A resin composition for fiber-reinforced plastic having a good balance between stability and curability and capable of producing fiber-reinforced plastic with improved strength. The composition contains an epoxy resin, an acid anhydride, and a catalyst that is liquid at 25° C. The catalyst is at least one member selected from the group consisting of a compound composed of an acid and a base and a compound composed of a quaternary onium cation and an anion.

A molded article of a carbon fiber composite material includes at least carbon fibers and a resin composition. The molded article of a carbon fiber composite material is characterized in that the surface roughness Ra thereof is 0.01-2 μm and in that the tensile shear adhesive strength (F0) thereof when a metal has been adhered to the surface thereof via an adhesive layer that contains an epoxy compound and is 0.1-3 mm thick is 10-40 MPa.

The present disclosure provides a unique method of making a fine fiber that is formed from a composition including an epoxy and a polymer component including a 4-vinyl pyridine-containing polymer. The present disclosure also provides a unique method of coating a fine fiber with a composition including an epoxy and a polymer component including a 4-vinyl pyridine-containing polymer. The present disclosure further provides fine fibers wherein the entirety of the fiber is formed from a composition including an epoxy and a polymer component including a 4-vinyl pyridine-containing polymer. Also provided are filter media and filter substrates including the fine fibers.

The present disclosure provides a thermosetting resin sheet that makes it easier, while an insulating layer where a conductor is to be embedded is being formed, to embed the conductor in the insulating layer and reduces the chances of causing a decline in moldability. A thermosetting resin sheet (1) includes a prepreg layer (2) and a resin sheet layer (3) stacked on the prepreg layer (2). The prepreg layer (2) includes a base member (4) and an uncured product or semi-cured product of a first thermosetting resin composition impregnated into the base member (4). The resin sheet layer (3) is an uncured product or semi-cured product of a second thermosetting resin composition. A curing time of the resin sheet layer (3) is longer than a curing time of the prepreg layer (2).

A resin sheet according to the present disclosure includes an uncured product or semi-cured product of a thermosetting resin composition. A melt viscosity of the resin sheet is equal to or greater than 10 Pa.Math.s and equal to or less than 2000 Pa.Math.s when measured using a Koka flow tester under a measuring condition including 130° C. and 1 MPa and is equal to or greater than 6 Pa.Math.s and equal to or less than 1200 Pa.Math.s when measured using the Koka flow tester under a measuring condition including 130° C. and 4 MPa.

A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.

A crosslinkable polymer powder compositions redispersible in water includes one or more vinyl ester polymers, one or more compounds bearing epoxide groups and optionally one or more curing agents which crosslink with the compounds bearing epoxide groups. The vinyl ester polymers do not comprise any epoxide-functional monomer units. The crosslinkable polymer powder compositions redispersible in water includes ≥51% by weight, based on the total weight of the vinyl ester polymers, of one or more compounds bearing epoxide groups.

A thermosetting resin composition at least including: [A] an epoxy resin containing two or more glycidyl groups; [B] a cyanate ester resin containing two or more cyanate groups; and [C] an amine compound; and satisfying the following conditions (1) and (2): (1) 0.25≤the number of moles of glycidyl groups in the thermosetting resin composition/the number of moles of cyanate groups in the thermosetting resin composition≤1.5; and (2) 0.05≤the number of moles of active hydrogen contained in the amino groups in the thermosetting resin composition/the number of moles of cyanate groups in the thermosetting resin composition<0.5; and a prepreg and a fiber reinforced composite material using the thermosetting resin composition. Provided are a thermosetting resin composition having excellent mechanical properties and heat resistance in a high-temperature environment after moisture absorption, and having excellent reactivity that allows curing in a short time; a prepreg prepared by impregnating a reinforced fiber with a thermosetting resin composition, which prepreg has excellent handling ability (tackiness properties) at room temperature; and a fiber reinforced composite material including a thermosetting resin composition and a reinforced fiber.

A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tanδ = E″/E′) of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof. The loss modulus (E″), the storage modulus (E′), and the loss tangent (tanδ = E″/E′) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.

This invention relates to an anti-flutter adhesive composition, comprising a) at least one ethylenically unsaturated polymer; b) at least one PVC homopolymer having a K value from 67 to 75; c) at least one PVC copolymer having a K value from 60 to 75; d) at least one epoxy resin; e) at least one epoxy curing agent; f) at least one first organic peroxide having a decomposition temperature from 125 to 180° C.; and g) at least one second organic peroxide having a decomposition temperature less than 125° C. The anti-flutter adhesive composition can be cured across a wide temperature and have excellent shear strength and good appearance after cured.