A fluid system component can include a body that includes a multidimensional shape defined in orthogonal directions and layers stacked along one of the orthogonal directions, where at least one of the layers includes polymeric material and graphene nanoplatelets formed in situ from the polymeric material, and where the graphene nanoplatelets increase stiffness of the polymeric material.

A fluid system component can include a body that includes a multidimensional shape defined in orthogonal directions and layers stacked along one of the orthogonal directions, where at least one of the layers includes polymeric material and graphene nanoplatelets formed in situ from the polymeric material, and where the graphene nanoplatelets increase stiffness of the polymeric material.

Disclosed a preparation method of a green, biodegradable, and multifunctional collagen-based nanocomposite film, and overcomes the problems of difficult biodegradation, poor barrier property, and single function of food packaging materials in the existing technologies. The present invention includes the following steps: adding silicate nanosheet into deionized water for ultrasonic dispersion; then adding polyphenolic acid into the mixture, wherein a mass ratio of the polyphenolic acid to the silicate nanosheet is 1:(0.2˜1); and adjusting the pH value to 3.0˜4.0 to obtain a solution A; adding collagen with a concentration of 5 g/L into an acetic acid solution, and fully dissolving the collagen to obtain a solution B; isovolumetrically mixing the solution A with the solution B, stirring at room temperature, and adjusting the pH value to 4.5˜5.5 to obtain a casting solution; and pouring the casting solution into a polytetrafluoroethylene mold, and naturally drying to obtain a nanocomposite film.

An acrylic conductive paste is provided, based on 100 parts by weight, including: 30-84 parts of conductive particles, 15˜45 parts of acrylate, 0.5˜2.5 parts of adhesion promoter, 0.5˜3 parts of initiator. The conductive particles include three-dimensional dendritic conductive particles; and the adhesion promoter is a mixture of a silane coupling agent and a phosphate ester. The conductive paste of the present disclosure has good electrical conductivity, short curing time, strong adhesion, and can be used for a long-time room temperature operation. The present disclosure also provides a method for preparing the above-mentioned acrylic conductive paste, which is convenient for operation and industrial application; at the same time, it shows that the acrylic conductive paste of the present disclosure can be applied to semiconductor components for packaging a semiconductor device.

An acrylic conductive paste is provided, based on 100 parts by weight, including: 30-84 parts of conductive particles, 15˜45 parts of acrylate, 0.5˜2.5 parts of adhesion promoter, 0.5˜3 parts of initiator. The conductive particles include three-dimensional dendritic conductive particles; and the adhesion promoter is a mixture of a silane coupling agent and a phosphate ester. The conductive paste of the present disclosure has good electrical conductivity, short curing time, strong adhesion, and can be used for a long-time room temperature operation. The present disclosure also provides a method for preparing the above-mentioned acrylic conductive paste, which is convenient for operation and industrial application; at the same time, it shows that the acrylic conductive paste of the present disclosure can be applied to semiconductor components for packaging a semiconductor device.

An epoxy conductive paste is disclosed, based on 100 parts by total mass, comprising the following raw material components: 30˜81 parts of conductive particles, 16˜30 parts of epoxy, 0.2˜3 parts of acrylic, 1˜15 parts of reactive diluent, 1˜15 parts of toughening agent, 0.4˜5 parts of silane coupling agent, and 0.4˜5 parts of cationic curing agent; wherein, the conductive particles include conductive particles with a three-dimensional dendritic microstructure. The conductive paste of the disclosure has the characteristics of good conductivity, short curing time, strong adhesion, and capability for long-term operation at room temperature.

An epoxy conductive paste is disclosed, based on 100 parts by total mass, comprising the following raw material components: 30˜81 parts of conductive particles, 16˜30 parts of epoxy, 0.2˜3 parts of acrylic, 1˜15 parts of reactive diluent, 1˜15 parts of toughening agent, 0.4˜5 parts of silane coupling agent, and 0.4˜5 parts of cationic curing agent; wherein, the conductive particles include conductive particles with a three-dimensional dendritic microstructure. The conductive paste of the disclosure has the characteristics of good conductivity, short curing time, strong adhesion, and capability for long-term operation at room temperature.

Described herein is a polyurethane including a reaction product of an isocyanate component, a polyol component, and graphene nano platelets. The graphene nano platelets are reacted in an amount of from about 0.1 to about 20% by weight, based on a total weight of the polyurethane. The graphene nano platelets have an average lateral dimension (x, y) of from about 1 to about 100 μm, an average through-plane dimension (z) of from about 5 to about 100 nm, and an oxygen content of from about 0.01 to about 10% by weight, based on a total weight of the graphene nano platelets.

Described herein is a polyurethane including a reaction product of an isocyanate component, a polyol component, and graphene nano platelets. The graphene nano platelets are reacted in an amount of from about 0.1 to about 20% by weight, based on a total weight of the polyurethane. The graphene nano platelets have an average lateral dimension (x, y) of from about 1 to about 100 μm, an average through-plane dimension (z) of from about 5 to about 100 nm, and an oxygen content of from about 0.01 to about 10% by weight, based on a total weight of the graphene nano platelets.

This invention provides resin formulations which may be used for 3D printing and pyrolyzing to produce a ceramic matrix composite. The resin formulations contain a solid-phase filler, to provide high thermal stability and mechanical strength (e.g., fracture toughness) in the final ceramic material. The invention provides direct, free-form 3D printing of a preceramic polymer loaded with a solid-phase filler, followed by converting the preceramic polymer to a 3D-printed ceramic matrix composite with potentially complex 3D shapes or in the form of large parts. Other variations provide active solid-phase functional additives as solid-phase fillers, to perform or enhance at least one chemical, physical, mechanical, or electrical function within the ceramic structure as it is being formed as well as in the final structure. Solid-phase functional additives actively improve the final ceramic structure through one or more changes actively induced by the additives during pyrolysis or other thermal treatment.