The present disclosure provides a resin blend. The resin blend includes at least one diluent containing a single phthalonitrile functional group and at least one diphthalonitrile resin. Also provided are prepregs including the resin blend impregnated into continuous reinforcing fibers or a cloth. Similarly, the present disclosure provides a molding compound including chopped reinforcing fibers distributed in the resin blend. An article is also provided, which includes polymerization product of the resin blend. An alternative article includes a substrate and a layer of the resin blend disposed on the substrate. The diluent typically improves processability of the resin blend and lowers the softening temperature of the polymerization product of the resin blend.

A method for reducing friability and/or mineral dusting of a mineral loaded polymer is provided. The method includes providing a mineral loaded polymer article made from a monolithic material formed of at least a base polymer and an active agent. The active agent is in the form of minerals. The article has an external surface onto which a film coating is applied using a liquid solution that solidifies to form the film coating. The film coating substantially prevents release of the minerals outside of the article while at the same time provides gas permeability to facilitate transmission of a gas between an environment external to the film coating and the minerals loaded within the article.

Disclosed herein is a substrate-independently surface-coated polymer by aromatic-amine compound and a coating method thereof, and in particular to a substrate-independently surface-coated polymer and a coating method thereof wherein an aromatic compound in which two or more amines are substituted on benzene, is substrate-independently surface-coated. The substrate-independently surface-coated polymer characterized in that the surface of a polymer substrate is coated in such a way to react, using a surface modifier, an aromatic compound of the following structural formula on at least one surface of the polymer substrate having a nucleophilic functional group or an electrophilic functional group.

Provided herein is a composite material that includes at least one thermoresponsive polymer and at least one organic foam material. Further provided herein is a method for producing the composite material and also to the use of the composite material for cooling and for regulating temperature.

Disclosed herein is a substrate-independently surface-coated polymer by aromatic-amine compound and a coating method thereof, and in particular to a substrate-independently surface-coated polymer and a coating method thereof wherein an aromatic compound in which two or more amines are substituted on benzene, is substrate-independently surface-coated. The substrate-independently surface-coated polymer characterized in that the surface of a polymer substrate is coated in such a way to react, using a surface modifier, an aromatic compound of the following structural formula on at least one surface of the polymer substrate having a nucleophilic functional group or an electrophilic functional group.

An object of the present invention is to provide a resin composition that has a variety of properties required for a material for printed circuit boards such as high flame retardancy, and can attain a cured product having high moldability, high resistance against chemicals in a desmearing step, and a small coefficient of thermal expansion, a prepreg comprising the resin composition, a laminate including the prepreg, a metallic foil clad laminate including the prepreg, and a printed circuit board including the prepreg. A resin composition comprising an acrylic-silicone copolymer (A), a halogen-free epoxy resin (B), a cyanic acid ester compound (C) and/or a phenol resin (D), and an inorganic filler (E).

A carbon fiber-reinforced polyarylene sulfide has both dynamic characteristics and molding cycle characteristics and can be produced with high productivity by preparing a polycarbodiimide-modified polyarylene sulfide using a polyarylene sulfide and a polycarbodiimide as raw materials, then melting the resulting polycarbodiimide-modified polyarylene sulfide, and combining the polycarbodiimide-modified polyarylene sulfide with carbon fibers at a specific ratio to produce a composite.

The present disclosure provides: a thermosetting resin composition comprising: (a) bisphenol M-type epoxy resin; (b) bisphenol M-type cyanate ester resin; (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or oligomers thereof; and (d) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The printed circuit board simultaneously has an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.

A gas-barrier laminate (10) of a structure in which a first inorganic barrier layer (3), a water-trapping layer (5) and a second inorganic barrier layer (9) are provided in this order on a plastic base material (1), wherein the water-trapping layer (5) is a layer in which a granular moisture-absorbing agent is dispersed in a matrix of an ionic polymer, the granular moisture-absorbing agent being capable of absorbing moisture to a degree lower than that attained by the matrix, and an organic layer (7) is provided between the water-trapping layer (5) and the second inorganic barrier layer (9), the organic layer (7) serving as an underlying layer for forming the second inorganic barrier layer. The water-trapping layer has excellent barrier property against water and is, at the same time, effectively suppressed from swelling despite it has absorbed moisture. The water-trapping layer is, further, effectively suppressed from losing its activity.

A polyamide resin composition includes a specified amount of a compound and/or its condensate that includes a hydroxyl group and an epoxy group or a carbodiimide group and has a specific structure. Another polyamide resin composition includes specified amounts of an aliphatic compound having three or more amino groups or three or more hydroxyl groups per molecule and a compound having more than one functional group per molecule that is reactive with the amino group or the hydroxyl group, wherein, when an ASTM No. 1 dumbbell of 3.2 mm in thickness produced by injection molding of the polyamide resin composition is processed by heat treatment at 130 C. for 100 hours, an increase rate in concentration of a carboxyl group in the polyamide resin composition from a surface of the molded product to a depth of 0.2 mm after the heat treatment is lower than 70%.