A hydrogel 1 having a laminate structure of layer A 10 and layer B 20, wherein layer A 10 contains a monomer-derived component, water, a humectant, a water-insoluble polymer having tackiness and an amphiphilic polymer, the water-insoluble polymer is contained in a proportion of 3 to 20 wt % based on a total amount of layer A, and the amphiphilic polymer is a polyvinyl alcohol having a saponification degree of 50 to 75% and is contained in a proportion of 0.05 to 5 wt % based on the total amount of layer A; layer B 20 contains a monomer-derived component, water and a humectant and is substantially free of a water-insoluble polymer having tackiness and a polyvinyl alcohol; and an amount of the water based on a total amount of layer B is the amount of water based on the total amount of layer A10 wt %.

The present invention is a quartz glass fiber-containing prepreg, including: (A) at least one quartz glass fiber selected from the group consisting of a quartz cloth, a quartz chopped strand, a quartz nonwoven fabric, and a quartz wool; as well as a resin composition including (B) a maleimide compound that is a solid at 25 C., containing at least one dimer acid skeleton, at least one linear alkylene group having 6 or more carbon atoms, and at least two maleimide groups in the molecule; and (C) a curing accelerator, wherein the total content of uranium and thorium is 0 to 0.1 ppm. This provides a quartz glass fiber-containing prepreg to give a quartz glass fiber-containing substrate that is used as a PCB to prevent malfunction of a semiconductor device caused by the PCB to decrease transmission loss.

This disclosure describes polymerization processes and processes for quenching polymerization reactions using reactive particulates, such as high molecular weight functionalized olefin copolymers, as quenching agents, typically in solution or bulk polymerization processes.

A resin composition is provided. The resin composition comprises the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I),

##STR00001## wherein M1 and the Z1 groups are as defined in the specification; and (b) an organic compound of the following formula (II) or formula (III),

##STR00002## wherein R, R11 to R19 and R21 to R28 are as defined in the specification, and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).

The present invention provides as steam barrier resin, a steam barrier coating agent, a steam barrier film, and a steam barrier laminate that exhibit an improved steam barrier property. The steam barrier resin is obtained by reacting a carboxylic acid group and/or an acid anhydride group of a copolymer (C) with an organometallic complex (D). The copolymer (C) is obtained by polymerizing an unsaturated hydrocarbon monomer (A) and an unsaturated carboxylic acid and/or an unsaturated dicarboxylic anhydride (B). Further, the steam barrier resin includes metal bridging between the copolymers (C). The steam barrier coating agent contains the steam barrier resin and a solvent (B). The steam barrier film of the present invention is a film containing the steam barrier. The steam barrier laminate is obtained by laminating the steam barrier film of the present invention on at least one surface of a substrate film.

Provided is a foamed acrylic-resin object, in which a heat-resistant temperature in thermomechanical analysis is 170 C. or higher, and the number of bubbles respectively having a major diameter of 2 mm or greater is 2.0 or less per area of 10 cm10 cm.

A resin composition is provided. The resin composition comprises the following components: (A) epoxy resin; (B) a cross-linking agent; (C) bismaleimide resin (BMI) represented by the following formula (I):

##STR00001## wherein R.sub.1 is an organic group; and (D) a resin represented by the following formula (II):

##STR00002## wherein n is an integer of 1 to 10.

The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.

A resin composition suitable for an optical compensation film, an optical compensation film using the same, which is excellent in the retardation characteristics and wavelength dispersion characteristics, and a production method of an optical compensation film. A resin composition containing, as resin components, from 30 to 99 wt % of a cellulose-based resin represented by the following formula (1) and from 1 to 70 wt % of a cinnamic acid ester copolymer: ##STR00001## where each of R.sub.1, R.sub.2 and R.sub.3 independently represents hydrogen or a substituent having a carbon number of 1 to 12.

Carbodiimide is added to a molten aromatic polyamide resin so as to provide resin pellets. The percentage of residual unreacted carbodiimide to each resin pellet is 0.03% to 0.33% by mass.