Provided is a thermoplastic resin composition excellent in heat resistance, transparency, appearance after shaping, and weather resistance, and in which coloring is suppressed during shaping processing. The thermoplastic resin composition of the present invention includes a copolymer (P1), and an antioxidant (O) represented by General Formula (1), in which the thermoplastic resin composition contains 80% by mass or more of the copolymer (P1) with respect to a total mass of the thermoplastic resin composition, and the copolymer (P1) includes 80 mol % or more of a repeating unit (A) derived from methyl (meth)acrylate (a), 2 mol % or more and 7 mol % or less of a repeating unit (B) derived from (meth)acrylic acid (b), and 0.001 mol % or more and 0.15 mol % or less of a repeating unit (C) having a glutaric anhydride structure. ##STR00001## [in Formula (1), R.sup.1 and R.sup.1′ each independently represent one or a plurality of alkyl groups having 1 to 8 carbon atoms substituted at an arbitrary position on a phenyl group]

The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof; and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) contains (A1) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of less than 600 and (A2) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of 600 or more. The present invention also relates to a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.

The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof; and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) contains (A1) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of less than 600 and (A2) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of 600 or more. The present invention also relates to a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.

A method for evaluating the compatibility of a thermosetting resin composition containing at least two kinds of resins and an inorganic filler, the method including the following steps 1A and 2A: Step 1A: a step of obtaining a reflected electronic image of the cross section of a cured product of the thermosetting resin composition using a scanning electron microscope at an observation magnification of 50 to 250 times; and Step 2A: a step in which, in the reflected electronic image, a phase-separated resin region is referred to as a separation part and the remaining region is referred to as a non-separation part, and the image is binarized such that the separation part has one value and the non-separation part has the other value, and the area ratio of the region of the non-separation part of the resultant binarized image to the total region of the binarized image (area of the region of the non-separation part×100/area of the total region of the binarized image) is calculated as the area ratio Rw of the non-separation part.

A method for evaluating the compatibility of a thermosetting resin composition containing at least two kinds of resins and an inorganic filler, the method including the following steps 1A and 2A: Step 1A: a step of obtaining a reflected electronic image of the cross section of a cured product of the thermosetting resin composition using a scanning electron microscope at an observation magnification of 50 to 250 times; and Step 2A: a step in which, in the reflected electronic image, a phase-separated resin region is referred to as a separation part and the remaining region is referred to as a non-separation part, and the image is binarized such that the separation part has one value and the non-separation part has the other value, and the area ratio of the region of the non-separation part of the resultant binarized image to the total region of the binarized image (area of the region of the non-separation part×100/area of the total region of the binarized image) is calculated as the area ratio Rw of the non-separation part.

A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin and 45 parts by weight to 75 parts by weight of an inorganic filler combination, wherein the inorganic filler combination at least includes chemically synthesized silica and silicon nitride, and a weight ratio of the chemically synthesized silica and the silicon nitride is between 1:2 and 5:2. The resin composition or an article made therefrom may achieve improvement in at least one of the following properties: dielectric constant, dissipation factor, peel strength, soldering resistance, T300 thermal resistance, laminate appearance, sedimentation property, water absorption rate, and ratio of thermal expansion.

A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin and 45 parts by weight to 75 parts by weight of an inorganic filler combination, wherein the inorganic filler combination at least includes chemically synthesized silica and silicon nitride, and a weight ratio of the chemically synthesized silica and the silicon nitride is between 1:2 and 5:2. The resin composition or an article made therefrom may achieve improvement in at least one of the following properties: dielectric constant, dissipation factor, peel strength, soldering resistance, T300 thermal resistance, laminate appearance, sedimentation property, water absorption rate, and ratio of thermal expansion.

The present invention relates to a method for purifying N-substituted maleimide. More particularly, the present invention adopts an evaporation apparatus, which can previously remove impurities having higher boiling points than the N-substituted maleimide after removing an organic solvent from an N-substituted maleimide resulting solution, thereby achieving effects of minimizing the pressure loss and polymerization loss, and obtaining high-purity N-substituted maleimide.

The present invention relates to a method for purifying N-substituted maleimide. More particularly, the present invention adopts an evaporation apparatus, which can previously remove impurities having higher boiling points than the N-substituted maleimide after removing an organic solvent from an N-substituted maleimide resulting solution, thereby achieving effects of minimizing the pressure loss and polymerization loss, and obtaining high-purity N-substituted maleimide.

An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.