder are described.

A resin formulation is provided. The resin formulation includes carboxy anhydride at 100 parts by weight, first diisocyanate having the following formula (I) at 20-90 parts by weight, second diisocyanate having the following formulas (II), (III) or a combination thereof at 45-103 parts by weight, and bismaleimide (BMI) at 50-200 parts by weight. A resin polymer and a composite material including the resin polymer are also provided. ##STR00001## In formulas (I), (II) and (III), A includes benzene or cyclohexane, Q includes C1-C12 alkylene, O, S or SO.sub.2, X includes H, CH.sub.3 or CH.sub.2CH.sub.3, R.sub.1 includes H, CH.sub.3 or CH.sub.2CH.sub.3, and E includes H, CH.sub.3 or CH.sub.2CH.sub.3.

The present invention relates to a phosphazene compound comprising cyano group having a molecular structure of Formula (I); wherein, Y and Y are independently selected from organic groups; M.sub.1 and M.sub.2 are independently selected from phosphazene groups, and M.sub.1 contains m.sub.1 phosphorus atoms, and M.sub.2 contains m.sub.2 phosphorus atoms; X.sub.1, X.sub.1, X.sub.2, X.sub.3 and X.sub.4 are independently selected from any one of the sixth main-group elements; R and R are independently selected from divalent organic groups; a is an integer greater than or equal to 0; b is an integer greater than or equal to 1; and c is an integer greater than or equal to 0; and a+b=2m.sub.1, d+2=2m.sub.2. The present invention achieves a synergistic effect with P and N of phosphazene group by introducing cyano group to the phosphazene group, and thus improves thermal stability and flame retardancy of the phosphazene compound, and the compatibility thereof with other components is excellent. The resin composition comprising the phosphazene compound of the present invention has good heat resistance, water resistance, adhesive properties and mechanical properties, and thus the application thereof is widened.

The present invention relates to a thermoset resin composition, and a prepreg and a laminate for a printed circuit board manufactured therefrom. The thermoset resin composition comprises the following components: a phosphorus-containing polyphenyl ether resin having low molecular weight, an epoxy resin, a cyanate resin and an accelerator. The prepreg manufactured using the resin composition comprises a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The laminate for a printed circuit board manufactured using the resin composition comprises a plurality of laminated prepregs, a metal foil covering one or two faces of the laminated prepregs by pressing, with each prepreg comprising a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The thermoset resin composition of the present invention has properties such as a low dielectric constant and a dielectric dissipation factor, high heat resistance, a high glass transition temperature, and flame retardancy, etc. The laminates for a printed circuit board manufactured using same have excellent metal foil peel strength, heat resistance and dielectric properties, and are suitable for high frequency and high speed electronic circuit boards.

This application features a method of forming a polymer layer on the surface of a substrate using a self-initiating monomer. A polymer layer is formed by polymerization of a monomer on a metal layer to fill or cover defects of the metal layer. The metal layer the polymer layer may be used as an airtight material.

The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I):

##STR00001## wherein R is

##STR00002## R is

##STR00003## R is hydrogen,

##STR00004##

Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.

A laminated body including: a substrate; a storage layer; and a buffer layer disposed in this order, in which the storage layer is formed of a cured product of a composition containing a polyfunctional monomer (a1), inorganic particles (a2), and a surfactant (a3), the buffer layer is formed of a cured product of a composition containing a polyfunctional monomer (b1) and inorganic particles (b2), a content mass of the inorganic particles (a2) is 30% by mass or more, a content mass of the inorganic particles (b2) is 30% by mass or more, and the polyfunctional monomer (a1) and the polyfunctional monomer (b1) contain a polyfunctional monomer having a molecular weight per epoxy group in one molecule of 200 g/mol or more.

The present invention relates to resin compositions, fiber reinforced polymeric structures and electromagnetic induction processes for making same. Such magnetic induction processes are pulsed processes that can be optionally coupled with cooling steps between pulses. The aforementioned fiber reinforced polymeric structures can take forms that include, but are not limited to, pipes; pressure vessels, including rocket motor cases and fire extinguishers; golf club shafts; tennis and badminton racquets; skis; snowboards; hockey sticks; fishing rods; bicycle frames; boat masts; oars; paddles; baseball bats; and softball bats. In addition, such fiber reinforced polymeric structures can be supplemented with other materials, such as a rocket propellant, to form articles, for example, a rocket motor.

Methods of producing a fiber reinforced polymer matrix composite and a composite thermal protection system formed from the same. The method includes forming a polymerized fiber reinforced composite which including a cured thermoset polymer matrix and at least one reinforcement material. The method further includes treating at least a portion of a first face of the polymerized fiber reinforced composite with electromagnetic radiation to raise the temperature of the portion of the first face to at least 800 C. to produce a surface layer of graphitized carbon and a bulk polymerized fiber reinforced composite representing the untreated polymerized fiber reinforced composite. Further, the surface layer of graphitized carbon has an electrical conductivity of 0.25 S m.sup.1 to 2.5 S m.sup.1 where the electrical conductivity and a thermal conductivity are both greater than those of the bulk polymerized reinforced composite.

A thermoplastic polyurethane resin contains a reaction product of a polyisocyanate component and a polyol component. The polyisocyanate component contains a 1,4-bis(isocyanatomethyl)cyclohexane and a 1,3-bis(isocyanatomethyl) cyclohexane. The polyol component contains a polycarbonate polyol and a low molecular-weight polyol. The polycarbonate polyol includes a crystalline polycarbonate polyol that is in a solid state at 25 C. With respect to the total amount of the 1,4-bis(isocyanatomethyl) cyclohexane and the 1,3-bis(isocyanatomethyl) cyclohexane, the 1,4-bis(isocyanatomethyl) cyclohexane is 50 to 90 mol %, and the 1,3-bis(isocyanatomethyl) cyclohexane is 10 to 50 mol %.