Embodiments described herein are directed to compositions comprising nitrogen containing SMA oligomers or polymers in combination with the phosphonate oligomers or polymers. These compositions may be combined with other polymer resins to produce polymer compositions having good electrical, thermal, and mechanical properties combined with flame retardancy.

In the present technology, a thermally expandable microcapsule complex is blended in a rubber component, the thermally expandable microcapsule complex being obtained by preparing an aqueous solution of a water-soluble polymer having a concentration of 1 to 30 mass %, adding from 5 to 60 parts by mass of cellulose fibers to 100 parts by mass of the aqueous solution to prepare a liquid dispersion (1), adding from 10 to 200 parts by mass of thermally expandable microcapsules to the liquid dispersion (1) to prepare a liquid dispersion (2), and evaporating the moisture content of the liquid dispersion (2).

A resin composition is provided. The resin composition comprises the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I),

##STR00001## wherein M1 and the Z1 groups are as defined in the specification; and (b) an organic compound of the following formula (II) or formula (III),

##STR00002## wherein R, R11 to R19 and R21 to R28 are as defined in the specification, and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).

The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.

The present invention relates to a composition for radiation dosimetry and to a use of the composition in radiation dosimetry, such as in radiotherapy treatment verification. The present invention further relates to a method of determining a three-dimensional radiation dose distribution. The present invention also relates to a method of preventing or treating cancer, particularly to a radiotherapy treatment of cancer patients. Furthermore, the present invention relates to a method of preparing a composition for radiation dosimetry.